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153204-2000-RB-WA 3M 3mtm-2-mm-thru-board-skt-2mm-x-2mm-surface-mount-ts0521.pdf Description: CONN RCPT 4POS 0.079 GOLD SMD
Features: Pick and Place
Packaging: Tape & Reel (TR)
Connector Type: Receptacle, Bottom or Top Entry
Voltage Rating: 500VDC
Current Rating (Amps): 1A
Mounting Type: Surface Mount
Number of Positions: 4
Style: Board to Board or Cable
Operating Temperature: -55°C ~ 105°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.079" (2.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Tin
Part Status: Obsolete
Insulation Height: 0.129" (3.28mm)
Row Spacing - Mating: 0.079" (2.00mm)
Number of Rows: 2
товар відсутній
153214-2000-RB 3M 3mtm-2-mm-thru-board-skt-2mm-x-2mm-surface-mount-ts0521.pdf Description: CONN RCPT 14POS 0.079 GOLD SMD
товар відсутній
153216-2020-RB 153216-2020-RB 3M 3mtm-2-mm-thru-board-skt-2mm-x-2mm-surface-mount-ts0521.pdf Description: CONN RCPT 16POS 0.079 GOLD SMD
Features: Board Guide
Packaging: Tray
Connector Type: Receptacle, Bottom or Top Entry
Voltage Rating: 500VDC
Current Rating (Amps): 1A
Mounting Type: Surface Mount
Number of Positions: 16
Style: Board to Board or Cable
Operating Temperature: -55°C ~ 105°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.079" (2.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Tin
Part Status: Obsolete
Insulation Height: 0.129" (3.28mm)
Row Spacing - Mating: 0.079" (2.00mm)
Number of Rows: 2
товар відсутній
153250-2020-RB 153250-2020-RB 3M 3mtm-2-mm-thru-board-skt-2mm-x-2mm-surface-mount-ts0521.pdf Description: CONN RCPT 50POS 0.079 GOLD SMD
Features: Board Guide
Packaging: Tray
Connector Type: Receptacle, Bottom or Top Entry
Voltage Rating: 500VDC
Current Rating (Amps): 1A
Mounting Type: Surface Mount
Number of Positions: 50
Style: Board to Board or Cable
Operating Temperature: -55°C ~ 105°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.079" (2.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Tin
Part Status: Obsolete
Insulation Height: 0.129" (3.28mm)
Row Spacing - Mating: 0.079" (2.00mm)
Number of Rows: 2
товар відсутній
ICO-083-S8A-T 3M ICO,CICO,ICB_Series.pdf Description: CONN IC DIP SOCKET 8POS TIN
товар відсутній
ICO-083-S8-T 3M ICO,CICO,ICB_Series.pdf Description: CONN IC DIP SOCKET 8POS TIN
товар відсутній
ICO-143-S8A-T 3M ICO,CICO,ICB_Series.pdf Description: CONN IC DIP SOCKET 14POS TIN
товар відсутній
ICO-143-S8-T 3M ICO,CICO,ICB_Series.pdf Description: CONN IC DIP SOCKET 14POS TIN
товар відсутній
ICO-163-S8A-T 3M ICO,CICO,ICB_Series.pdf Description: CONN IC DIP SOCKET 16POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -65°C ~ 105°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Phosphor Bronze
Part Status: Obsolete
товар відсутній
ICO-183-S8A-T 3M ICO,CICO,ICB_Series.pdf Description: CONN IC DIP SOCKET 18POS TIN
товар відсутній
ICO-203-S8A-T 3M ICO,CICO,ICB_Series.pdf Description: CONN IC DIP SOCKET 20POS TIN
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -65°C ~ 105°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Phosphor Bronze
Part Status: Obsolete
товар відсутній
ICO-203-S8-T 3M ICO,CICO,ICB_Series.pdf Description: CONN IC DIP SOCKET 20POS TIN
товар відсутній
ICO-243-S8A-T 3M ICO,CICO,ICB_Series.pdf Description: CONN IC DIP SOCKET 24POS TIN
товар відсутній
ICO-246-S8-T 3M ICO,CICO,ICB_Series.pdf Description: CONN IC DIP SOCKET 24POS TIN
товар відсутній
ICO-286-S8A-T 3M ICO,CICO,ICB_Series.pdf Description: CONN IC DIP SOCKET 28POS TIN
товар відсутній
ICO-286-S8-T 3M ICO,CICO,ICB_Series.pdf Description: CONN IC DIP SOCKET 28POS TIN
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -65°C ~ 105°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Phosphor Bronze
Part Status: Obsolete
товар відсутній
ICO-326-S8A-T 3M ICO,CICO,ICB_Series.pdf Description: CONN IC DIP SOCKET 32POS TIN
товар відсутній
ICO-326-S8-T 3M ICO,CICO,ICB_Series.pdf Description: CONN IC DIP SOCKET 32POS TIN
товар відсутній
ICO-406-S8A-T 3M ICO,CICO,ICB_Series.pdf Description: CONN IC DIP SOCKET 40POS TIN
товар відсутній
ICO-406-S8-T 3M ICO,CICO,ICB_Series.pdf Description: CONN IC DIP SOCKET 40POS TIN
товар відсутній
ICO-426-S8A-T 3M ICO,CICO,ICB_Series.pdf Description: CONN IC DIP SOCKET 42POS TIN
товар відсутній
ICO-426-S8-T 3M ICO,CICO,ICB_Series.pdf Description: CONN IC DIP SOCKET 42POS TIN
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -65°C ~ 105°C
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Phosphor Bronze
товар відсутній
ICO-486-S8A-T 3M ICO,CICO,ICB_Series.pdf Description: CONN IC DIP SOCKET 48POS TIN
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -65°C ~ 105°C
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Phosphor Bronze
Part Status: Obsolete
товар відсутній
ICO-486-S8-T 3M ICO,CICO,ICB_Series.pdf Description: CONN IC DIP SOCKET 48POS TIN
товар відсутній
923719 3M 3mtm-test-clips-accessories.pdf Description: TEST CLIP 32POS DIP NAIL-HEAD
товар відсутній
100-006-000 3M 3mtm-dip-socket-screw-machine-100-series-ts2115.pdf Description: CONN IC DIP SOCKET 6POS GOLD
товар відсутній
100-008-000 3M 3mtm-dip-socket-screw-machine-100-series-ts2115.pdf Description: CONN IC DIP SOCKET 8POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
товар відсутній
100-008-001 3M 3mtm-dip-socket-screw-machine-100-series-ts2115.pdf Description: CONN IC DIP SOCKET 8POS GOLD
Packaging: Bulk
Features: Closed Frame, Seal Tape
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
Part Status: Obsolete
товар відсутній
100-010-000 3M 3mtm-dip-socket-screw-machine-100-series-ts2115.pdf Description: CONN IC DIP SOCKET 10POS GOLD
товар відсутній
100-014-000 3M 3mtm-dip-socket-screw-machine-100-series-ts2115.pdf Description: CONN IC DIP SOCKET 14POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
товар відсутній
100-014-001 3M 3mtm-dip-socket-screw-machine-100-series-ts2115.pdf Description: CONN IC DIP SOCKET 14POS GOLD
Packaging: Bulk
Features: Closed Frame, Seal Tape
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
Part Status: Obsolete
товар відсутній
100-016-000 3M 3mtm-dip-socket-screw-machine-100-series-ts2115.pdf Description: CONN IC DIP SOCKET 16POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
Part Status: Obsolete
товар відсутній
100-016-001 3M 3mtm-dip-socket-screw-machine-100-series-ts2115.pdf Description: CONN IC DIP SOCKET 16POS GOLD
Packaging: Bulk
Features: Closed Frame, Seal Tape
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
Part Status: Obsolete
товар відсутній
100-018-000 3M Description: CONN IC DIP SOCKET 18POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
Part Status: Obsolete
товар відсутній
100-018-001 3M Description: CONN IC DIP SOCKET 18POS GOLD
Packaging: Bulk
Features: Closed Frame, Seal Tape
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
Part Status: Obsolete
товар відсутній
100-020-000 3M Description: CONN IC DIP SOCKET 20POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
Part Status: Obsolete
товар відсутній
100-020-001 3M Description: CONN IC DIP SOCKET 20POS GOLD
Packaging: Bulk
Features: Closed Frame, Seal Tape
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
Part Status: Obsolete
товар відсутній
100-022-000 3M Description: CONN IC DIP SOCKET 22POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 22 (2 x 11)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
Part Status: Obsolete
товар відсутній
100-024-000 3M Description: CONN IC DIP SOCKET 24POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
Part Status: Obsolete
товар відсутній
100-024-001 3M Description: CONN IC DIP SOCKET 24POS GOLD
Features: Closed Frame, Seal Tape
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
Part Status: Obsolete
товар відсутній
100-028-000 3M Description: CONN IC DIP SOCKET 28POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
Part Status: Obsolete
товар відсутній
100-028-001 3M Description: CONN IC DIP SOCKET 28POS GOLD
Features: Closed Frame, Seal Tape
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
Part Status: Obsolete
товар відсутній
100-032-000 3M Description: CONN IC DIP SOCKET 32POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
Part Status: Obsolete
товар відсутній
100-032-001 3M Description: CONN IC DIP SOCKET 32POS GOLD
Packaging: Bulk
Features: Closed Frame, Seal Tape
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
Part Status: Obsolete
товар відсутній
100-040-000 3M Description: CONN IC DIP SOCKET 40POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
Part Status: Obsolete
товар відсутній
100-040-001 3M Description: CONN IC DIP SOCKET 40POS GOLD
Features: Closed Frame, Seal Tape
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
Part Status: Obsolete
товар відсутній
100-042-000 3M Description: CONN IC DIP SOCKET 42POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
Part Status: Obsolete
товар відсутній
100-048-000 3M Description: CONN IC DIP SOCKET 48POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
Part Status: Obsolete
товар відсутній
203-6585-00-0602J 203-6585-00-0602J 3M 3mtm-laser-diode-test-burn-in-socket-ts-0406.pdf Description: SOCKET LASER DIODE 3POS
товар відсутній
203-6585-50-0602J 203-6585-50-0602J 3M 3mtm-laser-diode-test-burn-in-socket-ts-0406.pdf Description: SOCKET LASER DIODE 3POS
Packaging: Bulk
For Use With/Related Products: Laser Diode Modules
Accessory Type: Laser - Socket
Part Status: Active
товар відсутній
203-6970-00-0602J 3M 3mtm-laser-diode-test-burn-in-socket-ts-0406.pdf Description: SOCKET LASER DIODE 3POS
Packaging: Bulk
For Use With/Related Products: Laser Diode Modules
Accessory Type: Laser - Socket
на замовлення 89 шт:
термін постачання 21-31 дні (днів)
1+772.75 грн
10+ 539.38 грн
203-6970-50-0602J 203-6970-50-0602J 3M 3mtm-laser-diode-test-burn-in-socket-ts-0406.pdf Description: SOCKET LASER DIODE 3POS
Packaging: Bulk
For Use With/Related Products: Laser Diode Modules
Accessory Type: Laser - Socket
Part Status: Active
на замовлення 138 шт:
термін постачання 21-31 дні (днів)
1+695.98 грн
10+ 486.18 грн
100+ 401.72 грн
204-6585-00-0602J 204-6585-00-0602J 3M 3mtm-laser-diode-test-burn-in-socket-ts-0406.pdf Description: SOCKET LASER DIODE 4POS
Packaging: Bulk
For Use With/Related Products: Laser Diode Modules
Accessory Type: Laser - Socket
товар відсутній
204-6585-50-0602J 204-6585-50-0602J 3M 3mtm-laser-diode-test-burn-in-socket-ts-0406.pdf Description: SOCKET LASER DIODE 4POS
Packaging: Bulk
For Use With/Related Products: Laser Diode Modules
Accessory Type: Laser - Socket
на замовлення 59 шт:
термін постачання 21-31 дні (днів)
1+843.84 грн
10+ 613.38 грн
204-6970-00-0602J 204-6970-00-0602J 3M 3mtm-laser-diode-test-burn-in-socket-ts-0406.pdf Description: SOCKET LASER DIODE 4POS
Packaging: Bulk
For Use With/Related Products: Laser Diode Modules
Accessory Type: Laser - Socket
Part Status: Active
на замовлення 107 шт:
термін постачання 21-31 дні (днів)
1+778.44 грн
10+ 565.53 грн
100+ 475.05 грн
204-6970-50-0602J 204-6970-50-0602J 3M 3mtm-laser-diode-test-burn-in-socket-ts-0406.pdf Description: SOCKET LASER DIODE 4POS
Packaging: Bulk
For Use With/Related Products: Laser Diode Modules
Accessory Type: Laser - Socket
Part Status: Active
товар відсутній
203-2737-55-1102 203-2737-55-1102 3M 3mtm-discrete-power-in-line-sockets-ts0458.pdf Description: CONN TRANSIST TO-3/TO-66 3POS
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: Transistor, TO-3 and TO-66
Operating Temperature: -55°C ~ 150°C
Number of Positions or Pins (Grid): 3 (Rectangular)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.234" (5.94mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
на замовлення 113 шт:
термін постачання 21-31 дні (днів)
1+3167.79 грн
10+ 2799.5 грн
30+ 2691.82 грн
50+ 2441.97 грн
100+ 2307.24 грн
SBR-ST-29-P-ML SBR-ST-29-P-ML 3M 3mtm-serial-attached-scsi-sas-connector-sbr-series-ts-2176.pdf Description: CONN SOCKET SAS 29POS VERT
товар відсутній
SBR-EV-29-P-ML SBR-EV-29-P-ML 3M 3mtm-serial-attached-scsi-sas-conn-sbr-series-ts-2177.pdf Description: CONN SAS RCPT 29POS SLD PCB
Packaging: Tray
Connector Type: SAS
Contact Finish: Gold
Mounting Type: Through Hole
Number of Positions: 29
Termination: Solder
Connector Style: Receptacle
Contact Finish Thickness: 30.0µin (0.76µm)
Part Status: Obsolete
на замовлення 242 шт:
термін постачання 21-31 дні (днів)
1+407.35 грн
10+ 354.13 грн
25+ 334.51 грн
40+ 306.27 грн
80+ 290.96 грн
230+ 260.33 грн
SBH-ST-29-SA-ML SBH-ST-29-SA-ML 3M 3mtm-serial-attached-scsisas-conn-sbh-series-ts-2179.pdf Description: CONN PLUG SAS 29POS STRADDLE MNT
товар відсутній
153204-2000-RB-WA 3mtm-2-mm-thru-board-skt-2mm-x-2mm-surface-mount-ts0521.pdf
Виробник: 3M
Description: CONN RCPT 4POS 0.079 GOLD SMD
Features: Pick and Place
Packaging: Tape & Reel (TR)
Connector Type: Receptacle, Bottom or Top Entry
Voltage Rating: 500VDC
Current Rating (Amps): 1A
Mounting Type: Surface Mount
Number of Positions: 4
Style: Board to Board or Cable
Operating Temperature: -55°C ~ 105°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.079" (2.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Tin
Part Status: Obsolete
Insulation Height: 0.129" (3.28mm)
Row Spacing - Mating: 0.079" (2.00mm)
Number of Rows: 2
товар відсутній
153214-2000-RB 3mtm-2-mm-thru-board-skt-2mm-x-2mm-surface-mount-ts0521.pdf
Виробник: 3M
Description: CONN RCPT 14POS 0.079 GOLD SMD
товар відсутній
153216-2020-RB 3mtm-2-mm-thru-board-skt-2mm-x-2mm-surface-mount-ts0521.pdf
153216-2020-RB
Виробник: 3M
Description: CONN RCPT 16POS 0.079 GOLD SMD
Features: Board Guide
Packaging: Tray
Connector Type: Receptacle, Bottom or Top Entry
Voltage Rating: 500VDC
Current Rating (Amps): 1A
Mounting Type: Surface Mount
Number of Positions: 16
Style: Board to Board or Cable
Operating Temperature: -55°C ~ 105°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.079" (2.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Tin
Part Status: Obsolete
Insulation Height: 0.129" (3.28mm)
Row Spacing - Mating: 0.079" (2.00mm)
Number of Rows: 2
товар відсутній
153250-2020-RB 3mtm-2-mm-thru-board-skt-2mm-x-2mm-surface-mount-ts0521.pdf
153250-2020-RB
Виробник: 3M
Description: CONN RCPT 50POS 0.079 GOLD SMD
Features: Board Guide
Packaging: Tray
Connector Type: Receptacle, Bottom or Top Entry
Voltage Rating: 500VDC
Current Rating (Amps): 1A
Mounting Type: Surface Mount
Number of Positions: 50
Style: Board to Board or Cable
Operating Temperature: -55°C ~ 105°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.079" (2.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Tin
Part Status: Obsolete
Insulation Height: 0.129" (3.28mm)
Row Spacing - Mating: 0.079" (2.00mm)
Number of Rows: 2
товар відсутній
ICO-083-S8A-T ICO,CICO,ICB_Series.pdf
Виробник: 3M
Description: CONN IC DIP SOCKET 8POS TIN
товар відсутній
ICO-083-S8-T ICO,CICO,ICB_Series.pdf
Виробник: 3M
Description: CONN IC DIP SOCKET 8POS TIN
товар відсутній
ICO-143-S8A-T ICO,CICO,ICB_Series.pdf
Виробник: 3M
Description: CONN IC DIP SOCKET 14POS TIN
товар відсутній
ICO-143-S8-T ICO,CICO,ICB_Series.pdf
Виробник: 3M
Description: CONN IC DIP SOCKET 14POS TIN
товар відсутній
ICO-163-S8A-T ICO,CICO,ICB_Series.pdf
Виробник: 3M
Description: CONN IC DIP SOCKET 16POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -65°C ~ 105°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Phosphor Bronze
Part Status: Obsolete
товар відсутній
ICO-183-S8A-T ICO,CICO,ICB_Series.pdf
Виробник: 3M
Description: CONN IC DIP SOCKET 18POS TIN
товар відсутній
ICO-203-S8A-T ICO,CICO,ICB_Series.pdf
Виробник: 3M
Description: CONN IC DIP SOCKET 20POS TIN
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -65°C ~ 105°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Phosphor Bronze
Part Status: Obsolete
товар відсутній
ICO-203-S8-T ICO,CICO,ICB_Series.pdf
Виробник: 3M
Description: CONN IC DIP SOCKET 20POS TIN
товар відсутній
ICO-243-S8A-T ICO,CICO,ICB_Series.pdf
Виробник: 3M
Description: CONN IC DIP SOCKET 24POS TIN
товар відсутній
ICO-246-S8-T ICO,CICO,ICB_Series.pdf
Виробник: 3M
Description: CONN IC DIP SOCKET 24POS TIN
товар відсутній
ICO-286-S8A-T ICO,CICO,ICB_Series.pdf
Виробник: 3M
Description: CONN IC DIP SOCKET 28POS TIN
товар відсутній
ICO-286-S8-T ICO,CICO,ICB_Series.pdf
Виробник: 3M
Description: CONN IC DIP SOCKET 28POS TIN
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -65°C ~ 105°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Phosphor Bronze
Part Status: Obsolete
товар відсутній
ICO-326-S8A-T ICO,CICO,ICB_Series.pdf
Виробник: 3M
Description: CONN IC DIP SOCKET 32POS TIN
товар відсутній
ICO-326-S8-T ICO,CICO,ICB_Series.pdf
Виробник: 3M
Description: CONN IC DIP SOCKET 32POS TIN
товар відсутній
ICO-406-S8A-T ICO,CICO,ICB_Series.pdf
Виробник: 3M
Description: CONN IC DIP SOCKET 40POS TIN
товар відсутній
ICO-406-S8-T ICO,CICO,ICB_Series.pdf
Виробник: 3M
Description: CONN IC DIP SOCKET 40POS TIN
товар відсутній
ICO-426-S8A-T ICO,CICO,ICB_Series.pdf
Виробник: 3M
Description: CONN IC DIP SOCKET 42POS TIN
товар відсутній
ICO-426-S8-T ICO,CICO,ICB_Series.pdf
Виробник: 3M
Description: CONN IC DIP SOCKET 42POS TIN
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -65°C ~ 105°C
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Phosphor Bronze
товар відсутній
ICO-486-S8A-T ICO,CICO,ICB_Series.pdf
Виробник: 3M
Description: CONN IC DIP SOCKET 48POS TIN
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -65°C ~ 105°C
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Phosphor Bronze
Part Status: Obsolete
товар відсутній
ICO-486-S8-T ICO,CICO,ICB_Series.pdf
Виробник: 3M
Description: CONN IC DIP SOCKET 48POS TIN
товар відсутній
923719 3mtm-test-clips-accessories.pdf
Виробник: 3M
Description: TEST CLIP 32POS DIP NAIL-HEAD
товар відсутній
100-006-000 3mtm-dip-socket-screw-machine-100-series-ts2115.pdf
Виробник: 3M
Description: CONN IC DIP SOCKET 6POS GOLD
товар відсутній
100-008-000 3mtm-dip-socket-screw-machine-100-series-ts2115.pdf
Виробник: 3M
Description: CONN IC DIP SOCKET 8POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
товар відсутній
100-008-001 3mtm-dip-socket-screw-machine-100-series-ts2115.pdf
Виробник: 3M
Description: CONN IC DIP SOCKET 8POS GOLD
Packaging: Bulk
Features: Closed Frame, Seal Tape
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
Part Status: Obsolete
товар відсутній
100-010-000 3mtm-dip-socket-screw-machine-100-series-ts2115.pdf
Виробник: 3M
Description: CONN IC DIP SOCKET 10POS GOLD
товар відсутній
100-014-000 3mtm-dip-socket-screw-machine-100-series-ts2115.pdf
Виробник: 3M
Description: CONN IC DIP SOCKET 14POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
товар відсутній
100-014-001 3mtm-dip-socket-screw-machine-100-series-ts2115.pdf
Виробник: 3M
Description: CONN IC DIP SOCKET 14POS GOLD
Packaging: Bulk
Features: Closed Frame, Seal Tape
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
Part Status: Obsolete
товар відсутній
100-016-000 3mtm-dip-socket-screw-machine-100-series-ts2115.pdf
Виробник: 3M
Description: CONN IC DIP SOCKET 16POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
Part Status: Obsolete
товар відсутній
100-016-001 3mtm-dip-socket-screw-machine-100-series-ts2115.pdf
Виробник: 3M
Description: CONN IC DIP SOCKET 16POS GOLD
Packaging: Bulk
Features: Closed Frame, Seal Tape
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
Part Status: Obsolete
товар відсутній
100-018-000
Виробник: 3M
Description: CONN IC DIP SOCKET 18POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
Part Status: Obsolete
товар відсутній
100-018-001
Виробник: 3M
Description: CONN IC DIP SOCKET 18POS GOLD
Packaging: Bulk
Features: Closed Frame, Seal Tape
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
Part Status: Obsolete
товар відсутній
100-020-000
Виробник: 3M
Description: CONN IC DIP SOCKET 20POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
Part Status: Obsolete
товар відсутній
100-020-001
Виробник: 3M
Description: CONN IC DIP SOCKET 20POS GOLD
Packaging: Bulk
Features: Closed Frame, Seal Tape
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
Part Status: Obsolete
товар відсутній
100-022-000
Виробник: 3M
Description: CONN IC DIP SOCKET 22POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 22 (2 x 11)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
Part Status: Obsolete
товар відсутній
100-024-000
Виробник: 3M
Description: CONN IC DIP SOCKET 24POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
Part Status: Obsolete
товар відсутній
100-024-001
Виробник: 3M
Description: CONN IC DIP SOCKET 24POS GOLD
Features: Closed Frame, Seal Tape
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
Part Status: Obsolete
товар відсутній
100-028-000
Виробник: 3M
Description: CONN IC DIP SOCKET 28POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
Part Status: Obsolete
товар відсутній
100-028-001
Виробник: 3M
Description: CONN IC DIP SOCKET 28POS GOLD
Features: Closed Frame, Seal Tape
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
Part Status: Obsolete
товар відсутній
100-032-000
Виробник: 3M
Description: CONN IC DIP SOCKET 32POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
Part Status: Obsolete
товар відсутній
100-032-001
Виробник: 3M
Description: CONN IC DIP SOCKET 32POS GOLD
Packaging: Bulk
Features: Closed Frame, Seal Tape
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
Part Status: Obsolete
товар відсутній
100-040-000
Виробник: 3M
Description: CONN IC DIP SOCKET 40POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
Part Status: Obsolete
товар відсутній
100-040-001
Виробник: 3M
Description: CONN IC DIP SOCKET 40POS GOLD
Features: Closed Frame, Seal Tape
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
Part Status: Obsolete
товар відсутній
100-042-000
Виробник: 3M
Description: CONN IC DIP SOCKET 42POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
Part Status: Obsolete
товар відсутній
100-048-000
Виробник: 3M
Description: CONN IC DIP SOCKET 48POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
Part Status: Obsolete
товар відсутній
203-6585-00-0602J 3mtm-laser-diode-test-burn-in-socket-ts-0406.pdf
203-6585-00-0602J
Виробник: 3M
Description: SOCKET LASER DIODE 3POS
товар відсутній
203-6585-50-0602J 3mtm-laser-diode-test-burn-in-socket-ts-0406.pdf
203-6585-50-0602J
Виробник: 3M
Description: SOCKET LASER DIODE 3POS
Packaging: Bulk
For Use With/Related Products: Laser Diode Modules
Accessory Type: Laser - Socket
Part Status: Active
товар відсутній
203-6970-00-0602J 3mtm-laser-diode-test-burn-in-socket-ts-0406.pdf
Виробник: 3M
Description: SOCKET LASER DIODE 3POS
Packaging: Bulk
For Use With/Related Products: Laser Diode Modules
Accessory Type: Laser - Socket
на замовлення 89 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1+772.75 грн
10+ 539.38 грн
203-6970-50-0602J 3mtm-laser-diode-test-burn-in-socket-ts-0406.pdf
203-6970-50-0602J
Виробник: 3M
Description: SOCKET LASER DIODE 3POS
Packaging: Bulk
For Use With/Related Products: Laser Diode Modules
Accessory Type: Laser - Socket
Part Status: Active
на замовлення 138 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1+695.98 грн
10+ 486.18 грн
100+ 401.72 грн
204-6585-00-0602J 3mtm-laser-diode-test-burn-in-socket-ts-0406.pdf
204-6585-00-0602J
Виробник: 3M
Description: SOCKET LASER DIODE 4POS
Packaging: Bulk
For Use With/Related Products: Laser Diode Modules
Accessory Type: Laser - Socket
товар відсутній
204-6585-50-0602J 3mtm-laser-diode-test-burn-in-socket-ts-0406.pdf
204-6585-50-0602J
Виробник: 3M
Description: SOCKET LASER DIODE 4POS
Packaging: Bulk
For Use With/Related Products: Laser Diode Modules
Accessory Type: Laser - Socket
на замовлення 59 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1+843.84 грн
10+ 613.38 грн
204-6970-00-0602J 3mtm-laser-diode-test-burn-in-socket-ts-0406.pdf
204-6970-00-0602J
Виробник: 3M
Description: SOCKET LASER DIODE 4POS
Packaging: Bulk
For Use With/Related Products: Laser Diode Modules
Accessory Type: Laser - Socket
Part Status: Active
на замовлення 107 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1+778.44 грн
10+ 565.53 грн
100+ 475.05 грн
204-6970-50-0602J 3mtm-laser-diode-test-burn-in-socket-ts-0406.pdf
204-6970-50-0602J
Виробник: 3M
Description: SOCKET LASER DIODE 4POS
Packaging: Bulk
For Use With/Related Products: Laser Diode Modules
Accessory Type: Laser - Socket
Part Status: Active
товар відсутній
203-2737-55-1102 3mtm-discrete-power-in-line-sockets-ts0458.pdf
203-2737-55-1102
Виробник: 3M
Description: CONN TRANSIST TO-3/TO-66 3POS
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: Transistor, TO-3 and TO-66
Operating Temperature: -55°C ~ 150°C
Number of Positions or Pins (Grid): 3 (Rectangular)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.234" (5.94mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
на замовлення 113 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1+3167.79 грн
10+ 2799.5 грн
30+ 2691.82 грн
50+ 2441.97 грн
100+ 2307.24 грн
SBR-ST-29-P-ML 3mtm-serial-attached-scsi-sas-connector-sbr-series-ts-2176.pdf
SBR-ST-29-P-ML
Виробник: 3M
Description: CONN SOCKET SAS 29POS VERT
товар відсутній
SBR-EV-29-P-ML 3mtm-serial-attached-scsi-sas-conn-sbr-series-ts-2177.pdf
SBR-EV-29-P-ML
Виробник: 3M
Description: CONN SAS RCPT 29POS SLD PCB
Packaging: Tray
Connector Type: SAS
Contact Finish: Gold
Mounting Type: Through Hole
Number of Positions: 29
Termination: Solder
Connector Style: Receptacle
Contact Finish Thickness: 30.0µin (0.76µm)
Part Status: Obsolete
на замовлення 242 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1+407.35 грн
10+ 354.13 грн
25+ 334.51 грн
40+ 306.27 грн
80+ 290.96 грн
230+ 260.33 грн
SBH-ST-29-SA-ML 3mtm-serial-attached-scsisas-conn-sbh-series-ts-2179.pdf
SBH-ST-29-SA-ML
Виробник: 3M
Description: CONN PLUG SAS 29POS STRADDLE MNT
товар відсутній
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