| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна без ПДВ |
||
|---|---|---|---|---|---|---|---|
| EK-U1-ZCU104-G-J | AMD |
 Description: XILINX ZYNQ ULTRASCALE+ ZCU104 PPackaging: Box For Use With/Related Products: XCZU7EV Type: FPGA + MCU/MPU SoC Contents: Board(s), Cable(s), Accessories - Power Supply Not Included - Platform: Zynq UltraScale+ MPSoC ZCU104 Japan Part Status: Active |
товар відсутній |
||||
 |
A-U200-A64G-PQ-G | AMD |
Description: BOARD DCAB SERVER U200 ACTIVE Power (Watts): 225W Packaging: Box Memory Size: 64GB Interface: PCI Express Operating Temperature: 0°C ~ 45°C Bandwidth: 77GB/s Cooling Type: Fan LUTs: 892k INT8 TOPs: 18.6 |
на замовлення 17 шт: термін постачання 21-31 дні (днів) |
|
||
 |
A-U250-P64G-PQ-G | AMD |
Description: BOARD DCAB SERVER U250 PASSIVE Power (Watts): 225W Packaging: Box Memory Size: 64GB Interface: PCI Express Operating Temperature: 0°C ~ 45°C Bandwidth: 77GB/s Cooling Type: Heat Sink LUTs: 1341k INT8 TOPs: 33.3 |
на замовлення 5 шт: термін постачання 21-31 дні (днів) |
|
||
 |
EK-U1-ZCU111-G | AMD |
Description: EVAL BOARD KIT ZCU111 Packaging: Bulk For Use With/Related Products: XCZU28DR Type: FPGA + MCU/MPU SoC Contents: Board(s), Cable(s), Power Supply, Accessories Platform: Zynq UltraScale+ MPSoC ZCU111 Part Status: Active |
на замовлення 29 шт: термін постачання 21-31 дні (днів) |
|
||
 |
EK-U1-VCU128-G | AMD |
Description: KIT EVAL VCU128 VIRTEX USCALE Packaging: Bulk For Use With/Related Products: XCVU37P Type: FPGA Contents: Board(s), Cable(s), Power Supply, Accessories Platform: Virtex UltraScale+ FPGA VCU128 PCIe Card Part Status: Active |
на замовлення 24 шт: термін постачання 21-31 дні (днів) |
|
||
 |
XC7S50-1FGA484I | AMD |
Description: IC FPGA 250 I/O 484FBGA Packaging: Tray Package / Case: 484-BGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.95V ~ 1.05V Number of Logic Elements/Cells: 52160 Supplier Device Package: 484-FPBGA (23x23) Number of LABs/CLBs: 4075 Total RAM Bits: 2764800 Part Status: Active Number of I/O: 250 DigiKey Programmable: Not Verified |
на замовлення 803 шт: термін постачання 21-31 дні (днів) |
|
||
 |
HW-PWAC-2600317 | AMD |
Description: HW ALVEO CARD RA PWR ADAPT Packaging: Box For Use With/Related Products: Alveo Accessory Type: Cable Assembly Part Status: Active |
на замовлення 8 шт: термін постачання 21-31 дні (днів) |
|
||
 |
EK-S7-SP701-G | AMD |
Description: SPARTAN7 SP701 FPGA KIT Packaging: Box For Use With/Related Products: XC7S100 Type: FPGA Contents: Board(s), Cable(s), Power Supply Platform: Spartan-7 FPGA SP701 Part Status: Active |
на замовлення 34 шт: термін постачання 21-31 дні (днів) |
|
||
| XC7Z007S-1CL225I | AMD |
Description: IC FPGA SGL ARM CORTEX 225BGA Packaging: Tray Package / Case: 225-LFBGA, CSPBGA Speed: 667MHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: Artix™-7 FPGA, 23K Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA Supplier Device Package: 225-CSPBGA (13x13) Architecture: MCU, FPGA Part Status: Active |
товар відсутній |
||||
| XCVU31P-2FSVH1924E | AMD |
Description: IC FPGA 208 I/O 1924FCBGA Packaging: Tray Package / Case: 1924-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.825V ~ 0.876V Number of Logic Elements/Cells: 961800 Supplier Device Package: 1924-FCBGA (45x45) Number of LABs/CLBs: 54960 Total RAM Bits: 24746394 Part Status: Active Number of I/O: 208 |
товар відсутній |
||||
 |
EK-U1-ZCU104-G-ED | AMD |
Description: KIT EVAL ZYNQUS+ MPSOC ZCU104 ED Packaging: Box For Use With/Related Products: XCZU7EV Type: FPGA + MCU/MPU SoC Contents: Board(s), Cable(s), Power Supply, Accessories Platform: Zynq UltraScale+ MPSoC ZCU104 Encryption Disabled Part Status: Obsolete |
на замовлення 1 шт: термін постачання 21-31 дні (днів) |
|
||
| XA7A12T-1CPG238I | AMD |
Description: IC FPGA 112 I/O 238CSBGA Packaging: Tray Package / Case: 238-LFBGA, CSPBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.95V ~ 1.05V Number of Logic Elements/Cells: 12800 Supplier Device Package: 238-CSBGA (10x10) Number of LABs/CLBs: 1000 Total RAM Bits: 737280 Part Status: Active Number of I/O: 112 |
товар відсутній |
||||
| XC7S50-1FTGB196Q | AMD |
Description: IC FPGA 100 I/O 196CSBGA Packaging: Tray Package / Case: 196-LBGA, CSPBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TJ) Voltage - Supply: 0.95V ~ 1.05V Number of Logic Elements/Cells: 52160 Supplier Device Package: 196-CSBGA (15x15) Number of LABs/CLBs: 4075 Total RAM Bits: 2764800 Part Status: Active Number of I/O: 100 DigiKey Programmable: Not Verified |
товар відсутній |
||||
| XC7S25-1FTGB196Q | AMD |
Description: IC FPGA 100 I/O 196CSBGA Packaging: Tray Package / Case: 196-LBGA, CSPBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TJ) Voltage - Supply: 0.95V ~ 1.05V Number of Logic Elements/Cells: 23360 Supplier Device Package: 196-CSBGA (15x15) Number of LABs/CLBs: 1825 Total RAM Bits: 1658880 Part Status: Active Number of I/O: 100 DigiKey Programmable: Not Verified |
товар відсутній |
||||
 |
A-U50DD-P00G-ES3-G | AMD |
Description: BOARD DCAB ALVEO U50 NET PASSIVE Packaging: Box Power (Watts): 75W Memory Size: 8GB Interface: PCI Express Operating Temperature: 0°C ~ 50°C Bandwidth: 201GB/s Cooling Type: Heat Sink LUTs: 872k |
товар відсутній |
|||
 |
XC95288XV-7FG256C | AMD |
Description: IC CPLD 288MC 7.5NS 256FBGA Packaging: Tray Package / Case: 256-BGA Mounting Type: Surface Mount Programmable Type: In System Programmable Number of Gates: 6400 Number of Macrocells: 288 Operating Temperature: 0°C ~ 70°C (TA) Delay Time tpd(1) Max: 7.5 ns Supplier Device Package: 256-FBGA (17x17) Number of Logic Elements/Blocks: 16 Voltage Supply - Internal: 2.37V ~ 2.62V Number of I/O: 192 DigiKey Programmable: Not Verified |
на замовлення 615 шт: термін постачання 21-31 дні (днів) |
|
||
 |
XC2C64A-7PCG44I | AMD |
Description: FLASH PLD, 7.5NS, 64-CELL PQCC44 Packaging: Bulk Part Status: Active DigiKey Programmable: Not Verified |
товар відсутній |
|||
|
|
XC2C64A-7PC44C | AMD |
Description: FLASH PLD, 7.5NS, 64-CELL PQCC44 Packaging: Bulk Part Status: Active DigiKey Programmable: Not Verified |
товар відсутній |
|||
 |
XC95144XV-5CS144C | AMD |
Description: FLASH PLD, 5NS, 144-CELL PBGA144 Packaging: Bulk Part Status: Active DigiKey Programmable: Not Verified |
на замовлення 1093 шт: термін постачання 21-31 дні (днів) |
|
||
|
|
XC95144XV-7CS144C | AMD |
Description: FLASH PLD, 7.5NS, 144-CELL Packaging: Bulk Part Status: Active DigiKey Programmable: Not Verified |
на замовлення 1459 шт: термін постачання 21-31 дні (днів) |
|
||
|
|
XC2C64A-7PCG44C | AMD |
Description: FLASH PLD, 7.5NS, 64-CELL PQCC44 Packaging: Bulk Part Status: Active DigiKey Programmable: Not Verified |
товар відсутній |
|||
 |
EK-U1-ZCU216-ES1-G | AMD |
Description: ZYNQ US+ RFSOC ZCU216 ES1 EVK Packaging: Box For Use With/Related Products: XCZU49DR Type: FPGA + MCU/MPU SoC Contents: Board(s), Cable(s), Power Supply, Accessories Platform: Zynq UltraScale+ RFSoC ZCU216 ES1 |
товар відсутній |
|||
 |
XCVU47P-2FSVH2892E | AMD |
Description: IC FPGA 624 I/O 2892FCBGA Packaging: Tray Package / Case: 2892-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.825V ~ 0.876V Number of Logic Elements/Cells: 2851800 Supplier Device Package: 2892-FCBGA (55x55) Number of LABs/CLBs: 162960 Total RAM Bits: 74344038 Number of I/O: 624 DigiKey Programmable: Not Verified |
товар відсутній |
|||
|
|
XCVU47P-L2FSVH2892E | AMD |
Description: IC FPGA 624 I/O 2892FCBGA Packaging: Tray Package / Case: 2892-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.698V ~ 0.742V Number of Logic Elements/Cells: 2851800 Supplier Device Package: 2892-FCBGA (55x55) Number of LABs/CLBs: 162960 Total RAM Bits: 74344038 Number of I/O: 624 DigiKey Programmable: Not Verified |
товар відсутній |
|||
|
|
XCVU47P-3FSVH2892E | AMD |
Description: IC FPGA 624 I/O 2892FCBGA Packaging: Tray Package / Case: 2892-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.825V ~ 0.876V Number of Logic Elements/Cells: 2851800 Supplier Device Package: 2892-FCBGA (55x55) Number of LABs/CLBs: 162960 Total RAM Bits: 74344038 Number of I/O: 624 DigiKey Programmable: Not Verified |
товар відсутній |
|||
| LMS-EMBD-SDSOC | AMD |
Description: TRAINING CREDIT SDSOC DEV METHOD Packaging: Electronic Delivery Type: License Media Delivery Type: Electronically Delivered Part Status: Active |
товар відсутній |
||||
 |
XCZU4EG-L1SFVC784I | AMD |
Description: IC SOC CORTEX-A53 784FCBGA Packaging: Tray Package / Case: 784-BFBGA, FCBGA Speed: 500MHz, 600MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 784-FCBGA (23x23) Architecture: MCU, FPGA |
товар відсутній |
|||
 |
XCZU4EG-L1FBVB900I | AMD |
Description: IC SOC CORTEX-A53 900FCBGA Packaging: Tray Package / Case: 900-BBGA, FCBGA Speed: 500MHz, 600MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 900-FCBGA (31x31) Architecture: MCU, FPGA |
товар відсутній |
|||
 |
XCZU6EG-L1FFVC900I | AMD |
Description: IC SOC CORTEX-A53 900FCBGA Packaging: Tray Package / Case: 900-BBGA, FCBGA Speed: 500MHz, 600MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 900-FCBGA (31x31) Architecture: MCU, FPGA |
товар відсутній |
|||
 |
XCZU6EG-L1FFVB1156I | AMD |
Description: IC SOC CORTEX-A53 1156FCBGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 500MHz, 600MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA |
товар відсутній |
|||
 |
XCZU7EG-L1FFVC1156I | AMD |
Description: IC SOC CORTEX-A53 1156FCBGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 500MHz, 600MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA |
товар відсутній |
|||
|
|
XCZU11EG-L1FFVC1156I | AMD |
Description: IC SOC CORTEX-A53 1156FCBGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 500MHz, 600MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 653K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA |
товар відсутній |
|||
 |
XCZU15EG-L1FFVB1156I | AMD |
Description: IC SOC CORTEX-A53 1156FCBGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 500MHz, 600MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 747K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA Part Status: Active |
товар відсутній |
|||
 |
XCZU19EG-L1FFVB1517I | AMD |
Description: IC SOC CORTEX-A53 1517FCBGA Packaging: Tray Package / Case: 1517-BBGA, FCBGA Speed: 500MHz, 600MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1517-FCBGA (40x40) Architecture: MCU, FPGA Part Status: Active |
товар відсутній |
|||
| XCZU19EG-L1FFVC1760I | AMD |
Description: IC SOC CORTEX-A53 1760FCBGA Packaging: Tray Package / Case: 1760-BBGA, FCBGA Speed: 500MHz, 600MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1760-FCBGA (42.5x42.5) Architecture: MCU, FPGA Part Status: Active |
товар відсутній |
||||
| XCVU160-2FLGB2104E | AMD |
Description: IC FPGA 702 I/O 2104FCBGA Packaging: Tray Package / Case: 2104-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.922V ~ 0.979V Number of Logic Elements/Cells: 2026500 Supplier Device Package: 2104-FCBGA (47.5x47.5) Number of LABs/CLBs: 115800 Total RAM Bits: 130969600 Number of I/O: 702 DigiKey Programmable: Not Verified |
товар відсутній |
||||
| XCVU160-2FLGB2104I | AMD |
Description: IC FPGA 702 I/O 2104FCBGA Packaging: Tray Package / Case: 2104-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.922V ~ 0.979V Number of Logic Elements/Cells: 2026500 Supplier Device Package: 2104-FCBGA (47.5x47.5) Number of LABs/CLBs: 115800 Total RAM Bits: 130969600 Number of I/O: 702 DigiKey Programmable: Not Verified |
товар відсутній |
||||
 |
XCKU3P-1FFVA676E | AMD |
Description: IC FPGA 256 I/O 676FCBGA Packaging: Tray Package / Case: 676-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.825V ~ 0.876V Number of Logic Elements/Cells: 355950 Supplier Device Package: 676-FCBGA (27x27) Number of LABs/CLBs: 20340 Total RAM Bits: 31641600 Number of I/O: 256 DigiKey Programmable: Not Verified |
товар відсутній |
|||
|
|
XCKU3P-2FFVA676E | AMD |
Description: IC FPGA 256 I/O 676FCBGA Packaging: Tray Package / Case: 676-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.825V ~ 0.876V Number of Logic Elements/Cells: 355950 Supplier Device Package: 676-FCBGA (27x27) Number of LABs/CLBs: 20340 Total RAM Bits: 31641600 Number of I/O: 256 DigiKey Programmable: Not Verified |
товар відсутній |
|||
|
|
XCKU3P-2FFVA676I | AMD |
Description: IC FPGA 256 I/O 676FCBGA Packaging: Tray Package / Case: 676-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.825V ~ 0.876V Number of Logic Elements/Cells: 355950 Supplier Device Package: 676-FCBGA (27x27) Number of LABs/CLBs: 20340 Total RAM Bits: 31641600 Number of I/O: 256 DigiKey Programmable: Not Verified |
товар відсутній |
|||
 |
XC3164A-09TQ144C | AMD |
Description: FPGA, 224 CLBS, 3500 GATES Packaging: Bulk Part Status: Active DigiKey Programmable: Not Verified Package / Case: 144-LQFP Exposed Pad Mounting Type: Surface Mount Number of Gates: 4500 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 4.25V ~ 5.25V Number of Logic Elements/Cells: 224 Supplier Device Package: 144-TQFP (20x20) Number of LABs/CLBs: 224 Total RAM Bits: 46064 Number of I/O: 120 |
на замовлення 57 шт: термін постачання 21-31 дні (днів) |
|
||
 |
XC6SLX100-2FGG484C | AMD |
Description: IC FPGA 326 I/O 484FBGA Packaging: Tray Package / Case: 484-BBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 101261 Supplier Device Package: 484-FBGA (23x23) Number of LABs/CLBs: 7911 Total RAM Bits: 4939776 Part Status: Active Number of I/O: 326 DigiKey Programmable: Not Verified |
на замовлення 120 шт: термін постачання 21-31 дні (днів) |
|
||
| EFR-DI-3RD-PARTY-LIC | AMD |
Description: IP R 3RD PARTY PROVIDER LIC GEN Packaging: Electronic Delivery For Use With/Related Products: Xilinx Type: License License Length: 1 Year Renewal Media Delivery Type: Electronically Delivered |
товар відсутній |
||||
 |
XC9572XL-7PC44I | AMD |
Description: FLASH PLD, 7.5NS, 72-CELL PQCC44 Packaging: Bulk Part Status: Active DigiKey Programmable: Not Verified |
товар відсутній |
|||
| XCS20XL-4CS144C | AMD |
Description: IC FPGA 113 I/O 144CSBGA Packaging: Bulk Package / Case: 144-TFBGA, CSPBGA Mounting Type: Surface Mount Number of Gates: 20000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 3V ~ 3.6V Number of Logic Elements/Cells: 950 Supplier Device Package: 144-LCSBGA (12x12) Number of LABs/CLBs: 400 Total RAM Bits: 12800 Part Status: Obsolete Number of I/O: 113 |
на замовлення 617 шт: термін постачання 21-31 дні (днів) |
|
|||
 |
XCR3032XL-10VQ44Q0789 | AMD |
Description: EE PLD, 10NS, CMOS Packaging: Bulk Part Status: Active DigiKey Programmable: Not Verified |
товар відсутній |
|||
|
|
XCR3032XL-10VQ44Q | AMD |
Description: EE PLD, 10NS, CMOS, PQFP44 Packaging: Bulk Part Status: Active DigiKey Programmable: Not Verified |
товар відсутній |
|||
 |
EK-U1-ZCU102-G-ED | AMD |
Description: KIT EVAL ZYNQUS+ MPSOC ZCU102 ED Packaging: Box For Use With/Related Products: XCZU9EG Type: FPGA + MCU/MPU SoC Contents: Board(s), Cable(s), Power Supply, Accessories Platform: Zynq UltraScale+ MPSoC ZCU102 Encryption Disabled Part Status: Active |
на замовлення 33 шт: термін постачання 21-31 дні (днів) |
|
||
 |
EK-U1-ZCU102-G-J | AMD |
Description: XILINX ZYNQ ULTRASCALE+ MPSOC ZC Packaging: Box For Use With/Related Products: XCZU9EG Type: FPGA + MCU/MPU SoC Contents: Board(s), Cable(s), Accessories - Power Supply Not Included - Platform: Zynq UltraScale+ MPSoC ZCU102 Japan Part Status: Active |
товар відсутній |
|||
| EF-DI-25GBASE-KR-RLL | AMD |
Description: LICENSE LTD REDISTRIBUTION 25GBA Packaging: Electronic Delivery For Use With/Related Products: Xilinx Type: License License Length: 1 Year License - User Details: Redistribution Limited Media Delivery Type: Electronically Delivered Part Status: Active |
товар відсутній |
||||
| EF-DI-25GEMAC-RLL | AMD |
Description: LICENSE LTD REDISTRIBUTION 25GEM Packaging: Electronic Delivery For Use With/Related Products: Xilinx Type: License License Length: 1 Year License - User Details: Redistribution Limited Media Delivery Type: Electronically Delivered Part Status: Active |
товар відсутній |
||||
| EFR-DI-25GBASE-KR-RLL | AMD |
Description: LICENSE LTD REDISTRIBUTION 25GBA Packaging: Electronic Delivery For Use With/Related Products: Xilinx Type: License License Length: 1 Year Renewal License - User Details: Redistribution Limited Media Delivery Type: Electronically Delivered Part Status: Active |
товар відсутній |
||||
| EFR-DI-25GEMAC-RLL | AMD |
Description: LICENSE LTD REDISTRIBUTION 25GEM Packaging: Electronic Delivery For Use With/Related Products: Xilinx Type: License License Length: 1 Year Renewal License - User Details: Redistribution Limited Media Delivery Type: Electronically Delivered Part Status: Active |
товар відсутній |
||||
| XCV400-4BG560I | AMD |
Description: IC FPGA 404 I/O 560MBGA Packaging: Bulk Package / Case: 560-LBGA Exposed Pad, Metal Mounting Type: Surface Mount Number of Gates: 468252 Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 2.375V ~ 2.625V Number of Logic Elements/Cells: 10800 Supplier Device Package: 560-MBGA (42.5x42.5) Number of LABs/CLBs: 2400 Total RAM Bits: 81920 Part Status: Obsolete Number of I/O: 404 DigiKey Programmable: Not Verified |
на замовлення 2 шт: термін постачання 21-31 дні (днів) |
|
|||
 |
XC4036XLA-09BG432C | AMD |
Description: FPGA, 1296 CLBS, 22000 GATES Packaging: Bulk Package / Case: 432-LBGA Exposed Pad, Metal Mounting Type: Surface Mount Number of Gates: 22000 Supplier Device Package: 432-MBGA (40x40) Number of LABs/CLBs: 1296 DigiKey Programmable: Not Verified |
на замовлення 16 шт: термін постачання 21-31 дні (днів) |
|
||
|
|
XCV400E-7BG432C0773 | AMD |
Description: FPGA, 2400 CLBS, 468252 GATES, 2 Packaging: Bulk Part Status: Active |
на замовлення 70 шт: термін постачання 21-31 дні (днів) |
|
||
| EK-U1-ZCU208-ES1-G | AMD |
Description: ZYNQ US+ RFSOC ZCU208 ES1 EVK Packaging: Box For Use With/Related Products: XCZU48DR Type: FPGA + MCU/MPU SoC Contents: Board(s), Cable(s), Power Supply, Accessories Platform: Zynq UltraScale+ RFSoC ZCU208 ES1 |
товар відсутній |
||||
 |
XCF16PVOG48C | AMD |
Description: IC PROM SRL 1.8V 16M GATE 48TSOP Packaging: Tray Package / Case: 48-TFSOP (0.724", 18.40mm Width) Mounting Type: Surface Mount Memory Size: 16MB Programmable Type: In System Programmable Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.65V ~ 2V Supplier Device Package: 48-TSOP DigiKey Programmable: Not Verified |
товар відсутній |
|||
|
|
XC2C32A-4PCG44C | AMD |
Description: FLASH PLD, 4NS, 32-CELL PQCC44 Packaging: Bulk Part Status: Active DigiKey Programmable: Not Verified |
товар відсутній |
|||
|
|
XC2C32A-4PC44C | AMD |
Description: FLASH PLD, 4NS, 32-CELL PQCC44 Packaging: Bulk Part Status: Active DigiKey Programmable: Not Verified |
товар відсутній |
| EK-U1-ZCU104-G-J |
|
Виробник: AMD
Description: XILINX ZYNQ ULTRASCALE+ ZCU104 P
Packaging: Box
For Use With/Related Products: XCZU7EV
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Accessories - Power Supply Not Included -
Platform: Zynq UltraScale+ MPSoC ZCU104 Japan
Part Status: Active
Description: XILINX ZYNQ ULTRASCALE+ ZCU104 P
Packaging: Box
For Use With/Related Products: XCZU7EV
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Accessories - Power Supply Not Included -
Platform: Zynq UltraScale+ MPSoC ZCU104 Japan
Part Status: Active
товар відсутній
| A-U200-A64G-PQ-G |
|
Виробник: AMD
Description: BOARD DCAB SERVER U200 ACTIVE
Power (Watts): 225W
Packaging: Box
Memory Size: 64GB
Interface: PCI Express
Operating Temperature: 0°C ~ 45°C
Bandwidth: 77GB/s
Cooling Type: Fan
LUTs: 892k
INT8 TOPs: 18.6
Description: BOARD DCAB SERVER U200 ACTIVE
Power (Watts): 225W
Packaging: Box
Memory Size: 64GB
Interface: PCI Express
Operating Temperature: 0°C ~ 45°C
Bandwidth: 77GB/s
Cooling Type: Fan
LUTs: 892k
INT8 TOPs: 18.6
на замовлення 17 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 395226.41 грн |
| A-U250-P64G-PQ-G |
|
Виробник: AMD
Description: BOARD DCAB SERVER U250 PASSIVE
Power (Watts): 225W
Packaging: Box
Memory Size: 64GB
Interface: PCI Express
Operating Temperature: 0°C ~ 45°C
Bandwidth: 77GB/s
Cooling Type: Heat Sink
LUTs: 1341k
INT8 TOPs: 33.3
Description: BOARD DCAB SERVER U250 PASSIVE
Power (Watts): 225W
Packaging: Box
Memory Size: 64GB
Interface: PCI Express
Operating Temperature: 0°C ~ 45°C
Bandwidth: 77GB/s
Cooling Type: Heat Sink
LUTs: 1341k
INT8 TOPs: 33.3
на замовлення 5 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 616604.75 грн |
| EK-U1-ZCU111-G |
|
Виробник: AMD
Description: EVAL BOARD KIT ZCU111
Packaging: Bulk
For Use With/Related Products: XCZU28DR
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Power Supply, Accessories
Platform: Zynq UltraScale+ MPSoC ZCU111
Part Status: Active
Description: EVAL BOARD KIT ZCU111
Packaging: Bulk
For Use With/Related Products: XCZU28DR
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Power Supply, Accessories
Platform: Zynq UltraScale+ MPSoC ZCU111
Part Status: Active
на замовлення 29 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 843845.22 грн |
| EK-U1-VCU128-G |
|
Виробник: AMD
Description: KIT EVAL VCU128 VIRTEX USCALE
Packaging: Bulk
For Use With/Related Products: XCVU37P
Type: FPGA
Contents: Board(s), Cable(s), Power Supply, Accessories
Platform: Virtex UltraScale+ FPGA VCU128 PCIe Card
Part Status: Active
Description: KIT EVAL VCU128 VIRTEX USCALE
Packaging: Bulk
For Use With/Related Products: XCVU37P
Type: FPGA
Contents: Board(s), Cable(s), Power Supply, Accessories
Platform: Virtex UltraScale+ FPGA VCU128 PCIe Card
Part Status: Active
на замовлення 24 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 881817 грн |
| XC7S50-1FGA484I |
|
Виробник: AMD
Description: IC FPGA 250 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 52160
Supplier Device Package: 484-FPBGA (23x23)
Number of LABs/CLBs: 4075
Total RAM Bits: 2764800
Part Status: Active
Number of I/O: 250
DigiKey Programmable: Not Verified
Description: IC FPGA 250 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 52160
Supplier Device Package: 484-FPBGA (23x23)
Number of LABs/CLBs: 4075
Total RAM Bits: 2764800
Part Status: Active
Number of I/O: 250
DigiKey Programmable: Not Verified
на замовлення 803 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 4678.84 грн |
| HW-PWAC-2600317 |
Виробник: AMD
Description: HW ALVEO CARD RA PWR ADAPT
Packaging: Box
For Use With/Related Products: Alveo
Accessory Type: Cable Assembly
Part Status: Active
Description: HW ALVEO CARD RA PWR ADAPT
Packaging: Box
For Use With/Related Products: Alveo
Accessory Type: Cable Assembly
Part Status: Active
на замовлення 8 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 866.53 грн |
| EK-S7-SP701-G |
|
Виробник: AMD
Description: SPARTAN7 SP701 FPGA KIT
Packaging: Box
For Use With/Related Products: XC7S100
Type: FPGA
Contents: Board(s), Cable(s), Power Supply
Platform: Spartan-7 FPGA SP701
Part Status: Active
Description: SPARTAN7 SP701 FPGA KIT
Packaging: Box
For Use With/Related Products: XC7S100
Type: FPGA
Contents: Board(s), Cable(s), Power Supply
Platform: Spartan-7 FPGA SP701
Part Status: Active
на замовлення 34 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 61073.61 грн |
| XC7Z007S-1CL225I |
|
Виробник: AMD
Description: IC FPGA SGL ARM CORTEX 225BGA
Packaging: Tray
Package / Case: 225-LFBGA, CSPBGA
Speed: 667MHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 23K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 225-CSPBGA (13x13)
Architecture: MCU, FPGA
Part Status: Active
Description: IC FPGA SGL ARM CORTEX 225BGA
Packaging: Tray
Package / Case: 225-LFBGA, CSPBGA
Speed: 667MHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 23K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 225-CSPBGA (13x13)
Architecture: MCU, FPGA
Part Status: Active
товар відсутній
| XCVU31P-2FSVH1924E |
|
Виробник: AMD
Description: IC FPGA 208 I/O 1924FCBGA
Packaging: Tray
Package / Case: 1924-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 961800
Supplier Device Package: 1924-FCBGA (45x45)
Number of LABs/CLBs: 54960
Total RAM Bits: 24746394
Part Status: Active
Number of I/O: 208
Description: IC FPGA 208 I/O 1924FCBGA
Packaging: Tray
Package / Case: 1924-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 961800
Supplier Device Package: 1924-FCBGA (45x45)
Number of LABs/CLBs: 54960
Total RAM Bits: 24746394
Part Status: Active
Number of I/O: 208
товар відсутній
| EK-U1-ZCU104-G-ED |
|
Виробник: AMD
Description: KIT EVAL ZYNQUS+ MPSOC ZCU104 ED
Packaging: Box
For Use With/Related Products: XCZU7EV
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Power Supply, Accessories
Platform: Zynq UltraScale+ MPSoC ZCU104 Encryption Disabled
Part Status: Obsolete
Description: KIT EVAL ZYNQUS+ MPSOC ZCU104 ED
Packaging: Box
For Use With/Related Products: XCZU7EV
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Power Supply, Accessories
Platform: Zynq UltraScale+ MPSoC ZCU104 Encryption Disabled
Part Status: Obsolete
на замовлення 1 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 122624.56 грн |
| XA7A12T-1CPG238I |
|
Виробник: AMD
Description: IC FPGA 112 I/O 238CSBGA
Packaging: Tray
Package / Case: 238-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 12800
Supplier Device Package: 238-CSBGA (10x10)
Number of LABs/CLBs: 1000
Total RAM Bits: 737280
Part Status: Active
Number of I/O: 112
Description: IC FPGA 112 I/O 238CSBGA
Packaging: Tray
Package / Case: 238-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 12800
Supplier Device Package: 238-CSBGA (10x10)
Number of LABs/CLBs: 1000
Total RAM Bits: 737280
Part Status: Active
Number of I/O: 112
товар відсутній
| XC7S50-1FTGB196Q |
|
Виробник: AMD
Description: IC FPGA 100 I/O 196CSBGA
Packaging: Tray
Package / Case: 196-LBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 52160
Supplier Device Package: 196-CSBGA (15x15)
Number of LABs/CLBs: 4075
Total RAM Bits: 2764800
Part Status: Active
Number of I/O: 100
DigiKey Programmable: Not Verified
Description: IC FPGA 100 I/O 196CSBGA
Packaging: Tray
Package / Case: 196-LBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 52160
Supplier Device Package: 196-CSBGA (15x15)
Number of LABs/CLBs: 4075
Total RAM Bits: 2764800
Part Status: Active
Number of I/O: 100
DigiKey Programmable: Not Verified
товар відсутній
| XC7S25-1FTGB196Q |
|
Виробник: AMD
Description: IC FPGA 100 I/O 196CSBGA
Packaging: Tray
Package / Case: 196-LBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 23360
Supplier Device Package: 196-CSBGA (15x15)
Number of LABs/CLBs: 1825
Total RAM Bits: 1658880
Part Status: Active
Number of I/O: 100
DigiKey Programmable: Not Verified
Description: IC FPGA 100 I/O 196CSBGA
Packaging: Tray
Package / Case: 196-LBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 23360
Supplier Device Package: 196-CSBGA (15x15)
Number of LABs/CLBs: 1825
Total RAM Bits: 1658880
Part Status: Active
Number of I/O: 100
DigiKey Programmable: Not Verified
товар відсутній
| A-U50DD-P00G-ES3-G |
|
Виробник: AMD
Description: BOARD DCAB ALVEO U50 NET PASSIVE
Packaging: Box
Power (Watts): 75W
Memory Size: 8GB
Interface: PCI Express
Operating Temperature: 0°C ~ 50°C
Bandwidth: 201GB/s
Cooling Type: Heat Sink
LUTs: 872k
Description: BOARD DCAB ALVEO U50 NET PASSIVE
Packaging: Box
Power (Watts): 75W
Memory Size: 8GB
Interface: PCI Express
Operating Temperature: 0°C ~ 50°C
Bandwidth: 201GB/s
Cooling Type: Heat Sink
LUTs: 872k
товар відсутній
| XC95288XV-7FG256C |
|
Виробник: AMD
Description: IC CPLD 288MC 7.5NS 256FBGA
Packaging: Tray
Package / Case: 256-BGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Gates: 6400
Number of Macrocells: 288
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 7.5 ns
Supplier Device Package: 256-FBGA (17x17)
Number of Logic Elements/Blocks: 16
Voltage Supply - Internal: 2.37V ~ 2.62V
Number of I/O: 192
DigiKey Programmable: Not Verified
Description: IC CPLD 288MC 7.5NS 256FBGA
Packaging: Tray
Package / Case: 256-BGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Gates: 6400
Number of Macrocells: 288
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 7.5 ns
Supplier Device Package: 256-FBGA (17x17)
Number of Logic Elements/Blocks: 16
Voltage Supply - Internal: 2.37V ~ 2.62V
Number of I/O: 192
DigiKey Programmable: Not Verified
на замовлення 615 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 36+ | 566.52 грн |
| XC2C64A-7PCG44I |
|
Виробник: AMD
Description: FLASH PLD, 7.5NS, 64-CELL PQCC44
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Description: FLASH PLD, 7.5NS, 64-CELL PQCC44
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
товар відсутній
| XC2C64A-7PC44C |
|
Виробник: AMD
Description: FLASH PLD, 7.5NS, 64-CELL PQCC44
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Description: FLASH PLD, 7.5NS, 64-CELL PQCC44
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
товар відсутній
| XC95144XV-5CS144C |
|
Виробник: AMD
Description: FLASH PLD, 5NS, 144-CELL PBGA144
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Description: FLASH PLD, 5NS, 144-CELL PBGA144
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
на замовлення 1093 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 21+ | 958.99 грн |
| XC95144XV-7CS144C |
|
Виробник: AMD
Description: FLASH PLD, 7.5NS, 144-CELL
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Description: FLASH PLD, 7.5NS, 144-CELL
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
на замовлення 1459 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 31+ | 641.99 грн |
| XC2C64A-7PCG44C |
|
Виробник: AMD
Description: FLASH PLD, 7.5NS, 64-CELL PQCC44
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Description: FLASH PLD, 7.5NS, 64-CELL PQCC44
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
товар відсутній
| EK-U1-ZCU216-ES1-G |
|
Виробник: AMD
Description: ZYNQ US+ RFSOC ZCU216 ES1 EVK
Packaging: Box
For Use With/Related Products: XCZU49DR
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Power Supply, Accessories
Platform: Zynq UltraScale+ RFSoC ZCU216 ES1
Description: ZYNQ US+ RFSOC ZCU216 ES1 EVK
Packaging: Box
For Use With/Related Products: XCZU49DR
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Power Supply, Accessories
Platform: Zynq UltraScale+ RFSoC ZCU216 ES1
товар відсутній
| XCVU47P-2FSVH2892E |
|
Виробник: AMD
Description: IC FPGA 624 I/O 2892FCBGA
Packaging: Tray
Package / Case: 2892-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 2851800
Supplier Device Package: 2892-FCBGA (55x55)
Number of LABs/CLBs: 162960
Total RAM Bits: 74344038
Number of I/O: 624
DigiKey Programmable: Not Verified
Description: IC FPGA 624 I/O 2892FCBGA
Packaging: Tray
Package / Case: 2892-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 2851800
Supplier Device Package: 2892-FCBGA (55x55)
Number of LABs/CLBs: 162960
Total RAM Bits: 74344038
Number of I/O: 624
DigiKey Programmable: Not Verified
товар відсутній
| XCVU47P-L2FSVH2892E |
|
Виробник: AMD
Description: IC FPGA 624 I/O 2892FCBGA
Packaging: Tray
Package / Case: 2892-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.698V ~ 0.742V
Number of Logic Elements/Cells: 2851800
Supplier Device Package: 2892-FCBGA (55x55)
Number of LABs/CLBs: 162960
Total RAM Bits: 74344038
Number of I/O: 624
DigiKey Programmable: Not Verified
Description: IC FPGA 624 I/O 2892FCBGA
Packaging: Tray
Package / Case: 2892-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.698V ~ 0.742V
Number of Logic Elements/Cells: 2851800
Supplier Device Package: 2892-FCBGA (55x55)
Number of LABs/CLBs: 162960
Total RAM Bits: 74344038
Number of I/O: 624
DigiKey Programmable: Not Verified
товар відсутній
| XCVU47P-3FSVH2892E |
|
Виробник: AMD
Description: IC FPGA 624 I/O 2892FCBGA
Packaging: Tray
Package / Case: 2892-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 2851800
Supplier Device Package: 2892-FCBGA (55x55)
Number of LABs/CLBs: 162960
Total RAM Bits: 74344038
Number of I/O: 624
DigiKey Programmable: Not Verified
Description: IC FPGA 624 I/O 2892FCBGA
Packaging: Tray
Package / Case: 2892-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 2851800
Supplier Device Package: 2892-FCBGA (55x55)
Number of LABs/CLBs: 162960
Total RAM Bits: 74344038
Number of I/O: 624
DigiKey Programmable: Not Verified
товар відсутній
| LMS-EMBD-SDSOC |
Виробник: AMD
Description: TRAINING CREDIT SDSOC DEV METHOD
Packaging: Electronic Delivery
Type: License
Media Delivery Type: Electronically Delivered
Part Status: Active
Description: TRAINING CREDIT SDSOC DEV METHOD
Packaging: Electronic Delivery
Type: License
Media Delivery Type: Electronically Delivered
Part Status: Active
товар відсутній
| XCZU4EG-L1SFVC784I |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
товар відсутній
| XCZU4EG-L1FBVB900I |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
товар відсутній
| XCZU6EG-L1FFVC900I |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
товар відсутній
| XCZU6EG-L1FFVB1156I |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
товар відсутній
| XCZU7EG-L1FFVC1156I |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
товар відсутній
| XCZU11EG-L1FFVC1156I |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 653K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 653K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
товар відсутній
| XCZU15EG-L1FFVB1156I |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 747K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 747K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Part Status: Active
товар відсутній
| XCZU19EG-L1FFVB1517I |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 1517FCBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1517-FCBGA (40x40)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 1517FCBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1517-FCBGA (40x40)
Architecture: MCU, FPGA
Part Status: Active
товар відсутній
| XCZU19EG-L1FFVC1760I |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 1760FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 1760FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
товар відсутній
| XCVU160-2FLGB2104E |
|
Виробник: AMD
Description: IC FPGA 702 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.922V ~ 0.979V
Number of Logic Elements/Cells: 2026500
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of LABs/CLBs: 115800
Total RAM Bits: 130969600
Number of I/O: 702
DigiKey Programmable: Not Verified
Description: IC FPGA 702 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.922V ~ 0.979V
Number of Logic Elements/Cells: 2026500
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of LABs/CLBs: 115800
Total RAM Bits: 130969600
Number of I/O: 702
DigiKey Programmable: Not Verified
товар відсутній
| XCVU160-2FLGB2104I |
|
Виробник: AMD
Description: IC FPGA 702 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.922V ~ 0.979V
Number of Logic Elements/Cells: 2026500
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of LABs/CLBs: 115800
Total RAM Bits: 130969600
Number of I/O: 702
DigiKey Programmable: Not Verified
Description: IC FPGA 702 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.922V ~ 0.979V
Number of Logic Elements/Cells: 2026500
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of LABs/CLBs: 115800
Total RAM Bits: 130969600
Number of I/O: 702
DigiKey Programmable: Not Verified
товар відсутній
| XCKU3P-1FFVA676E |
|
Виробник: AMD
Description: IC FPGA 256 I/O 676FCBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 355950
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 20340
Total RAM Bits: 31641600
Number of I/O: 256
DigiKey Programmable: Not Verified
Description: IC FPGA 256 I/O 676FCBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 355950
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 20340
Total RAM Bits: 31641600
Number of I/O: 256
DigiKey Programmable: Not Verified
товар відсутній
| XCKU3P-2FFVA676E |
|
Виробник: AMD
Description: IC FPGA 256 I/O 676FCBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 355950
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 20340
Total RAM Bits: 31641600
Number of I/O: 256
DigiKey Programmable: Not Verified
Description: IC FPGA 256 I/O 676FCBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 355950
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 20340
Total RAM Bits: 31641600
Number of I/O: 256
DigiKey Programmable: Not Verified
товар відсутній
| XCKU3P-2FFVA676I |
|
Виробник: AMD
Description: IC FPGA 256 I/O 676FCBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 355950
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 20340
Total RAM Bits: 31641600
Number of I/O: 256
DigiKey Programmable: Not Verified
Description: IC FPGA 256 I/O 676FCBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 355950
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 20340
Total RAM Bits: 31641600
Number of I/O: 256
DigiKey Programmable: Not Verified
товар відсутній
| XC3164A-09TQ144C |
|
Виробник: AMD
Description: FPGA, 224 CLBS, 3500 GATES
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Number of Gates: 4500
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 4.25V ~ 5.25V
Number of Logic Elements/Cells: 224
Supplier Device Package: 144-TQFP (20x20)
Number of LABs/CLBs: 224
Total RAM Bits: 46064
Number of I/O: 120
Description: FPGA, 224 CLBS, 3500 GATES
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Number of Gates: 4500
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 4.25V ~ 5.25V
Number of Logic Elements/Cells: 224
Supplier Device Package: 144-TQFP (20x20)
Number of LABs/CLBs: 224
Total RAM Bits: 46064
Number of I/O: 120
на замовлення 57 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 13+ | 1552 грн |
| XC6SLX100-2FGG484C |
|
Виробник: AMD
Description: IC FPGA 326 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 101261
Supplier Device Package: 484-FBGA (23x23)
Number of LABs/CLBs: 7911
Total RAM Bits: 4939776
Part Status: Active
Number of I/O: 326
DigiKey Programmable: Not Verified
Description: IC FPGA 326 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 101261
Supplier Device Package: 484-FBGA (23x23)
Number of LABs/CLBs: 7911
Total RAM Bits: 4939776
Part Status: Active
Number of I/O: 326
DigiKey Programmable: Not Verified
на замовлення 120 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 14798.4 грн |
| EFR-DI-3RD-PARTY-LIC |
Виробник: AMD
Description: IP R 3RD PARTY PROVIDER LIC GEN
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: License
License Length: 1 Year Renewal
Media Delivery Type: Electronically Delivered
Description: IP R 3RD PARTY PROVIDER LIC GEN
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: License
License Length: 1 Year Renewal
Media Delivery Type: Electronically Delivered
товар відсутній
| XC9572XL-7PC44I |
|
Виробник: AMD
Description: FLASH PLD, 7.5NS, 72-CELL PQCC44
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Description: FLASH PLD, 7.5NS, 72-CELL PQCC44
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
товар відсутній
| XCS20XL-4CS144C |
|
Виробник: AMD
Description: IC FPGA 113 I/O 144CSBGA
Packaging: Bulk
Package / Case: 144-TFBGA, CSPBGA
Mounting Type: Surface Mount
Number of Gates: 20000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 950
Supplier Device Package: 144-LCSBGA (12x12)
Number of LABs/CLBs: 400
Total RAM Bits: 12800
Part Status: Obsolete
Number of I/O: 113
Description: IC FPGA 113 I/O 144CSBGA
Packaging: Bulk
Package / Case: 144-TFBGA, CSPBGA
Mounting Type: Surface Mount
Number of Gates: 20000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 950
Supplier Device Package: 144-LCSBGA (12x12)
Number of LABs/CLBs: 400
Total RAM Bits: 12800
Part Status: Obsolete
Number of I/O: 113
на замовлення 617 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 36+ | 570.54 грн |
| XCR3032XL-10VQ44Q0789 |
|
Виробник: AMD
Description: EE PLD, 10NS, CMOS
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Description: EE PLD, 10NS, CMOS
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
товар відсутній
| XCR3032XL-10VQ44Q |
|
Виробник: AMD
Description: EE PLD, 10NS, CMOS, PQFP44
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Description: EE PLD, 10NS, CMOS, PQFP44
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
товар відсутній
| EK-U1-ZCU102-G-ED |
|
Виробник: AMD
Description: KIT EVAL ZYNQUS+ MPSOC ZCU102 ED
Packaging: Box
For Use With/Related Products: XCZU9EG
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Power Supply, Accessories
Platform: Zynq UltraScale+ MPSoC ZCU102 Encryption Disabled
Part Status: Active
Description: KIT EVAL ZYNQUS+ MPSOC ZCU102 ED
Packaging: Box
For Use With/Related Products: XCZU9EG
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Power Supply, Accessories
Platform: Zynq UltraScale+ MPSoC ZCU102 Encryption Disabled
Part Status: Active
на замовлення 33 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 262270.84 грн |
| EK-U1-ZCU102-G-J |
|
Виробник: AMD
Description: XILINX ZYNQ ULTRASCALE+ MPSOC ZC
Packaging: Box
For Use With/Related Products: XCZU9EG
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Accessories - Power Supply Not Included -
Platform: Zynq UltraScale+ MPSoC ZCU102 Japan
Part Status: Active
Description: XILINX ZYNQ ULTRASCALE+ MPSOC ZC
Packaging: Box
For Use With/Related Products: XCZU9EG
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Accessories - Power Supply Not Included -
Platform: Zynq UltraScale+ MPSoC ZCU102 Japan
Part Status: Active
товар відсутній
| EF-DI-25GBASE-KR-RLL |
Виробник: AMD
Description: LICENSE LTD REDISTRIBUTION 25GBA
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: License
License Length: 1 Year
License - User Details: Redistribution Limited
Media Delivery Type: Electronically Delivered
Part Status: Active
Description: LICENSE LTD REDISTRIBUTION 25GBA
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: License
License Length: 1 Year
License - User Details: Redistribution Limited
Media Delivery Type: Electronically Delivered
Part Status: Active
товар відсутній
| EF-DI-25GEMAC-RLL |
Виробник: AMD
Description: LICENSE LTD REDISTRIBUTION 25GEM
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: License
License Length: 1 Year
License - User Details: Redistribution Limited
Media Delivery Type: Electronically Delivered
Part Status: Active
Description: LICENSE LTD REDISTRIBUTION 25GEM
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: License
License Length: 1 Year
License - User Details: Redistribution Limited
Media Delivery Type: Electronically Delivered
Part Status: Active
товар відсутній
| EFR-DI-25GBASE-KR-RLL |
|
Виробник: AMD
Description: LICENSE LTD REDISTRIBUTION 25GBA
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: License
License Length: 1 Year Renewal
License - User Details: Redistribution Limited
Media Delivery Type: Electronically Delivered
Part Status: Active
Description: LICENSE LTD REDISTRIBUTION 25GBA
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: License
License Length: 1 Year Renewal
License - User Details: Redistribution Limited
Media Delivery Type: Electronically Delivered
Part Status: Active
товар відсутній
| EFR-DI-25GEMAC-RLL |
|
Виробник: AMD
Description: LICENSE LTD REDISTRIBUTION 25GEM
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: License
License Length: 1 Year Renewal
License - User Details: Redistribution Limited
Media Delivery Type: Electronically Delivered
Part Status: Active
Description: LICENSE LTD REDISTRIBUTION 25GEM
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: License
License Length: 1 Year Renewal
License - User Details: Redistribution Limited
Media Delivery Type: Electronically Delivered
Part Status: Active
товар відсутній
| XCV400-4BG560I |
|
Виробник: AMD
Description: IC FPGA 404 I/O 560MBGA
Packaging: Bulk
Package / Case: 560-LBGA Exposed Pad, Metal
Mounting Type: Surface Mount
Number of Gates: 468252
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 2.375V ~ 2.625V
Number of Logic Elements/Cells: 10800
Supplier Device Package: 560-MBGA (42.5x42.5)
Number of LABs/CLBs: 2400
Total RAM Bits: 81920
Part Status: Obsolete
Number of I/O: 404
DigiKey Programmable: Not Verified
Description: IC FPGA 404 I/O 560MBGA
Packaging: Bulk
Package / Case: 560-LBGA Exposed Pad, Metal
Mounting Type: Surface Mount
Number of Gates: 468252
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 2.375V ~ 2.625V
Number of Logic Elements/Cells: 10800
Supplier Device Package: 560-MBGA (42.5x42.5)
Number of LABs/CLBs: 2400
Total RAM Bits: 81920
Part Status: Obsolete
Number of I/O: 404
DigiKey Programmable: Not Verified
на замовлення 2 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 36809.3 грн |
| XC4036XLA-09BG432C |
|
Виробник: AMD
Description: FPGA, 1296 CLBS, 22000 GATES
Packaging: Bulk
Package / Case: 432-LBGA Exposed Pad, Metal
Mounting Type: Surface Mount
Number of Gates: 22000
Supplier Device Package: 432-MBGA (40x40)
Number of LABs/CLBs: 1296
DigiKey Programmable: Not Verified
Description: FPGA, 1296 CLBS, 22000 GATES
Packaging: Bulk
Package / Case: 432-LBGA Exposed Pad, Metal
Mounting Type: Surface Mount
Number of Gates: 22000
Supplier Device Package: 432-MBGA (40x40)
Number of LABs/CLBs: 1296
DigiKey Programmable: Not Verified
на замовлення 16 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 11184.27 грн |
| XCV400E-7BG432C0773 |
|
на замовлення 70 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 28498.05 грн |
| EK-U1-ZCU208-ES1-G |
|
Виробник: AMD
Description: ZYNQ US+ RFSOC ZCU208 ES1 EVK
Packaging: Box
For Use With/Related Products: XCZU48DR
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Power Supply, Accessories
Platform: Zynq UltraScale+ RFSoC ZCU208 ES1
Description: ZYNQ US+ RFSOC ZCU208 ES1 EVK
Packaging: Box
For Use With/Related Products: XCZU48DR
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Power Supply, Accessories
Platform: Zynq UltraScale+ RFSoC ZCU208 ES1
товар відсутній
| XCF16PVOG48C |
|
Виробник: AMD
Description: IC PROM SRL 1.8V 16M GATE 48TSOP
Packaging: Tray
Package / Case: 48-TFSOP (0.724", 18.40mm Width)
Mounting Type: Surface Mount
Memory Size: 16MB
Programmable Type: In System Programmable
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.65V ~ 2V
Supplier Device Package: 48-TSOP
DigiKey Programmable: Not Verified
Description: IC PROM SRL 1.8V 16M GATE 48TSOP
Packaging: Tray
Package / Case: 48-TFSOP (0.724", 18.40mm Width)
Mounting Type: Surface Mount
Memory Size: 16MB
Programmable Type: In System Programmable
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.65V ~ 2V
Supplier Device Package: 48-TSOP
DigiKey Programmable: Not Verified
товар відсутній
| XC2C32A-4PCG44C |
|
Виробник: AMD
Description: FLASH PLD, 4NS, 32-CELL PQCC44
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Description: FLASH PLD, 4NS, 32-CELL PQCC44
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
товар відсутній
| XC2C32A-4PC44C |
|
Виробник: AMD
Description: FLASH PLD, 4NS, 32-CELL PQCC44
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Description: FLASH PLD, 4NS, 32-CELL PQCC44
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
товар відсутній