Фото | Назва | Виробник | Інформація |
Доступність |
Ціна без ПДВ |
||||||||||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
SBR-EV-29-P-ML | 3M |
Description: CONN SAS RCPT 29POS SLD PCB Packaging: Tray Connector Type: SAS Contact Finish: Gold Mounting Type: Through Hole Number of Positions: 29 Termination: Solder Connector Style: Receptacle Contact Finish Thickness: 30.0µin (0.76µm) Part Status: Obsolete |
на замовлення 242 шт: термін постачання 21-31 дні (днів) |
|
|||||||||||||||||||
SBH-ST-29-SA-ML | 3M | Description: CONN PLUG SAS 29POS STRADDLE MNT |
товар відсутній |
||||||||||||||||||||
SBH-ST-29-SM-ML | 3M |
Description: CONN SAS PLUG 29POS SLD SMD Features: Flange Packaging: Tray Connector Type: SAS Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 29 Termination: Solder Connector Style: Plug Contact Finish Thickness: 30.0µin (0.76µm) Part Status: Obsolete |
на замовлення 2916 шт: термін постачання 21-31 дні (днів) |
|
|||||||||||||||||||
SBR-RA-29-S-ML | 3M |
Description: CONN SAS RCPT 29POS SLD R/A Packaging: Tray Connector Type: SAS Contact Finish: Gold Mounting Type: Through Hole, Right Angle Number of Positions: 29 Termination: Solder Connector Style: Receptacle Contact Finish Thickness: 30.0µin (0.76µm) |
товар відсутній |
||||||||||||||||||||
4808-3000-CP | 3M |
Description: CONN IC DIP SOCKET 8POS TIN Features: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -25°C ~ 85°C Number of Positions or Pins (Grid): 8 (2 x 4) Termination: Solder Housing Material: Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 35.4µin (0.90µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 35.0µin (0.90µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
на замовлення 27691 шт: термін постачання 21-31 дні (днів) |
|
|||||||||||||||||||
4814-3000-CP | 3M |
Description: CONN IC DIP SOCKET 14POS TIN Features: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -25°C ~ 85°C Number of Positions or Pins (Grid): 14 (2 x 7) Termination: Solder Housing Material: Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 35.4µin (0.90µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 35.0µin (0.90µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
на замовлення 3503 шт: термін постачання 21-31 дні (днів) |
|
|||||||||||||||||||
4816-3000-CP | 3M |
Description: CONN IC DIP SOCKET 16POS TIN Features: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -25°C ~ 85°C Number of Positions or Pins (Grid): 16 (2 x 8) Termination: Solder Housing Material: Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 35.4µin (0.90µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 35.0µin (0.90µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
на замовлення 4441 шт: термін постачання 21-31 дні (днів) |
|
|||||||||||||||||||
4818-3000-CP | 3M |
Description: CONN IC DIP SOCKET 18POS TIN Features: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -25°C ~ 85°C Number of Positions or Pins (Grid): 18 (2 x 9) Termination: Solder Housing Material: Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 35.4µin (0.90µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 35.0µin (0.90µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
на замовлення 1395 шт: термін постачання 21-31 дні (днів) |
|
|||||||||||||||||||
4820-3000-CP | 3M |
Description: CONN IC DIP SOCKET 20POS TIN Features: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -25°C ~ 85°C Number of Positions or Pins (Grid): 20 (2 x 10) Termination: Solder Housing Material: Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 35.4µin (0.90µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 35.0µin (0.90µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
на замовлення 7054 шт: термін постачання 21-31 дні (днів) |
|
|||||||||||||||||||
4824-3000-CP | 3M |
Description: CONN IC DIP SOCKET 24POS TIN Features: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -25°C ~ 85°C Number of Positions or Pins (Grid): 24 (2 x 12) Termination: Solder Housing Material: Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 35.4µin (0.90µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 35.0µin (0.90µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
на замовлення 7658 шт: термін постачання 21-31 дні (днів) |
|
|||||||||||||||||||
4824-6000-CP | 3M |
Description: CONN IC DIP SOCKET 24POS TIN Features: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -25°C ~ 85°C Number of Positions or Pins (Grid): 24 (2 x 12) Termination: Solder Housing Material: Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 35.4µin (0.90µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 35.0µin (0.90µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
на замовлення 3132 шт: термін постачання 21-31 дні (днів) |
|
|||||||||||||||||||
4828-3000-CP | 3M |
Description: CONN IC DIP SOCKET 28POS TIN Features: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -25°C ~ 85°C Number of Positions or Pins (Grid): 28 (2 x 14) Termination: Solder Housing Material: Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 35.4µin (0.90µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 35.0µin (0.90µm) Contact Material - Post: Phosphor Bronze Part Status: Obsolete |
товар відсутній |
||||||||||||||||||||
4828-6000-CP | 3M |
Description: CONN IC DIP SOCKET 28POS TIN Features: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -25°C ~ 85°C Number of Positions or Pins (Grid): 28 (2 x 14) Termination: Solder Housing Material: Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 35.4µin (0.90µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 35.0µin (0.90µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
на замовлення 5240 шт: термін постачання 21-31 дні (днів) |
|
|||||||||||||||||||
4832-6000-CP | 3M |
Description: CONN IC DIP SOCKET 32POS TIN Features: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -25°C ~ 85°C Number of Positions or Pins (Grid): 32 (2 x 16) Termination: Solder Housing Material: Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 35.4µin (0.90µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 35.0µin (0.90µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
на замовлення 1217 шт: термін постачання 21-31 дні (днів) |
|
|||||||||||||||||||
4840-6000-CP | 3M |
Description: CONN IC DIP SOCKET 40POS TIN Features: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -25°C ~ 85°C Number of Positions or Pins (Grid): 40 (2 x 20) Termination: Solder Housing Material: Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 35.4µin (0.90µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 35.0µin (0.90µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
на замовлення 2902 шт: термін постачання 21-31 дні (днів) |
|
|||||||||||||||||||
4848-6000-CP | 3M |
Description: CONN IC DIP SOCKET 48POS TIN Features: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -25°C ~ 85°C Number of Positions or Pins (Grid): 48 (2 x 24) Termination: Solder Housing Material: Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 35.4µin (0.90µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 35.0µin (0.90µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
на замовлення 470 шт: термін постачання 21-31 дні (днів) |
|
|||||||||||||||||||
4808-3004-CP | 3M |
Description: CONN IC DIP SOCKET 8POS TIN Features: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -25°C ~ 85°C Number of Positions or Pins (Grid): 8 (2 x 4) Termination: Solder Housing Material: Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 35.4µin (0.90µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 35.0µin (0.90µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
на замовлення 47338 шт: термін постачання 21-31 дні (днів) |
|
|||||||||||||||||||
4814-3004-CP | 3M |
Description: CONN IC DIP SOCKET 14POS TIN Features: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -25°C ~ 85°C Number of Positions or Pins (Grid): 14 (2 x 7) Termination: Solder Housing Material: Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 35.4µin (0.90µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 35.0µin (0.90µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
товар відсутній |
||||||||||||||||||||
4816-3004-CP | 3M |
Description: CONN IC DIP SOCKET 16POS TIN Features: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -25°C ~ 85°C Number of Positions or Pins (Grid): 16 (2 x 8) Termination: Solder Housing Material: Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 35.4µin (0.90µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 35.0µin (0.90µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
на замовлення 12941 шт: термін постачання 21-31 дні (днів) |
|
|||||||||||||||||||
4818-3004-CP | 3M |
Description: CONN IC DIP SOCKET 18POS TIN Features: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -25°C ~ 85°C Number of Positions or Pins (Grid): 18 (2 x 9) Termination: Solder Housing Material: Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 35.4µin (0.90µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 35.0µin (0.90µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
на замовлення 6217 шт: термін постачання 21-31 дні (днів) |
|
|||||||||||||||||||
4820-3004-CP | 3M |
Description: CONN IC DIP SOCKET 20POS TIN Features: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -25°C ~ 85°C Number of Positions or Pins (Grid): 20 (2 x 10) Termination: Solder Housing Material: Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 35.4µin (0.90µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 35.0µin (0.90µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
на замовлення 6418 шт: термін постачання 21-31 дні (днів) |
|
|||||||||||||||||||
4824-3004-CP | 3M | Description: CONN IC DIP SOCKET 24POS TIN |
товар відсутній |
||||||||||||||||||||
4824-6004-CP | 3M |
Description: CONN IC DIP SOCKET 24POS TIN Features: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -25°C ~ 85°C Number of Positions or Pins (Grid): 24 (2 x 12) Termination: Solder Housing Material: Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 35.4µin (0.90µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 35.0µin (0.90µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
на замовлення 3657 шт: термін постачання 21-31 дні (днів) |
|
|||||||||||||||||||
4828-3004-CP | 3M |
Description: CONN IC DIP SOCKET 28POS TIN Features: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -25°C ~ 85°C Number of Positions or Pins (Grid): 28 (2 x 14) Termination: Solder Housing Material: Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 35.4µin (0.90µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 35.0µin (0.90µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
на замовлення 12079 шт: термін постачання 21-31 дні (днів) |
|
|||||||||||||||||||
4828-6004-CP | 3M |
Description: CONN IC DIP SOCKET 28POS TIN Features: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -25°C ~ 85°C Number of Positions or Pins (Grid): 28 (2 x 14) Termination: Solder Housing Material: Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 35.4µin (0.90µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 35.0µin (0.90µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
на замовлення 3150 шт: термін постачання 21-31 дні (днів) |
|
|||||||||||||||||||
4832-6004-CP | 3M |
Description: CONN IC DIP SOCKET 32POS TIN Features: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -25°C ~ 85°C Number of Positions or Pins (Grid): 32 (2 x 16) Termination: Solder Housing Material: Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 35.4µin (0.90µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 35.0µin (0.90µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
на замовлення 715 шт: термін постачання 21-31 дні (днів) |
|
|||||||||||||||||||
4840-6004-CP | 3M |
Description: CONN IC DIP SOCKET 40POS TIN Features: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -25°C ~ 85°C Number of Positions or Pins (Grid): 40 (2 x 20) Termination: Solder Housing Material: Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 35.4µin (0.90µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 35.0µin (0.90µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
на замовлення 3405 шт: термін постачання 21-31 дні (днів) |
|
|||||||||||||||||||
4848-6004-CP | 3M |
Description: CONN IC DIP SOCKET 48POS TIN Features: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -25°C ~ 85°C Number of Positions or Pins (Grid): 48 (2 x 24) Termination: Solder Housing Material: Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 35.4µin (0.90µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 35.0µin (0.90µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
на замовлення 564 шт: термін постачання 21-31 дні (днів) |
|
|||||||||||||||||||
D7E50-7316-02 | 3M |
Description: CONN COMPACT FLASH CARD SNAP-IN Packaging: Bulk Connector Type: Ejector Mounting Type: Snap-In Card Type: CompactFlash® - Type I Ejector Side: Right Insertion, Removal Method: Push In, Push Out Part Status: Active |
на замовлення 726 шт: термін постачання 21-31 дні (днів) |
|
|||||||||||||||||||
D7E50-8316-03 | 3M |
Description: CONN COMPACT FLASH CARD SNAP-IN Packaging: Bulk Connector Type: Ejector Mounting Type: Snap-In Card Type: CompactFlash® - Type I Ejector Side: Right Insertion, Removal Method: Push In, Push Out Part Status: Active |
на замовлення 993 шт: термін постачання 21-31 дні (днів) |
|
|||||||||||||||||||
3418-0000 | 3M | Description: CONN IDC 40POS 26-28AWG VERT |
товар відсутній |
||||||||||||||||||||
3426-0000 | 3M |
Description: CONN IDC 50POS 26-28AWG VERT Packaging: Bulk Features: Feed Through Connector Type: Ribbon Cable Contact Finish: Gold Color: Gray Mounting Type: Through Hole Wire Gauge: 26-28 AWG, Stranded or Solid Number of Positions: 50 Row Spacing: 0.100" (2.54mm) Contact Finish Thickness: 10.0µin (0.25µm) Cable Termination: IDC Cable Pitch: 0.050" (1.27mm) Number of Rows: 4 |
товар відсутній |
||||||||||||||||||||
3434-0000 | 3M | Description: CONN IDC 26POS 26-28AWG VERT |
товар відсутній |
||||||||||||||||||||
MP2-H024-41P1-S-TG30 | 3M |
Description: CONN HEADER FUTUREBUS+ 24POS PCB Features: Board Guide, Mating Guide Packaging: Tube Connector Type: Header, Male Pins Contact Finish: Gold Color: Beige Mounting Type: Through Hole Number of Positions: 24 Pitch: 0.079" (2.00mm) Number of Rows: 4 Number of Positions Loaded: All Termination: Press-Fit Connector Usage: Backplane Connector Style: Futurebus+® Contact Finish Thickness: 30.0µin (0.76µm) Part Status: Obsolete |
товар відсутній |
||||||||||||||||||||
MP2-H030-51P1-S-TG30 | 3M | Description: CONN HEADER FUTUREBUS+ 30POS PCB |
товар відсутній |
||||||||||||||||||||
MP2-H030-54P1-S-TR30 | 3M |
Description: CONN HEADER FUTUREBUS+ 30POS PCB Features: Board Guide, Mating Guide Packaging: Box Connector Type: Header, Male Pins Contact Finish: Gold Color: Beige Mounting Type: Through Hole Number of Positions: 30 Pitch: 0.079" (2.00mm) Number of Rows: 5 Number of Positions Loaded: All Termination: Press-Fit Connector Usage: Backplane Connector Style: Futurebus+® Contact Finish Thickness: 3.00µin (0.076µm) Part Status: Obsolete |
товар відсутній |
||||||||||||||||||||
MP2-H048-41P1-S-TG30 | 3M | Description: CONN HEADER 2-FB 48POS 4ROW |
товар відсутній |
||||||||||||||||||||
MP2-H048-41S3-S-TG | 3M | Description: CONN HEADER 2-FB 48POS 4ROW |
товар відсутній |
||||||||||||||||||||
MP2-H060-51P5-S-R30 | 3M | Description: CONN HEADER FUTUREBUS+ 60POS PCB |
товар відсутній |
||||||||||||||||||||
MP2-H060-54S1-S-TR30 | 3M |
Description: CONN HEADER FUTUREBUS+ 60POS PCB Features: Board Guide, Mating Guide Packaging: Box Connector Type: Header, Male Pins Contact Finish: Gold Color: Beige Mounting Type: Through Hole Number of Positions: 60 Pitch: 0.079" (2.00mm) Number of Rows: 5 Number of Positions Loaded: All Termination: Solder Connector Usage: Backplane Connector Style: Futurebus+® Contact Finish Thickness: 3.00µin (0.076µm) Part Status: Obsolete |
товар відсутній |
||||||||||||||||||||
MP2-H090-51P1-S-TR30 | 3M |
Description: CONN HEADER FUTUREBUS+ 90POS PCB Features: Board Guide, Mating Guide Packaging: Box Connector Type: Header, Male Pins Contact Finish: Gold Color: Beige Mounting Type: Through Hole Number of Positions: 90 Pitch: 0.079" (2.00mm) Number of Rows: 5 Number of Positions Loaded: All Termination: Press-Fit Connector Usage: Backplane Connector Style: Futurebus+® Contact Finish Thickness: 3.00µin (0.076µm) Part Status: Obsolete |
товар відсутній |
||||||||||||||||||||
MP2-H090-51S1-S-TG30 | 3M | Description: CONN HEADER FUTUREBUS+ 90POS PCB |
товар відсутній |
||||||||||||||||||||
MP2-H090-54S2-S-TG30 | 3M | Description: CONN HEADER 2-FB 90POS 5ROW |
товар відсутній |
||||||||||||||||||||
MP2-H096-41P1-S-TG30 | 3M | Description: CONN HEADER FUTUREBUS+ 96POS PCB |
товар відсутній |
||||||||||||||||||||
MP2-H120-41S1-S-TG30 | 3M |
Description: CONN HDR FUTUREBUS+ 120POS PCB Features: Board Guide, Mating Guide Packaging: Box Connector Type: Header, Male Pins Contact Finish: Gold Color: Beige Mounting Type: Through Hole Number of Positions: 120 Pitch: 0.079" (2.00mm) Number of Rows: 4 Number of Positions Loaded: All Termination: Solder Connector Usage: Backplane Connector Style: Futurebus+® Contact Finish Thickness: 30.0µin (0.76µm) |
товар відсутній |
||||||||||||||||||||
MP2-H144-41P1-S-TG30 | 3M | Description: CONN HEADER 2-FB 144POS 4ROW |
товар відсутній |
||||||||||||||||||||
MP2-H150-51S1-S-TR30 | 3M |
Description: CONN HDR FUTUREBUS+ 150POS PCB Features: Board Guide, Mating Guide Packaging: Box Connector Type: Header, Male Pins Contact Finish: Gold Color: Beige Mounting Type: Through Hole Number of Positions: 150 Pitch: 0.079" (2.00mm) Number of Rows: 5 Number of Positions Loaded: All Termination: Solder Connector Usage: Backplane Connector Style: Futurebus+® Contact Finish Thickness: 3.00µin (0.076µm) Part Status: Obsolete |
товар відсутній |
||||||||||||||||||||
MP2-H168-41P1-S-TG | 3M |
Description: CONN HDR FUTUREBUS+ 168POS PCB Features: Board Guide, Mating Guide Packaging: Box Connector Type: Header, Male Pins Contact Finish: Gold Color: Beige Mounting Type: Through Hole Number of Positions: 168 Pitch: 0.079" (2.00mm) Number of Rows: 4 Number of Positions Loaded: All Termination: Press-Fit Connector Usage: Backplane Connector Style: Futurebus+® Contact Finish Thickness: 10.0µin (0.25µm) Part Status: Obsolete |
товар відсутній |
||||||||||||||||||||
MP2-H180-51S2-S-TG30 | 3M | Description: CONN HDR FUTUREBUS+ 180POS PCB |
товар відсутній |
||||||||||||||||||||
MP2-H192-41S1-S-TR30 | 3M | Description: CONN HDR FUTUREBUS+ 192POS PCB |
товар відсутній |
||||||||||||||||||||
MP2-H192-44S1-S-TR30 | 3M |
Description: CONN HDR FUTUREBUS+ 192POS PCB Features: Board Guide, Mating Guide Packaging: Box Connector Type: Header, Male Pins Contact Finish: Gold Color: Beige Mounting Type: Through Hole Number of Positions: 192 Pitch: 0.079" (2.00mm) Number of Rows: 4 Number of Positions Loaded: All Termination: Solder Connector Usage: Backplane Connector Style: Futurebus+® Contact Finish Thickness: 3.00µin (0.076µm) Part Status: Obsolete |
товар відсутній |
||||||||||||||||||||
MP2-HP08-41P1-TG30 | 3M |
Description: CONN HEADER BLADE PWR 8POS PCB Packaging: Tube Connector Type: Header, Male Blades Contact Finish: Gold Color: Beige Mounting Type: Through Hole Number of Positions: 8 Pitch: 0.236" (6.00mm) Number of Rows: 4 Number of Positions Loaded: All Termination: Press-Fit Connector Usage: Backplane Connector Style: Blade Power Contact Finish Thickness: 30.0µin (0.76µm) Contact Layout, Typical: 8 Power Part Status: Obsolete |
товар відсутній |
||||||||||||||||||||
MP2-HP08-41P1-TR30 | 3M | Description: CONN POWER HEADER 2-FB 8POS 4ROW |
товар відсутній |
||||||||||||||||||||
MP2-HP08-42P1-TG30 | 3M |
Description: CONN HEADER BLADE PWR 8POS PCB Packaging: Tube Connector Type: Header, Male Blades Contact Finish: Gold Color: Beige Mounting Type: Through Hole Number of Positions: 8 Pitch: 0.236" (6.00mm) Number of Rows: 4 Number of Positions Loaded: All Termination: Press-Fit Connector Usage: Backplane Connector Style: Blade Power Contact Finish Thickness: 30.0µin (0.76µm) Contact Layout, Typical: 8 Power Part Status: Obsolete |
товар відсутній |
||||||||||||||||||||
MP2-HP10-51P1-TG30 | 3M | Description: CONN HEADER BLADE PWR 10POS PCB |
товар відсутній |
||||||||||||||||||||
MP2-HP10-51P1-TR30 | 3M | Description: CONN HEADER BLADE PWR 10POS PCB |
товар відсутній |
||||||||||||||||||||
MP2-HP10-51P1-TR40B | 3M | Description: CONN POWER HEADR 2-FB 10POS 5ROW |
товар відсутній |
||||||||||||||||||||
MP2-HP10-52P1-TR30 | 3M | Description: CONN HEADER BLADE PWR 10POS PCB |
товар відсутній |
||||||||||||||||||||
MP2-HP10-53P1-TR30 | 3M | Description: CONN POWER HEADR 2-FB 10POS 5ROW |
товар відсутній |
||||||||||||||||||||
MP2-HP10-5CP1-TG30 | 3M |
Description: CONN HEADER BLADE PWR 10POS PCB Packaging: Bulk Connector Type: Header, Male Blades Contact Finish: Gold Color: Beige Mounting Type: Through Hole Number of Positions: 10 Pitch: 0.236" (6.00mm) Number of Rows: 5 Number of Positions Loaded: All Termination: Press-Fit Connector Usage: Backplane Connector Style: Blade Power Contact Finish Thickness: 30.0µin (0.76µm) Contact Layout, Typical: 10 Power Part Status: Obsolete |
товар відсутній |
SBR-EV-29-P-ML |
Виробник: 3M
Description: CONN SAS RCPT 29POS SLD PCB
Packaging: Tray
Connector Type: SAS
Contact Finish: Gold
Mounting Type: Through Hole
Number of Positions: 29
Termination: Solder
Connector Style: Receptacle
Contact Finish Thickness: 30.0µin (0.76µm)
Part Status: Obsolete
Description: CONN SAS RCPT 29POS SLD PCB
Packaging: Tray
Connector Type: SAS
Contact Finish: Gold
Mounting Type: Through Hole
Number of Positions: 29
Termination: Solder
Connector Style: Receptacle
Contact Finish Thickness: 30.0µin (0.76µm)
Part Status: Obsolete
на замовлення 242 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 407.35 грн |
10+ | 354.13 грн |
25+ | 334.51 грн |
40+ | 306.27 грн |
80+ | 290.96 грн |
230+ | 260.33 грн |
SBH-ST-29-SM-ML |
Виробник: 3M
Description: CONN SAS PLUG 29POS SLD SMD
Features: Flange
Packaging: Tray
Connector Type: SAS
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 29
Termination: Solder
Connector Style: Plug
Contact Finish Thickness: 30.0µin (0.76µm)
Part Status: Obsolete
Description: CONN SAS PLUG 29POS SLD SMD
Features: Flange
Packaging: Tray
Connector Type: SAS
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 29
Termination: Solder
Connector Style: Plug
Contact Finish Thickness: 30.0µin (0.76µm)
Part Status: Obsolete
на замовлення 2916 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 420.14 грн |
10+ | 367.14 грн |
25+ | 347.71 грн |
40+ | 318.72 грн |
80+ | 303.54 грн |
230+ | 265.6 грн |
440+ | 253.78 грн |
945+ | 216.46 грн |
2400+ | 201.53 грн |
SBR-RA-29-S-ML |
Виробник: 3M
Description: CONN SAS RCPT 29POS SLD R/A
Packaging: Tray
Connector Type: SAS
Contact Finish: Gold
Mounting Type: Through Hole, Right Angle
Number of Positions: 29
Termination: Solder
Connector Style: Receptacle
Contact Finish Thickness: 30.0µin (0.76µm)
Description: CONN SAS RCPT 29POS SLD R/A
Packaging: Tray
Connector Type: SAS
Contact Finish: Gold
Mounting Type: Through Hole, Right Angle
Number of Positions: 29
Termination: Solder
Connector Style: Receptacle
Contact Finish Thickness: 30.0µin (0.76µm)
товар відсутній
4808-3000-CP |
Виробник: 3M
Description: CONN IC DIP SOCKET 8POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: CONN IC DIP SOCKET 8POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
на замовлення 27691 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
7+ | 46.92 грн |
10+ | 39.09 грн |
25+ | 35.73 грн |
50+ | 31.54 грн |
100+ | 30.24 грн |
250+ | 27.61 грн |
500+ | 25.86 грн |
1000+ | 21.33 грн |
2500+ | 19.4 грн |
4814-3000-CP |
Виробник: 3M
Description: CONN IC DIP SOCKET 14POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: CONN IC DIP SOCKET 14POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
на замовлення 3503 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
7+ | 46.21 грн |
10+ | 38.68 грн |
28+ | 35.35 грн |
56+ | 31.23 грн |
112+ | 29.93 грн |
252+ | 27.32 грн |
504+ | 25.6 грн |
1008+ | 21.12 грн |
2520+ | 19.2 грн |
4816-3000-CP |
Виробник: 3M
Description: CONN IC DIP SOCKET 16POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: CONN IC DIP SOCKET 16POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
на замовлення 4441 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
7+ | 46.92 грн |
10+ | 39.09 грн |
25+ | 35.73 грн |
50+ | 31.54 грн |
100+ | 30.24 грн |
250+ | 27.61 грн |
500+ | 25.86 грн |
1000+ | 21.33 грн |
2500+ | 19.4 грн |
4818-3000-CP |
Виробник: 3M
Description: CONN IC DIP SOCKET 18POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: CONN IC DIP SOCKET 18POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
на замовлення 1395 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
6+ | 50.47 грн |
22+ | 41.17 грн |
44+ | 38.66 грн |
110+ | 34.71 грн |
264+ | 31.55 грн |
506+ | 28.4 грн |
1012+ | 24.83 грн |
4820-3000-CP |
Виробник: 3M
Description: CONN IC DIP SOCKET 20POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: CONN IC DIP SOCKET 20POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
на замовлення 7054 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
6+ | 52.61 грн |
20+ | 42.89 грн |
40+ | 40.27 грн |
100+ | 36.14 грн |
260+ | 32.86 грн |
500+ | 29.57 грн |
1000+ | 25.86 грн |
2500+ | 23.43 грн |
4824-3000-CP |
Виробник: 3M
Description: CONN IC DIP SOCKET 24POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: CONN IC DIP SOCKET 24POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
на замовлення 7658 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
5+ | 65.4 грн |
16+ | 53.23 грн |
32+ | 51.04 грн |
64+ | 46.89 грн |
112+ | 44.85 грн |
256+ | 40.77 грн |
512+ | 36.09 грн |
1008+ | 32.08 грн |
2512+ | 29.07 грн |
4824-6000-CP |
Виробник: 3M
Description: CONN IC DIP SOCKET 24POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: CONN IC DIP SOCKET 24POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
на замовлення 3132 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
5+ | 65.4 грн |
16+ | 53.23 грн |
32+ | 51.04 грн |
64+ | 46.89 грн |
112+ | 44.85 грн |
256+ | 40.77 грн |
512+ | 36.09 грн |
1008+ | 32.08 грн |
2512+ | 29.07 грн |
4828-3000-CP |
Виробник: 3M
Description: CONN IC DIP SOCKET 28POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Obsolete
Description: CONN IC DIP SOCKET 28POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Obsolete
товар відсутній
4828-6000-CP |
Виробник: 3M
Description: CONN IC DIP SOCKET 28POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: CONN IC DIP SOCKET 28POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
на замовлення 5240 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
4+ | 71.8 грн |
14+ | 58.34 грн |
28+ | 55.94 грн |
56+ | 51.38 грн |
112+ | 49.15 грн |
252+ | 44.69 грн |
504+ | 39.56 грн |
1008+ | 35.16 грн |
2506+ | 31.87 грн |
4832-6000-CP |
Виробник: 3M
Description: CONN IC DIP SOCKET 32POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: CONN IC DIP SOCKET 32POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
на замовлення 1217 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
4+ | 71.8 грн |
12+ | 58.3 грн |
36+ | 55.94 грн |
60+ | 51.38 грн |
108+ | 49.16 грн |
252+ | 44.69 грн |
504+ | 39.56 грн |
1008+ | 35.16 грн |
4840-6000-CP |
Виробник: 3M
Description: CONN IC DIP SOCKET 40POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: CONN IC DIP SOCKET 40POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
на замовлення 2902 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
4+ | 80.33 грн |
10+ | 65.24 грн |
30+ | 62.57 грн |
50+ | 57.45 грн |
100+ | 54.95 грн |
250+ | 49.96 грн |
500+ | 44.23 грн |
1000+ | 39.31 грн |
2500+ | 35.63 грн |
4848-6000-CP |
Виробник: 3M
Description: CONN IC DIP SOCKET 48POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: CONN IC DIP SOCKET 48POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
на замовлення 470 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
4+ | 94.55 грн |
16+ | 78.98 грн |
32+ | 75.65 грн |
56+ | 69.4 грн |
104+ | 66.25 грн |
256+ | 59.94 грн |
4808-3004-CP |
Виробник: 3M
Description: CONN IC DIP SOCKET 8POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: CONN IC DIP SOCKET 8POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
на замовлення 47338 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
7+ | 46.92 грн |
10+ | 39.09 грн |
25+ | 35.73 грн |
50+ | 31.54 грн |
100+ | 30.24 грн |
250+ | 27.61 грн |
500+ | 25.86 грн |
1000+ | 21.33 грн |
2500+ | 19.4 грн |
4814-3004-CP |
Виробник: 3M
Description: CONN IC DIP SOCKET 14POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: CONN IC DIP SOCKET 14POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
товар відсутній
4816-3004-CP |
Виробник: 3M
Description: CONN IC DIP SOCKET 16POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: CONN IC DIP SOCKET 16POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
на замовлення 12941 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
6+ | 50.47 грн |
10+ | 41.21 грн |
25+ | 39.49 грн |
50+ | 36.29 грн |
100+ | 34.71 грн |
250+ | 31.55 грн |
500+ | 27.93 грн |
1000+ | 24.83 грн |
2500+ | 22.5 грн |
4818-3004-CP |
Виробник: 3M
Description: CONN IC DIP SOCKET 18POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: CONN IC DIP SOCKET 18POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
на замовлення 6217 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
6+ | 52.61 грн |
22+ | 42.91 грн |
44+ | 40.27 грн |
110+ | 36.15 грн |
264+ | 32.86 грн |
506+ | 29.57 грн |
1012+ | 25.86 грн |
2508+ | 23.43 грн |
4820-3004-CP |
Виробник: 3M
Description: CONN IC DIP SOCKET 20POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: CONN IC DIP SOCKET 20POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
на замовлення 6418 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
6+ | 52.61 грн |
20+ | 42.89 грн |
40+ | 40.27 грн |
100+ | 36.14 грн |
260+ | 32.86 грн |
500+ | 29.57 грн |
1000+ | 25.86 грн |
2500+ | 23.43 грн |
4824-6004-CP |
Виробник: 3M
Description: CONN IC DIP SOCKET 24POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: CONN IC DIP SOCKET 24POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
на замовлення 3657 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
5+ | 65.4 грн |
16+ | 53.23 грн |
32+ | 51.04 грн |
64+ | 46.89 грн |
112+ | 44.85 грн |
256+ | 40.77 грн |
512+ | 36.09 грн |
1008+ | 32.08 грн |
2512+ | 29.07 грн |
4828-3004-CP |
Виробник: 3M
Description: CONN IC DIP SOCKET 28POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: CONN IC DIP SOCKET 28POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
на замовлення 12079 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
5+ | 69.67 грн |
14+ | 56.62 грн |
28+ | 54.3 грн |
56+ | 49.87 грн |
112+ | 47.7 грн |
252+ | 43.37 грн |
504+ | 38.39 грн |
1008+ | 34.13 грн |
2506+ | 30.93 грн |
4828-6004-CP |
Виробник: 3M
Description: CONN IC DIP SOCKET 28POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: CONN IC DIP SOCKET 28POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
на замовлення 3150 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
4+ | 73.22 грн |
14+ | 60.05 грн |
28+ | 57.6 грн |
56+ | 52.9 грн |
112+ | 50.59 грн |
252+ | 45.99 грн |
504+ | 40.71 грн |
1008+ | 36.19 грн |
2506+ | 32.8 грн |
4832-6004-CP |
Виробник: 3M
Description: CONN IC DIP SOCKET 32POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: CONN IC DIP SOCKET 32POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
на замовлення 715 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
4+ | 80.33 грн |
12+ | 65.21 грн |
36+ | 62.54 грн |
60+ | 57.46 грн |
108+ | 54.96 грн |
252+ | 49.96 грн |
504+ | 44.23 грн |
4840-6004-CP |
Виробник: 3M
Description: CONN IC DIP SOCKET 40POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: CONN IC DIP SOCKET 40POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
на замовлення 3405 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
4+ | 86.73 грн |
10+ | 70.37 грн |
30+ | 67.48 грн |
50+ | 61.97 грн |
100+ | 59.28 грн |
250+ | 53.89 грн |
500+ | 47.71 грн |
1000+ | 42.4 грн |
2500+ | 38.43 грн |
4848-6004-CP |
Виробник: 3M
Description: CONN IC DIP SOCKET 48POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: CONN IC DIP SOCKET 48POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
на замовлення 564 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
4+ | 94.55 грн |
16+ | 78.98 грн |
32+ | 75.65 грн |
56+ | 69.4 грн |
104+ | 66.25 грн |
256+ | 59.94 грн |
504+ | 54.3 грн |
D7E50-7316-02 |
Виробник: 3M
Description: CONN COMPACT FLASH CARD SNAP-IN
Packaging: Bulk
Connector Type: Ejector
Mounting Type: Snap-In
Card Type: CompactFlash® - Type I
Ejector Side: Right
Insertion, Removal Method: Push In, Push Out
Part Status: Active
Description: CONN COMPACT FLASH CARD SNAP-IN
Packaging: Bulk
Connector Type: Ejector
Mounting Type: Snap-In
Card Type: CompactFlash® - Type I
Ejector Side: Right
Insertion, Removal Method: Push In, Push Out
Part Status: Active
на замовлення 726 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 513.98 грн |
10+ | 447.71 грн |
25+ | 422.98 грн |
50+ | 387.27 грн |
100+ | 367.9 грн |
250+ | 329.17 грн |
500+ | 304.73 грн |
D7E50-8316-03 |
Виробник: 3M
Description: CONN COMPACT FLASH CARD SNAP-IN
Packaging: Bulk
Connector Type: Ejector
Mounting Type: Snap-In
Card Type: CompactFlash® - Type I
Ejector Side: Right
Insertion, Removal Method: Push In, Push Out
Part Status: Active
Description: CONN COMPACT FLASH CARD SNAP-IN
Packaging: Bulk
Connector Type: Ejector
Mounting Type: Snap-In
Card Type: CompactFlash® - Type I
Ejector Side: Right
Insertion, Removal Method: Push In, Push Out
Part Status: Active
на замовлення 993 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 563.04 грн |
10+ | 488.31 грн |
25+ | 459.98 грн |
50+ | 420.62 грн |
100+ | 409.55 грн |
250+ | 365.27 грн |
500+ | 337.51 грн |
3426-0000 |
Виробник: 3M
Description: CONN IDC 50POS 26-28AWG VERT
Packaging: Bulk
Features: Feed Through
Connector Type: Ribbon Cable
Contact Finish: Gold
Color: Gray
Mounting Type: Through Hole
Wire Gauge: 26-28 AWG, Stranded or Solid
Number of Positions: 50
Row Spacing: 0.100" (2.54mm)
Contact Finish Thickness: 10.0µin (0.25µm)
Cable Termination: IDC
Cable Pitch: 0.050" (1.27mm)
Number of Rows: 4
Description: CONN IDC 50POS 26-28AWG VERT
Packaging: Bulk
Features: Feed Through
Connector Type: Ribbon Cable
Contact Finish: Gold
Color: Gray
Mounting Type: Through Hole
Wire Gauge: 26-28 AWG, Stranded or Solid
Number of Positions: 50
Row Spacing: 0.100" (2.54mm)
Contact Finish Thickness: 10.0µin (0.25µm)
Cable Termination: IDC
Cable Pitch: 0.050" (1.27mm)
Number of Rows: 4
товар відсутній
MP2-H024-41P1-S-TG30 |
Виробник: 3M
Description: CONN HEADER FUTUREBUS+ 24POS PCB
Features: Board Guide, Mating Guide
Packaging: Tube
Connector Type: Header, Male Pins
Contact Finish: Gold
Color: Beige
Mounting Type: Through Hole
Number of Positions: 24
Pitch: 0.079" (2.00mm)
Number of Rows: 4
Number of Positions Loaded: All
Termination: Press-Fit
Connector Usage: Backplane
Connector Style: Futurebus+®
Contact Finish Thickness: 30.0µin (0.76µm)
Part Status: Obsolete
Description: CONN HEADER FUTUREBUS+ 24POS PCB
Features: Board Guide, Mating Guide
Packaging: Tube
Connector Type: Header, Male Pins
Contact Finish: Gold
Color: Beige
Mounting Type: Through Hole
Number of Positions: 24
Pitch: 0.079" (2.00mm)
Number of Rows: 4
Number of Positions Loaded: All
Termination: Press-Fit
Connector Usage: Backplane
Connector Style: Futurebus+®
Contact Finish Thickness: 30.0µin (0.76µm)
Part Status: Obsolete
товар відсутній
MP2-H030-54P1-S-TR30 |
Виробник: 3M
Description: CONN HEADER FUTUREBUS+ 30POS PCB
Features: Board Guide, Mating Guide
Packaging: Box
Connector Type: Header, Male Pins
Contact Finish: Gold
Color: Beige
Mounting Type: Through Hole
Number of Positions: 30
Pitch: 0.079" (2.00mm)
Number of Rows: 5
Number of Positions Loaded: All
Termination: Press-Fit
Connector Usage: Backplane
Connector Style: Futurebus+®
Contact Finish Thickness: 3.00µin (0.076µm)
Part Status: Obsolete
Description: CONN HEADER FUTUREBUS+ 30POS PCB
Features: Board Guide, Mating Guide
Packaging: Box
Connector Type: Header, Male Pins
Contact Finish: Gold
Color: Beige
Mounting Type: Through Hole
Number of Positions: 30
Pitch: 0.079" (2.00mm)
Number of Rows: 5
Number of Positions Loaded: All
Termination: Press-Fit
Connector Usage: Backplane
Connector Style: Futurebus+®
Contact Finish Thickness: 3.00µin (0.076µm)
Part Status: Obsolete
товар відсутній
MP2-H060-54S1-S-TR30 |
Виробник: 3M
Description: CONN HEADER FUTUREBUS+ 60POS PCB
Features: Board Guide, Mating Guide
Packaging: Box
Connector Type: Header, Male Pins
Contact Finish: Gold
Color: Beige
Mounting Type: Through Hole
Number of Positions: 60
Pitch: 0.079" (2.00mm)
Number of Rows: 5
Number of Positions Loaded: All
Termination: Solder
Connector Usage: Backplane
Connector Style: Futurebus+®
Contact Finish Thickness: 3.00µin (0.076µm)
Part Status: Obsolete
Description: CONN HEADER FUTUREBUS+ 60POS PCB
Features: Board Guide, Mating Guide
Packaging: Box
Connector Type: Header, Male Pins
Contact Finish: Gold
Color: Beige
Mounting Type: Through Hole
Number of Positions: 60
Pitch: 0.079" (2.00mm)
Number of Rows: 5
Number of Positions Loaded: All
Termination: Solder
Connector Usage: Backplane
Connector Style: Futurebus+®
Contact Finish Thickness: 3.00µin (0.076µm)
Part Status: Obsolete
товар відсутній
MP2-H090-51P1-S-TR30 |
Виробник: 3M
Description: CONN HEADER FUTUREBUS+ 90POS PCB
Features: Board Guide, Mating Guide
Packaging: Box
Connector Type: Header, Male Pins
Contact Finish: Gold
Color: Beige
Mounting Type: Through Hole
Number of Positions: 90
Pitch: 0.079" (2.00mm)
Number of Rows: 5
Number of Positions Loaded: All
Termination: Press-Fit
Connector Usage: Backplane
Connector Style: Futurebus+®
Contact Finish Thickness: 3.00µin (0.076µm)
Part Status: Obsolete
Description: CONN HEADER FUTUREBUS+ 90POS PCB
Features: Board Guide, Mating Guide
Packaging: Box
Connector Type: Header, Male Pins
Contact Finish: Gold
Color: Beige
Mounting Type: Through Hole
Number of Positions: 90
Pitch: 0.079" (2.00mm)
Number of Rows: 5
Number of Positions Loaded: All
Termination: Press-Fit
Connector Usage: Backplane
Connector Style: Futurebus+®
Contact Finish Thickness: 3.00µin (0.076µm)
Part Status: Obsolete
товар відсутній
MP2-H120-41S1-S-TG30 |
Виробник: 3M
Description: CONN HDR FUTUREBUS+ 120POS PCB
Features: Board Guide, Mating Guide
Packaging: Box
Connector Type: Header, Male Pins
Contact Finish: Gold
Color: Beige
Mounting Type: Through Hole
Number of Positions: 120
Pitch: 0.079" (2.00mm)
Number of Rows: 4
Number of Positions Loaded: All
Termination: Solder
Connector Usage: Backplane
Connector Style: Futurebus+®
Contact Finish Thickness: 30.0µin (0.76µm)
Description: CONN HDR FUTUREBUS+ 120POS PCB
Features: Board Guide, Mating Guide
Packaging: Box
Connector Type: Header, Male Pins
Contact Finish: Gold
Color: Beige
Mounting Type: Through Hole
Number of Positions: 120
Pitch: 0.079" (2.00mm)
Number of Rows: 4
Number of Positions Loaded: All
Termination: Solder
Connector Usage: Backplane
Connector Style: Futurebus+®
Contact Finish Thickness: 30.0µin (0.76µm)
товар відсутній
MP2-H150-51S1-S-TR30 |
Виробник: 3M
Description: CONN HDR FUTUREBUS+ 150POS PCB
Features: Board Guide, Mating Guide
Packaging: Box
Connector Type: Header, Male Pins
Contact Finish: Gold
Color: Beige
Mounting Type: Through Hole
Number of Positions: 150
Pitch: 0.079" (2.00mm)
Number of Rows: 5
Number of Positions Loaded: All
Termination: Solder
Connector Usage: Backplane
Connector Style: Futurebus+®
Contact Finish Thickness: 3.00µin (0.076µm)
Part Status: Obsolete
Description: CONN HDR FUTUREBUS+ 150POS PCB
Features: Board Guide, Mating Guide
Packaging: Box
Connector Type: Header, Male Pins
Contact Finish: Gold
Color: Beige
Mounting Type: Through Hole
Number of Positions: 150
Pitch: 0.079" (2.00mm)
Number of Rows: 5
Number of Positions Loaded: All
Termination: Solder
Connector Usage: Backplane
Connector Style: Futurebus+®
Contact Finish Thickness: 3.00µin (0.076µm)
Part Status: Obsolete
товар відсутній
MP2-H168-41P1-S-TG |
Виробник: 3M
Description: CONN HDR FUTUREBUS+ 168POS PCB
Features: Board Guide, Mating Guide
Packaging: Box
Connector Type: Header, Male Pins
Contact Finish: Gold
Color: Beige
Mounting Type: Through Hole
Number of Positions: 168
Pitch: 0.079" (2.00mm)
Number of Rows: 4
Number of Positions Loaded: All
Termination: Press-Fit
Connector Usage: Backplane
Connector Style: Futurebus+®
Contact Finish Thickness: 10.0µin (0.25µm)
Part Status: Obsolete
Description: CONN HDR FUTUREBUS+ 168POS PCB
Features: Board Guide, Mating Guide
Packaging: Box
Connector Type: Header, Male Pins
Contact Finish: Gold
Color: Beige
Mounting Type: Through Hole
Number of Positions: 168
Pitch: 0.079" (2.00mm)
Number of Rows: 4
Number of Positions Loaded: All
Termination: Press-Fit
Connector Usage: Backplane
Connector Style: Futurebus+®
Contact Finish Thickness: 10.0µin (0.25µm)
Part Status: Obsolete
товар відсутній
MP2-H192-44S1-S-TR30 |
Виробник: 3M
Description: CONN HDR FUTUREBUS+ 192POS PCB
Features: Board Guide, Mating Guide
Packaging: Box
Connector Type: Header, Male Pins
Contact Finish: Gold
Color: Beige
Mounting Type: Through Hole
Number of Positions: 192
Pitch: 0.079" (2.00mm)
Number of Rows: 4
Number of Positions Loaded: All
Termination: Solder
Connector Usage: Backplane
Connector Style: Futurebus+®
Contact Finish Thickness: 3.00µin (0.076µm)
Part Status: Obsolete
Description: CONN HDR FUTUREBUS+ 192POS PCB
Features: Board Guide, Mating Guide
Packaging: Box
Connector Type: Header, Male Pins
Contact Finish: Gold
Color: Beige
Mounting Type: Through Hole
Number of Positions: 192
Pitch: 0.079" (2.00mm)
Number of Rows: 4
Number of Positions Loaded: All
Termination: Solder
Connector Usage: Backplane
Connector Style: Futurebus+®
Contact Finish Thickness: 3.00µin (0.076µm)
Part Status: Obsolete
товар відсутній
MP2-HP08-41P1-TG30 |
Виробник: 3M
Description: CONN HEADER BLADE PWR 8POS PCB
Packaging: Tube
Connector Type: Header, Male Blades
Contact Finish: Gold
Color: Beige
Mounting Type: Through Hole
Number of Positions: 8
Pitch: 0.236" (6.00mm)
Number of Rows: 4
Number of Positions Loaded: All
Termination: Press-Fit
Connector Usage: Backplane
Connector Style: Blade Power
Contact Finish Thickness: 30.0µin (0.76µm)
Contact Layout, Typical: 8 Power
Part Status: Obsolete
Description: CONN HEADER BLADE PWR 8POS PCB
Packaging: Tube
Connector Type: Header, Male Blades
Contact Finish: Gold
Color: Beige
Mounting Type: Through Hole
Number of Positions: 8
Pitch: 0.236" (6.00mm)
Number of Rows: 4
Number of Positions Loaded: All
Termination: Press-Fit
Connector Usage: Backplane
Connector Style: Blade Power
Contact Finish Thickness: 30.0µin (0.76µm)
Contact Layout, Typical: 8 Power
Part Status: Obsolete
товар відсутній
MP2-HP08-42P1-TG30 |
Виробник: 3M
Description: CONN HEADER BLADE PWR 8POS PCB
Packaging: Tube
Connector Type: Header, Male Blades
Contact Finish: Gold
Color: Beige
Mounting Type: Through Hole
Number of Positions: 8
Pitch: 0.236" (6.00mm)
Number of Rows: 4
Number of Positions Loaded: All
Termination: Press-Fit
Connector Usage: Backplane
Connector Style: Blade Power
Contact Finish Thickness: 30.0µin (0.76µm)
Contact Layout, Typical: 8 Power
Part Status: Obsolete
Description: CONN HEADER BLADE PWR 8POS PCB
Packaging: Tube
Connector Type: Header, Male Blades
Contact Finish: Gold
Color: Beige
Mounting Type: Through Hole
Number of Positions: 8
Pitch: 0.236" (6.00mm)
Number of Rows: 4
Number of Positions Loaded: All
Termination: Press-Fit
Connector Usage: Backplane
Connector Style: Blade Power
Contact Finish Thickness: 30.0µin (0.76µm)
Contact Layout, Typical: 8 Power
Part Status: Obsolete
товар відсутній
MP2-HP10-5CP1-TG30 |
Виробник: 3M
Description: CONN HEADER BLADE PWR 10POS PCB
Packaging: Bulk
Connector Type: Header, Male Blades
Contact Finish: Gold
Color: Beige
Mounting Type: Through Hole
Number of Positions: 10
Pitch: 0.236" (6.00mm)
Number of Rows: 5
Number of Positions Loaded: All
Termination: Press-Fit
Connector Usage: Backplane
Connector Style: Blade Power
Contact Finish Thickness: 30.0µin (0.76µm)
Contact Layout, Typical: 10 Power
Part Status: Obsolete
Description: CONN HEADER BLADE PWR 10POS PCB
Packaging: Bulk
Connector Type: Header, Male Blades
Contact Finish: Gold
Color: Beige
Mounting Type: Through Hole
Number of Positions: 10
Pitch: 0.236" (6.00mm)
Number of Rows: 5
Number of Positions Loaded: All
Termination: Press-Fit
Connector Usage: Backplane
Connector Style: Blade Power
Contact Finish Thickness: 30.0µin (0.76µm)
Contact Layout, Typical: 10 Power
Part Status: Obsolete
товар відсутній