| Фото | Назва | Виробник | Інформація |
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XC3S500E-4CPG132I | AMD |
 Description: IC FPGA 92 I/O 132CSBGAPackaging: Tray Package / Case: 132-TFBGA, CSPBGA Mounting Type: Surface Mount Number of Gates: 500000 Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 10476 Supplier Device Package: 132-CSPBGA (8x8) Number of LABs/CLBs: 1164 Total RAM Bits: 368640 Number of I/O: 92 DigiKey Programmable: Not Verified |
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XC3S500E-5CPG132C | AMD |
Description: IC FPGA 92 I/O 132CSBGA Packaging: Tray Package / Case: 132-TFBGA, CSPBGA Mounting Type: Surface Mount Number of Gates: 500000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 10476 Supplier Device Package: 132-CSPBGA (8x8) Number of LABs/CLBs: 1164 Total RAM Bits: 368640 Number of I/O: 92 DigiKey Programmable: Not Verified |
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XC3S500E-4CP132I | AMD |
Description: IC FPGA 92 I/O 132CSBGA Packaging: Bulk Package / Case: 132-TFBGA, CSPBGA Mounting Type: Surface Mount Number of Gates: 500000 Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 10476 Supplier Device Package: 132-CSPBGA (8x8) Number of LABs/CLBs: 1164 Total RAM Bits: 368640 Number of I/O: 92 DigiKey Programmable: Not Verified |
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XC3S500E-4FTG256I | AMD |
Description: IC FPGA 190 I/O 256FTBGA Packaging: Tray Package / Case: 256-LBGA Mounting Type: Surface Mount Number of Gates: 500000 Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 10476 Supplier Device Package: 256-FTBGA (17x17) Number of LABs/CLBs: 1164 Total RAM Bits: 368640 Number of I/O: 190 DigiKey Programmable: Not Verified |
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XC3S500E-4FT256C | AMD |
Description: IC FPGA 190 I/O 256FTBGA Packaging: Bulk Package / Case: 256-LBGA Mounting Type: Surface Mount Number of Gates: 500000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 10476 Supplier Device Package: 256-FTBGA (17x17) Number of LABs/CLBs: 1164 Total RAM Bits: 368640 Number of I/O: 190 DigiKey Programmable: Not Verified |
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XC3S500E-5FGG320C | AMD |
Description: IC FPGA 232 I/O 320FBGA Packaging: Tray Package / Case: 320-BGA Mounting Type: Surface Mount Number of Gates: 500000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 10476 Supplier Device Package: 320-FBGA (19x19) Number of LABs/CLBs: 1164 Total RAM Bits: 368640 Number of I/O: 232 DigiKey Programmable: Not Verified |
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XC3S500E-4FT256I | AMD |
Description: IC FPGA 190 I/O 256FTBGA Packaging: Tray Package / Case: 256-LBGA Mounting Type: Surface Mount Number of Gates: 500000 Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 10476 Supplier Device Package: 256-FTBGA (17x17) Number of LABs/CLBs: 1164 Total RAM Bits: 368640 Number of I/O: 190 DigiKey Programmable: Not Verified |
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XC3S500E-4FG320C | AMD |
Description: IC FPGA 232 I/O 320FBGA Packaging: Bulk Package / Case: 320-BGA Mounting Type: Surface Mount Number of Gates: 500000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 10476 Supplier Device Package: 320-FBGA (19x19) Number of LABs/CLBs: 1164 Total RAM Bits: 368640 Number of I/O: 232 DigiKey Programmable: Not Verified |
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XC3S500E-4FG320I | AMD |
Description: IC FPGA 232 I/O 320FBGA Packaging: Tray Package / Case: 320-BGA Mounting Type: Surface Mount Number of Gates: 500000 Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 10476 Supplier Device Package: 320-FBGA (19x19) Number of LABs/CLBs: 1164 Total RAM Bits: 368640 Number of I/O: 232 DigiKey Programmable: Not Verified |
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XC3S500E-5PQG208C | AMD |
Description: IC FPGA 158 I/O 208QFP Packaging: Tray Package / Case: 208-BFQFP Mounting Type: Surface Mount Number of Gates: 500000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 10476 Supplier Device Package: 208-PQFP (28x28) Number of LABs/CLBs: 1164 Total RAM Bits: 368640 Number of I/O: 158 DigiKey Programmable: Not Verified |
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XC3S500E-5PQ208C | AMD |
Description: IC FPGA 158 I/O 208QFP Packaging: Tray Package / Case: 208-BFQFP Mounting Type: Surface Mount Number of Gates: 500000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 10476 Supplier Device Package: 208-PQFP (28x28) Number of LABs/CLBs: 1164 Total RAM Bits: 368640 Number of I/O: 158 DigiKey Programmable: Not Verified |
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XC4VLX60-10FF1148C | AMD |
Description: IC FPGA 640 I/O 1148FCBGA Packaging: Bulk Package / Case: 1148-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 59904 Supplier Device Package: 1148-FCPBGA (35x35) Number of LABs/CLBs: 6656 Total RAM Bits: 2949120 Number of I/O: 640 DigiKey Programmable: Not Verified |
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XC7A12T-1CSG325I | AMD |
Description: IC FPGA 150 I/O 324CSBGA Packaging: Tray Package / Case: 324-LFBGA, CSPBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.95V ~ 1.05V Number of Logic Elements/Cells: 12800 Supplier Device Package: 324-CSPBGA (15x15) Number of LABs/CLBs: 1000 Total RAM Bits: 737280 Number of I/O: 150 DigiKey Programmable: Not Verified |
на замовлення 1109 шт: термін постачання 21-31 дні (днів) |
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HW-MUSB-3090136 | AMD |
Description: CABLE MICRO USB ALVEO U200/U250 Packaging: Bag Accessory Type: Cable Assembly |
на замовлення 87 шт: термін постачання 21-31 дні (днів) |
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XC3S400-5TQG144C | AMD |
Description: IC FPGA 97 I/O 144TQFP Packaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Number of Gates: 400000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 8064 Supplier Device Package: 144-TQFP (20x20) Number of LABs/CLBs: 896 Total RAM Bits: 294912 Number of I/O: 97 DigiKey Programmable: Not Verified |
на замовлення 6 шт: термін постачання 21-31 дні (днів) |
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XC3S400-4TQG144I | AMD |
Description: IC FPGA 97 I/O 144TQFP Packaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Number of Gates: 400000 Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 8064 Supplier Device Package: 144-TQFP (20x20) Number of LABs/CLBs: 896 Total RAM Bits: 294912 Number of I/O: 97 DigiKey Programmable: Not Verified |
на замовлення 6 шт: термін постачання 21-31 дні (днів) |
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XC3S400A-4FGG320I | AMD |
Description: IC FPGA 251 I/O 320FBGA Packaging: Tray Package / Case: 320-BGA Mounting Type: Surface Mount Number of Gates: 400000 Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 8064 Supplier Device Package: 320-FBGA (19x19) Number of LABs/CLBs: 896 Total RAM Bits: 368640 Number of I/O: 251 DigiKey Programmable: Not Verified |
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XC3S4000-4FGG676C | AMD |
Description: IC FPGA 489 I/O 676FBGA Packaging: Tray Package / Case: 676-BGA Mounting Type: Surface Mount Number of Gates: 4000000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 62208 Supplier Device Package: 676-FBGA (27x27) Number of LABs/CLBs: 6912 Total RAM Bits: 1769472 Number of I/O: 489 DigiKey Programmable: Not Verified |
на замовлення 3 шт: термін постачання 21-31 дні (днів) |
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XC3S4000-5FGG676C | AMD |
Description: IC FPGA 489 I/O 676FBGA Packaging: Tray Package / Case: 676-BGA Mounting Type: Surface Mount Number of Gates: 4000000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 62208 Supplier Device Package: 676-FBGA (27x27) Number of LABs/CLBs: 6912 Total RAM Bits: 1769472 Number of I/O: 489 DigiKey Programmable: Not Verified |
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XC3S4000-4FG676C | AMD |
Description: IC FPGA 489 I/O 676FCBGA Packaging: Bulk Package / Case: 676-BGA Mounting Type: Surface Mount Number of Gates: 4000000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 62208 Supplier Device Package: 676-FBGA (27x27) Number of LABs/CLBs: 6912 Total RAM Bits: 1769472 Number of I/O: 489 DigiKey Programmable: Not Verified |
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XC3S4000-4FGG900C | AMD |
Description: IC FPGA 633 I/O 900FBGA Packaging: Tray Package / Case: 900-BBGA Mounting Type: Surface Mount Number of Gates: 4000000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 62208 Supplier Device Package: 900-FBGA (31x31) Number of LABs/CLBs: 6912 Total RAM Bits: 1769472 Number of I/O: 633 DigiKey Programmable: Not Verified |
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XC3S4000-4FG676I | AMD |
Description: IC FPGA 489 I/O 676FCBGA Packaging: Tray Package / Case: 676-BGA Mounting Type: Surface Mount Number of Gates: 4000000 Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 62208 Supplier Device Package: 676-FBGA (27x27) Number of LABs/CLBs: 6912 Total RAM Bits: 1769472 Number of I/O: 489 DigiKey Programmable: Not Verified |
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XC3S4000-5FG676C | AMD |
Description: IC FPGA 489 I/O 676FCBGA Packaging: Bulk Package / Case: 676-BGA Mounting Type: Surface Mount Number of Gates: 4000000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 62208 Supplier Device Package: 676-FBGA (27x27) Number of LABs/CLBs: 6912 Total RAM Bits: 1769472 Number of I/O: 489 DigiKey Programmable: Not Verified |
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XC3S4000-4FG900C | AMD |
Description: IC FPGA 633 I/O 900FBGA Packaging: Bulk Package / Case: 900-BBGA Mounting Type: Surface Mount Number of Gates: 4000000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 62208 Supplier Device Package: 900-FBGA (31x31) Number of LABs/CLBs: 6912 Total RAM Bits: 1769472 Number of I/O: 633 DigiKey Programmable: Not Verified |
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XC3S4000-4FG900I | AMD |
Description: IC FPGA 633 I/O 900FBGA Packaging: Bulk Package / Case: 900-BBGA Mounting Type: Surface Mount Number of Gates: 4000000 Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 62208 Supplier Device Package: 900-FBGA (31x31) Number of LABs/CLBs: 6912 Total RAM Bits: 1769472 Number of I/O: 633 DigiKey Programmable: Not Verified |
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| XC4VLX40-10FF668C | AMD |
Description: IC FPGA 448 I/O 668FCBGA Packaging: Tray Package / Case: 668-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 41472 Supplier Device Package: 668-FCBGA (27x27) Number of LABs/CLBs: 4608 Total RAM Bits: 1769472 Number of I/O: 448 DigiKey Programmable: Not Verified |
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XC4VLX40-10FF1148C | AMD |
Description: IC FPGA 640 I/O 1148FCBGA Packaging: Bulk Package / Case: 1148-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 41472 Supplier Device Package: 1148-FCPBGA (35x35) Number of LABs/CLBs: 4608 Total RAM Bits: 1769472 Number of I/O: 640 DigiKey Programmable: Not Verified |
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| XAAU15P-1FFVB676Q | AMD |
Description: IC FPGA ARTIXUP AUTO 676FBGA Packaging: Tray Package / Case: 676-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TJ) Voltage - Supply: 0.825V ~ 0.876V Number of Logic Elements/Cells: 170100 Supplier Device Package: 676-FCBGA (27x27) Number of LABs/CLBs: 9720 Total RAM Bits: 5347738 Number of I/O: 228 |
на замовлення 1 шт: термін постачання 21-31 дні (днів) |
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| XAAU10P-1FFVB676I | AMD |
Description: IC FPGA ARTIXUP AUTO 676FBGA Packaging: Tray |
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| XAAU10P-L1SBVB484I | AMD |
Description: IC FPGA ARTIXUP AUTO 484BGA Packaging: Tray |
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| XAAU10P-L1FFVB676I | AMD |
Description: IC FPGA ARTIXUP AUTO 676FBGA Packaging: Tray |
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| XAAU15P-1SBVB484I | AMD |
Description: IC FPGA ARTIXUP AUTO 484BGA Packaging: Tray |
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| XAAU15P-1FFVB676I | AMD |
Description: IC FPGA ARTIXUP AUTO 676FBGA Packaging: Tray |
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| XAAU15P-L1FFVB676I | AMD |
Description: IC FPGA ARTIXUP AUTO 676FBGA Packaging: Tray |
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| XAAU10P-1FFVB676Q | AMD |
Description: IC FPGA ARTIXUP AUTO 676FBGA Packaging: Tray |
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XC3SD1800A-4CSG484C | AMD |
Description: IC FPGA 309 I/O 484CSBGA Packaging: Tray Package / Case: 484-FBGA, CSPBGA Mounting Type: Surface Mount Number of Gates: 1800000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 37440 Supplier Device Package: 484-CSPBGA (19x19) Number of LABs/CLBs: 4160 Total RAM Bits: 1548288 Number of I/O: 309 DigiKey Programmable: Not Verified |
на замовлення 4 шт: термін постачання 21-31 дні (днів) |
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XC3SD1800A-4FGG676C | AMD |
Description: IC FPGA 519 I/O 676FBGA Packaging: Tray Package / Case: 676-BGA Mounting Type: Surface Mount Number of Gates: 1800000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 37440 Supplier Device Package: 676-FBGA (27x27) Number of LABs/CLBs: 4160 Total RAM Bits: 1548288 Number of I/O: 519 DigiKey Programmable: Not Verified |
на замовлення 4 шт: термін постачання 21-31 дні (днів) |
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XC3SD1800A-4FGG676I | AMD |
Description: IC FPGA 519 I/O 676FBGA Packaging: Tray Package / Case: 676-BGA Mounting Type: Surface Mount Number of Gates: 1800000 Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 37440 Supplier Device Package: 676-FBGA (27x27) Number of LABs/CLBs: 4160 Total RAM Bits: 1548288 Number of I/O: 519 DigiKey Programmable: Not Verified |
на замовлення 3 шт: термін постачання 21-31 дні (днів) |
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XCAU15P-1FFVB676I | AMD |
Description: IC FPGA ARTIXUP 676BGA Packaging: Tray Package / Case: 676-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.698V ~ 0.742V Number of Logic Elements/Cells: 170100 Supplier Device Package: 676-FCBGA (27x27) Number of LABs/CLBs: 9720 Total RAM Bits: 5347738 Number of I/O: 228 DigiKey Programmable: Not Verified |
на замовлення 56 шт: термін постачання 21-31 дні (днів) |
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XCS30-4BG256C | AMD |
Description: IC FPGA 192 I/O 256BGA Packaging: Tray Package / Case: 256-BBGA Mounting Type: Surface Mount Number of Gates: 30000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 4.75V ~ 5.25V Number of Logic Elements/Cells: 1368 Supplier Device Package: 256-PBGA (27x27) Number of LABs/CLBs: 576 Total RAM Bits: 18432 Number of I/O: 192 DigiKey Programmable: Not Verified |
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XC7A200T-1SBG484C | AMD |
Description: IC FPGA 285 I/O 484FCBGA Packaging: Tray Package / Case: 484-FBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 0.95V ~ 1.05V Number of Logic Elements/Cells: 215360 Supplier Device Package: 484-FCBGA (19x19) Number of LABs/CLBs: 16825 Total RAM Bits: 13455360 Number of I/O: 285 DigiKey Programmable: Not Verified |
на замовлення 7 шт: термін постачання 21-31 дні (днів) |
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| XCVM1502-1MSENFVB1369 | AMD |
Description: IC VERSALPRIME ACAP FPGA 1369BGA Packaging: Tray Package / Case: 1369-BFBGA, FCBGA Speed: 600MHz, 1.3GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1369-FCBGA (35x35) Architecture: MPU, FPGA |
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| XCVM1502-1LSENFVB1369 | AMD |
Description: IC VERSALPRIME ACAP FPGA 1369BGA Packaging: Tray Package / Case: 1369-BFBGA, FCBGA Speed: 400MHz, 1GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1369-FCBGA (35x35) Architecture: MPU, FPGA |
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| XCVM1502-2MSENFVB1369 | AMD |
Description: IC VERSALPRIME ACAP FPGA 1369BGA Packaging: Tray Package / Case: 1369-BFBGA, FCBGA Speed: 600MHz, 1.4GHz RAM Size: 256KB Operating Temperature: 0°C ~ 110°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1369-FCBGA (35x35) Architecture: MPU, FPGA |
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| XCVM1502-1MSINFVB1369 | AMD |
Description: IC VERSALPRIME ACAP FPGA 1369BGA Packaging: Tray Package / Case: 1369-BFBGA, FCBGA Speed: 600MHz, 1.3GHz RAM Size: 256KB Operating Temperature: -40°C ~ 110°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1369-FCBGA (35x35) Architecture: MPU, FPGA |
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| XCVM1502-1LSINFVB1369 | AMD |
Description: IC VERSALPRIME ACAP FPGA 1369BGA Packaging: Tray Package / Case: 1369-BFBGA, FCBGA Speed: 400MHz, 1GHz RAM Size: 256KB Operating Temperature: -40°C ~ 110°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1369-FCBGA (35x35) Architecture: MPU, FPGA |
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| XCVM1502-1MLINFVB1369 | AMD |
Description: IC VERSALPRIME ACAP FPGA 1369BGA Packaging: Tray Package / Case: 1369-BFBGA, FCBGA Speed: 600MHz, 1.3GHz RAM Size: 256KB Operating Temperature: -40°C ~ 110°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1369-FCBGA (35x35) Architecture: MPU, FPGA |
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| XCVM1502-2MLENFVB1369 | AMD |
Description: IC VERSALPRIME ACAP FPGA 1369BGA Packaging: Tray Package / Case: 1369-BFBGA, FCBGA Speed: 600MHz, 1.4GHz RAM Size: 256KB Operating Temperature: 0°C ~ 110°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1369-FCBGA (35x35) Architecture: MPU, FPGA |
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| XCVM1502-2LSENFVB1369 | AMD |
Description: IC VERSALPRIME ACAP FPGA 1369BGA Packaging: Tray Package / Case: 1369-BFBGA, FCBGA Speed: 450MHz, 1.08GHz RAM Size: 256KB Operating Temperature: 0°C ~ 110°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1369-FCBGA (35x35) Architecture: MPU, FPGA |
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| XCVM1502-2MSINFVB1369 | AMD |
Description: IC VERSALPRIME ACAP FPGA 1369BGA Packaging: Tray Package / Case: 1369-BFBGA, FCBGA Speed: 600MHz, 1.4GHz RAM Size: 256KB Operating Temperature: -40°C ~ 110°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1369-FCBGA (35x35) Architecture: MPU, FPGA |
товар відсутній |
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| XCVM1502-1LLINFVB1369 | AMD |
Description: IC VERSALPRIME ACAP FPGA 1369BGA Packaging: Tray Package / Case: 1369-BFBGA, FCBGA Speed: 400MHz, 1GHz RAM Size: 256KB Operating Temperature: -40°C ~ 110°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1369-FCBGA (35x35) Architecture: MPU, FPGA |
товар відсутній |
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| XCVM1502-2LLENFVB1369 | AMD |
Description: IC VERSALPRIME ACAP FPGA 1369BGA Packaging: Tray Package / Case: 1369-BFBGA, FCBGA Speed: 450MHz, 1.08GHz RAM Size: 256KB Operating Temperature: 0°C ~ 110°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1369-FCBGA (35x35) Architecture: MPU, FPGA |
товар відсутній |
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| XCVM1502-2MLINFVB1369 | AMD |
Description: IC VERSALPRIME ACAP FPGA 1369BGA Packaging: Tray Package / Case: 1369-BFBGA, FCBGA Speed: 600MHz, 1.4GHz RAM Size: 256KB Operating Temperature: -40°C ~ 110°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1369-FCBGA (35x35) Architecture: MPU, FPGA |
товар відсутній |
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 |
XC7A15T-3CPG236E | AMD |
Description: IC FPGA 106 I/O 238CSBGA Packaging: Tray Package / Case: 238-LFBGA, CSPBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.95V ~ 1.05V Number of Logic Elements/Cells: 16640 Supplier Device Package: 238-CSBGA (10x10) Number of LABs/CLBs: 1300 Total RAM Bits: 921600 Number of I/O: 106 DigiKey Programmable: Not Verified |
товар відсутній |
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| EK-VMK180-G-J | AMD |
Description: EVAL VMK180 VERSAL PRIME NO PWR Packaging: Box For Use With/Related Products: XCVM1802 Type: FPGA + MCU/MPU SoC Contents: Board(s), Cable(s) - Power Supply Not Included - Platform: Versal Prime Adaptive SoC VMK180 Japan PCIe Card |
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 |
EK-VMK180-G-ED-J | AMD |
Description: EVAL VMK180 VERSAL PRIME NO PWR Packaging: Box For Use With/Related Products: XCVM1802 Type: FPGA + MCU/MPU SoC Contents: Board(s), Cable(s) - Power Supply Not Included - Platform: Versal Prime Adaptive SoC VMK180 Encryption Disabled Japan PCIe Card |
товар відсутній |
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 |
XC3S100E-4VQG100I | AMD |
Description: IC FPGA 66 I/O 100VQFP Packaging: Tray Package / Case: 100-TQFP Mounting Type: Surface Mount Number of Gates: 100000 Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 2160 Supplier Device Package: 100-VQFP (14x14) Number of LABs/CLBs: 240 Total RAM Bits: 73728 Number of I/O: 66 DigiKey Programmable: Not Verified |
товар відсутній |
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 |
XC3S100E-5VQG100C | AMD |
Description: IC FPGA 66 I/O 100VQFP Packaging: Tray Package / Case: 100-TQFP Mounting Type: Surface Mount Number of Gates: 100000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 2160 Supplier Device Package: 100-VQFP (14x14) Number of LABs/CLBs: 240 Total RAM Bits: 73728 Number of I/O: 66 DigiKey Programmable: Not Verified |
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XC3S100E-4CPG132C | AMD |
Description: IC FPGA 83 I/O 132CSBGA Packaging: Tray Package / Case: 132-TFBGA, CSPBGA Mounting Type: Surface Mount Number of Gates: 100000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 2160 Supplier Device Package: 132-CSPBGA (8x8) Number of LABs/CLBs: 240 Total RAM Bits: 73728 Number of I/O: 83 DigiKey Programmable: Not Verified |
товар відсутній |
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XC3S100E-4CPG132I | AMD |
Description: IC FPGA 83 I/O 132CSBGA Packaging: Tray Package / Case: 132-TFBGA, CSPBGA Mounting Type: Surface Mount Number of Gates: 100000 Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 2160 Supplier Device Package: 132-CSPBGA (8x8) Number of LABs/CLBs: 240 Total RAM Bits: 73728 Number of I/O: 83 DigiKey Programmable: Not Verified |
товар відсутній |
| XC3S500E-4CPG132I |
|
Виробник: AMD
Description: IC FPGA 92 I/O 132CSBGA
Packaging: Tray
Package / Case: 132-TFBGA, CSPBGA
Mounting Type: Surface Mount
Number of Gates: 500000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 10476
Supplier Device Package: 132-CSPBGA (8x8)
Number of LABs/CLBs: 1164
Total RAM Bits: 368640
Number of I/O: 92
DigiKey Programmable: Not Verified
Description: IC FPGA 92 I/O 132CSBGA
Packaging: Tray
Package / Case: 132-TFBGA, CSPBGA
Mounting Type: Surface Mount
Number of Gates: 500000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 10476
Supplier Device Package: 132-CSPBGA (8x8)
Number of LABs/CLBs: 1164
Total RAM Bits: 368640
Number of I/O: 92
DigiKey Programmable: Not Verified
товар відсутній
| XC3S500E-5CPG132C |
|
Виробник: AMD
Description: IC FPGA 92 I/O 132CSBGA
Packaging: Tray
Package / Case: 132-TFBGA, CSPBGA
Mounting Type: Surface Mount
Number of Gates: 500000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 10476
Supplier Device Package: 132-CSPBGA (8x8)
Number of LABs/CLBs: 1164
Total RAM Bits: 368640
Number of I/O: 92
DigiKey Programmable: Not Verified
Description: IC FPGA 92 I/O 132CSBGA
Packaging: Tray
Package / Case: 132-TFBGA, CSPBGA
Mounting Type: Surface Mount
Number of Gates: 500000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 10476
Supplier Device Package: 132-CSPBGA (8x8)
Number of LABs/CLBs: 1164
Total RAM Bits: 368640
Number of I/O: 92
DigiKey Programmable: Not Verified
товар відсутній
| XC3S500E-4CP132I |
|
Виробник: AMD
Description: IC FPGA 92 I/O 132CSBGA
Packaging: Bulk
Package / Case: 132-TFBGA, CSPBGA
Mounting Type: Surface Mount
Number of Gates: 500000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 10476
Supplier Device Package: 132-CSPBGA (8x8)
Number of LABs/CLBs: 1164
Total RAM Bits: 368640
Number of I/O: 92
DigiKey Programmable: Not Verified
Description: IC FPGA 92 I/O 132CSBGA
Packaging: Bulk
Package / Case: 132-TFBGA, CSPBGA
Mounting Type: Surface Mount
Number of Gates: 500000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 10476
Supplier Device Package: 132-CSPBGA (8x8)
Number of LABs/CLBs: 1164
Total RAM Bits: 368640
Number of I/O: 92
DigiKey Programmable: Not Verified
товар відсутній
| XC3S500E-4FTG256I |
|
Виробник: AMD
Description: IC FPGA 190 I/O 256FTBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Number of Gates: 500000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 10476
Supplier Device Package: 256-FTBGA (17x17)
Number of LABs/CLBs: 1164
Total RAM Bits: 368640
Number of I/O: 190
DigiKey Programmable: Not Verified
Description: IC FPGA 190 I/O 256FTBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Number of Gates: 500000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 10476
Supplier Device Package: 256-FTBGA (17x17)
Number of LABs/CLBs: 1164
Total RAM Bits: 368640
Number of I/O: 190
DigiKey Programmable: Not Verified
товар відсутній
| XC3S500E-4FT256C |
|
Виробник: AMD
Description: IC FPGA 190 I/O 256FTBGA
Packaging: Bulk
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Number of Gates: 500000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 10476
Supplier Device Package: 256-FTBGA (17x17)
Number of LABs/CLBs: 1164
Total RAM Bits: 368640
Number of I/O: 190
DigiKey Programmable: Not Verified
Description: IC FPGA 190 I/O 256FTBGA
Packaging: Bulk
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Number of Gates: 500000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 10476
Supplier Device Package: 256-FTBGA (17x17)
Number of LABs/CLBs: 1164
Total RAM Bits: 368640
Number of I/O: 190
DigiKey Programmable: Not Verified
товар відсутній
| XC3S500E-5FGG320C |
|
Виробник: AMD
Description: IC FPGA 232 I/O 320FBGA
Packaging: Tray
Package / Case: 320-BGA
Mounting Type: Surface Mount
Number of Gates: 500000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 10476
Supplier Device Package: 320-FBGA (19x19)
Number of LABs/CLBs: 1164
Total RAM Bits: 368640
Number of I/O: 232
DigiKey Programmable: Not Verified
Description: IC FPGA 232 I/O 320FBGA
Packaging: Tray
Package / Case: 320-BGA
Mounting Type: Surface Mount
Number of Gates: 500000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 10476
Supplier Device Package: 320-FBGA (19x19)
Number of LABs/CLBs: 1164
Total RAM Bits: 368640
Number of I/O: 232
DigiKey Programmable: Not Verified
товар відсутній
| XC3S500E-4FT256I |
|
Виробник: AMD
Description: IC FPGA 190 I/O 256FTBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Number of Gates: 500000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 10476
Supplier Device Package: 256-FTBGA (17x17)
Number of LABs/CLBs: 1164
Total RAM Bits: 368640
Number of I/O: 190
DigiKey Programmable: Not Verified
Description: IC FPGA 190 I/O 256FTBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Number of Gates: 500000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 10476
Supplier Device Package: 256-FTBGA (17x17)
Number of LABs/CLBs: 1164
Total RAM Bits: 368640
Number of I/O: 190
DigiKey Programmable: Not Verified
товар відсутній
| XC3S500E-4FG320C |
|
Виробник: AMD
Description: IC FPGA 232 I/O 320FBGA
Packaging: Bulk
Package / Case: 320-BGA
Mounting Type: Surface Mount
Number of Gates: 500000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 10476
Supplier Device Package: 320-FBGA (19x19)
Number of LABs/CLBs: 1164
Total RAM Bits: 368640
Number of I/O: 232
DigiKey Programmable: Not Verified
Description: IC FPGA 232 I/O 320FBGA
Packaging: Bulk
Package / Case: 320-BGA
Mounting Type: Surface Mount
Number of Gates: 500000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 10476
Supplier Device Package: 320-FBGA (19x19)
Number of LABs/CLBs: 1164
Total RAM Bits: 368640
Number of I/O: 232
DigiKey Programmable: Not Verified
товар відсутній
| XC3S500E-4FG320I |
|
Виробник: AMD
Description: IC FPGA 232 I/O 320FBGA
Packaging: Tray
Package / Case: 320-BGA
Mounting Type: Surface Mount
Number of Gates: 500000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 10476
Supplier Device Package: 320-FBGA (19x19)
Number of LABs/CLBs: 1164
Total RAM Bits: 368640
Number of I/O: 232
DigiKey Programmable: Not Verified
Description: IC FPGA 232 I/O 320FBGA
Packaging: Tray
Package / Case: 320-BGA
Mounting Type: Surface Mount
Number of Gates: 500000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 10476
Supplier Device Package: 320-FBGA (19x19)
Number of LABs/CLBs: 1164
Total RAM Bits: 368640
Number of I/O: 232
DigiKey Programmable: Not Verified
товар відсутній
| XC3S500E-5PQG208C |
|
Виробник: AMD
Description: IC FPGA 158 I/O 208QFP
Packaging: Tray
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Number of Gates: 500000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 10476
Supplier Device Package: 208-PQFP (28x28)
Number of LABs/CLBs: 1164
Total RAM Bits: 368640
Number of I/O: 158
DigiKey Programmable: Not Verified
Description: IC FPGA 158 I/O 208QFP
Packaging: Tray
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Number of Gates: 500000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 10476
Supplier Device Package: 208-PQFP (28x28)
Number of LABs/CLBs: 1164
Total RAM Bits: 368640
Number of I/O: 158
DigiKey Programmable: Not Verified
товар відсутній
| XC3S500E-5PQ208C |
|
Виробник: AMD
Description: IC FPGA 158 I/O 208QFP
Packaging: Tray
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Number of Gates: 500000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 10476
Supplier Device Package: 208-PQFP (28x28)
Number of LABs/CLBs: 1164
Total RAM Bits: 368640
Number of I/O: 158
DigiKey Programmable: Not Verified
Description: IC FPGA 158 I/O 208QFP
Packaging: Tray
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Number of Gates: 500000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 10476
Supplier Device Package: 208-PQFP (28x28)
Number of LABs/CLBs: 1164
Total RAM Bits: 368640
Number of I/O: 158
DigiKey Programmable: Not Verified
товар відсутній
| XC4VLX60-10FF1148C |
|
Виробник: AMD
Description: IC FPGA 640 I/O 1148FCBGA
Packaging: Bulk
Package / Case: 1148-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 59904
Supplier Device Package: 1148-FCPBGA (35x35)
Number of LABs/CLBs: 6656
Total RAM Bits: 2949120
Number of I/O: 640
DigiKey Programmable: Not Verified
Description: IC FPGA 640 I/O 1148FCBGA
Packaging: Bulk
Package / Case: 1148-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 59904
Supplier Device Package: 1148-FCPBGA (35x35)
Number of LABs/CLBs: 6656
Total RAM Bits: 2949120
Number of I/O: 640
DigiKey Programmable: Not Verified
товар відсутній
| XC7A12T-1CSG325I |
|
Виробник: AMD
Description: IC FPGA 150 I/O 324CSBGA
Packaging: Tray
Package / Case: 324-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 12800
Supplier Device Package: 324-CSPBGA (15x15)
Number of LABs/CLBs: 1000
Total RAM Bits: 737280
Number of I/O: 150
DigiKey Programmable: Not Verified
Description: IC FPGA 150 I/O 324CSBGA
Packaging: Tray
Package / Case: 324-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 12800
Supplier Device Package: 324-CSPBGA (15x15)
Number of LABs/CLBs: 1000
Total RAM Bits: 737280
Number of I/O: 150
DigiKey Programmable: Not Verified
на замовлення 1109 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 3146.57 грн |
| HW-MUSB-3090136 |
Виробник: AMD
Description: CABLE MICRO USB ALVEO U200/U250
Packaging: Bag
Accessory Type: Cable Assembly
Description: CABLE MICRO USB ALVEO U200/U250
Packaging: Bag
Accessory Type: Cable Assembly
на замовлення 87 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 868.78 грн |
| XC3S400-5TQG144C |
|
Виробник: AMD
Description: IC FPGA 97 I/O 144TQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Number of Gates: 400000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 8064
Supplier Device Package: 144-TQFP (20x20)
Number of LABs/CLBs: 896
Total RAM Bits: 294912
Number of I/O: 97
DigiKey Programmable: Not Verified
Description: IC FPGA 97 I/O 144TQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Number of Gates: 400000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 8064
Supplier Device Package: 144-TQFP (20x20)
Number of LABs/CLBs: 896
Total RAM Bits: 294912
Number of I/O: 97
DigiKey Programmable: Not Verified
на замовлення 6 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 4528.49 грн |
| XC3S400-4TQG144I |
|
Виробник: AMD
Description: IC FPGA 97 I/O 144TQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Number of Gates: 400000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 8064
Supplier Device Package: 144-TQFP (20x20)
Number of LABs/CLBs: 896
Total RAM Bits: 294912
Number of I/O: 97
DigiKey Programmable: Not Verified
Description: IC FPGA 97 I/O 144TQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Number of Gates: 400000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 8064
Supplier Device Package: 144-TQFP (20x20)
Number of LABs/CLBs: 896
Total RAM Bits: 294912
Number of I/O: 97
DigiKey Programmable: Not Verified
на замовлення 6 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 4528.49 грн |
| XC3S400A-4FGG320I |
|
Виробник: AMD
Description: IC FPGA 251 I/O 320FBGA
Packaging: Tray
Package / Case: 320-BGA
Mounting Type: Surface Mount
Number of Gates: 400000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 8064
Supplier Device Package: 320-FBGA (19x19)
Number of LABs/CLBs: 896
Total RAM Bits: 368640
Number of I/O: 251
DigiKey Programmable: Not Verified
Description: IC FPGA 251 I/O 320FBGA
Packaging: Tray
Package / Case: 320-BGA
Mounting Type: Surface Mount
Number of Gates: 400000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 8064
Supplier Device Package: 320-FBGA (19x19)
Number of LABs/CLBs: 896
Total RAM Bits: 368640
Number of I/O: 251
DigiKey Programmable: Not Verified
товар відсутній
| XC3S4000-4FGG676C |
|
Виробник: AMD
Description: IC FPGA 489 I/O 676FBGA
Packaging: Tray
Package / Case: 676-BGA
Mounting Type: Surface Mount
Number of Gates: 4000000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 62208
Supplier Device Package: 676-FBGA (27x27)
Number of LABs/CLBs: 6912
Total RAM Bits: 1769472
Number of I/O: 489
DigiKey Programmable: Not Verified
Description: IC FPGA 489 I/O 676FBGA
Packaging: Tray
Package / Case: 676-BGA
Mounting Type: Surface Mount
Number of Gates: 4000000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 62208
Supplier Device Package: 676-FBGA (27x27)
Number of LABs/CLBs: 6912
Total RAM Bits: 1769472
Number of I/O: 489
DigiKey Programmable: Not Verified
на замовлення 3 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 15378.63 грн |
| XC3S4000-5FGG676C |
|
Виробник: AMD
Description: IC FPGA 489 I/O 676FBGA
Packaging: Tray
Package / Case: 676-BGA
Mounting Type: Surface Mount
Number of Gates: 4000000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 62208
Supplier Device Package: 676-FBGA (27x27)
Number of LABs/CLBs: 6912
Total RAM Bits: 1769472
Number of I/O: 489
DigiKey Programmable: Not Verified
Description: IC FPGA 489 I/O 676FBGA
Packaging: Tray
Package / Case: 676-BGA
Mounting Type: Surface Mount
Number of Gates: 4000000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 62208
Supplier Device Package: 676-FBGA (27x27)
Number of LABs/CLBs: 6912
Total RAM Bits: 1769472
Number of I/O: 489
DigiKey Programmable: Not Verified
товар відсутній
| XC3S4000-4FG676C |
|
Виробник: AMD
Description: IC FPGA 489 I/O 676FCBGA
Packaging: Bulk
Package / Case: 676-BGA
Mounting Type: Surface Mount
Number of Gates: 4000000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 62208
Supplier Device Package: 676-FBGA (27x27)
Number of LABs/CLBs: 6912
Total RAM Bits: 1769472
Number of I/O: 489
DigiKey Programmable: Not Verified
Description: IC FPGA 489 I/O 676FCBGA
Packaging: Bulk
Package / Case: 676-BGA
Mounting Type: Surface Mount
Number of Gates: 4000000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 62208
Supplier Device Package: 676-FBGA (27x27)
Number of LABs/CLBs: 6912
Total RAM Bits: 1769472
Number of I/O: 489
DigiKey Programmable: Not Verified
товар відсутній
| XC3S4000-4FGG900C |
|
Виробник: AMD
Description: IC FPGA 633 I/O 900FBGA
Packaging: Tray
Package / Case: 900-BBGA
Mounting Type: Surface Mount
Number of Gates: 4000000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 62208
Supplier Device Package: 900-FBGA (31x31)
Number of LABs/CLBs: 6912
Total RAM Bits: 1769472
Number of I/O: 633
DigiKey Programmable: Not Verified
Description: IC FPGA 633 I/O 900FBGA
Packaging: Tray
Package / Case: 900-BBGA
Mounting Type: Surface Mount
Number of Gates: 4000000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 62208
Supplier Device Package: 900-FBGA (31x31)
Number of LABs/CLBs: 6912
Total RAM Bits: 1769472
Number of I/O: 633
DigiKey Programmable: Not Verified
товар відсутній
| XC3S4000-4FG676I |
|
Виробник: AMD
Description: IC FPGA 489 I/O 676FCBGA
Packaging: Tray
Package / Case: 676-BGA
Mounting Type: Surface Mount
Number of Gates: 4000000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 62208
Supplier Device Package: 676-FBGA (27x27)
Number of LABs/CLBs: 6912
Total RAM Bits: 1769472
Number of I/O: 489
DigiKey Programmable: Not Verified
Description: IC FPGA 489 I/O 676FCBGA
Packaging: Tray
Package / Case: 676-BGA
Mounting Type: Surface Mount
Number of Gates: 4000000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 62208
Supplier Device Package: 676-FBGA (27x27)
Number of LABs/CLBs: 6912
Total RAM Bits: 1769472
Number of I/O: 489
DigiKey Programmable: Not Verified
товар відсутній
| XC3S4000-5FG676C |
|
Виробник: AMD
Description: IC FPGA 489 I/O 676FCBGA
Packaging: Bulk
Package / Case: 676-BGA
Mounting Type: Surface Mount
Number of Gates: 4000000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 62208
Supplier Device Package: 676-FBGA (27x27)
Number of LABs/CLBs: 6912
Total RAM Bits: 1769472
Number of I/O: 489
DigiKey Programmable: Not Verified
Description: IC FPGA 489 I/O 676FCBGA
Packaging: Bulk
Package / Case: 676-BGA
Mounting Type: Surface Mount
Number of Gates: 4000000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 62208
Supplier Device Package: 676-FBGA (27x27)
Number of LABs/CLBs: 6912
Total RAM Bits: 1769472
Number of I/O: 489
DigiKey Programmable: Not Verified
товар відсутній
| XC3S4000-4FG900C |
|
Виробник: AMD
Description: IC FPGA 633 I/O 900FBGA
Packaging: Bulk
Package / Case: 900-BBGA
Mounting Type: Surface Mount
Number of Gates: 4000000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 62208
Supplier Device Package: 900-FBGA (31x31)
Number of LABs/CLBs: 6912
Total RAM Bits: 1769472
Number of I/O: 633
DigiKey Programmable: Not Verified
Description: IC FPGA 633 I/O 900FBGA
Packaging: Bulk
Package / Case: 900-BBGA
Mounting Type: Surface Mount
Number of Gates: 4000000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 62208
Supplier Device Package: 900-FBGA (31x31)
Number of LABs/CLBs: 6912
Total RAM Bits: 1769472
Number of I/O: 633
DigiKey Programmable: Not Verified
товар відсутній
| XC3S4000-4FG900I |
|
Виробник: AMD
Description: IC FPGA 633 I/O 900FBGA
Packaging: Bulk
Package / Case: 900-BBGA
Mounting Type: Surface Mount
Number of Gates: 4000000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 62208
Supplier Device Package: 900-FBGA (31x31)
Number of LABs/CLBs: 6912
Total RAM Bits: 1769472
Number of I/O: 633
DigiKey Programmable: Not Verified
Description: IC FPGA 633 I/O 900FBGA
Packaging: Bulk
Package / Case: 900-BBGA
Mounting Type: Surface Mount
Number of Gates: 4000000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 62208
Supplier Device Package: 900-FBGA (31x31)
Number of LABs/CLBs: 6912
Total RAM Bits: 1769472
Number of I/O: 633
DigiKey Programmable: Not Verified
товар відсутній
| XC4VLX40-10FF668C |
|
Виробник: AMD
Description: IC FPGA 448 I/O 668FCBGA
Packaging: Tray
Package / Case: 668-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 41472
Supplier Device Package: 668-FCBGA (27x27)
Number of LABs/CLBs: 4608
Total RAM Bits: 1769472
Number of I/O: 448
DigiKey Programmable: Not Verified
Description: IC FPGA 448 I/O 668FCBGA
Packaging: Tray
Package / Case: 668-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 41472
Supplier Device Package: 668-FCBGA (27x27)
Number of LABs/CLBs: 4608
Total RAM Bits: 1769472
Number of I/O: 448
DigiKey Programmable: Not Verified
товар відсутній
| XC4VLX40-10FF1148C |
|
Виробник: AMD
Description: IC FPGA 640 I/O 1148FCBGA
Packaging: Bulk
Package / Case: 1148-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 41472
Supplier Device Package: 1148-FCPBGA (35x35)
Number of LABs/CLBs: 4608
Total RAM Bits: 1769472
Number of I/O: 640
DigiKey Programmable: Not Verified
Description: IC FPGA 640 I/O 1148FCBGA
Packaging: Bulk
Package / Case: 1148-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 41472
Supplier Device Package: 1148-FCPBGA (35x35)
Number of LABs/CLBs: 4608
Total RAM Bits: 1769472
Number of I/O: 640
DigiKey Programmable: Not Verified
товар відсутній
| XAAU15P-1FFVB676Q |
|
Виробник: AMD
Description: IC FPGA ARTIXUP AUTO 676FBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 170100
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 9720
Total RAM Bits: 5347738
Number of I/O: 228
Description: IC FPGA ARTIXUP AUTO 676FBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 170100
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 9720
Total RAM Bits: 5347738
Number of I/O: 228
на замовлення 1 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 34379.2 грн |
| XAAU10P-1FFVB676I |
|
товар відсутній
| XAAU10P-L1SBVB484I |
|
товар відсутній
| XAAU10P-L1FFVB676I |
|
товар відсутній
| XAAU15P-1SBVB484I |
|
товар відсутній
| XAAU15P-1FFVB676I |
|
товар відсутній
| XAAU15P-L1FFVB676I |
|
товар відсутній
| XAAU10P-1FFVB676Q |
|
товар відсутній
| XC3SD1800A-4CSG484C |
|
Виробник: AMD
Description: IC FPGA 309 I/O 484CSBGA
Packaging: Tray
Package / Case: 484-FBGA, CSPBGA
Mounting Type: Surface Mount
Number of Gates: 1800000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 37440
Supplier Device Package: 484-CSPBGA (19x19)
Number of LABs/CLBs: 4160
Total RAM Bits: 1548288
Number of I/O: 309
DigiKey Programmable: Not Verified
Description: IC FPGA 309 I/O 484CSBGA
Packaging: Tray
Package / Case: 484-FBGA, CSPBGA
Mounting Type: Surface Mount
Number of Gates: 1800000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 37440
Supplier Device Package: 484-CSPBGA (19x19)
Number of LABs/CLBs: 4160
Total RAM Bits: 1548288
Number of I/O: 309
DigiKey Programmable: Not Verified
на замовлення 4 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 6670.87 грн |
| XC3SD1800A-4FGG676C |
|
Виробник: AMD
Description: IC FPGA 519 I/O 676FBGA
Packaging: Tray
Package / Case: 676-BGA
Mounting Type: Surface Mount
Number of Gates: 1800000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 37440
Supplier Device Package: 676-FBGA (27x27)
Number of LABs/CLBs: 4160
Total RAM Bits: 1548288
Number of I/O: 519
DigiKey Programmable: Not Verified
Description: IC FPGA 519 I/O 676FBGA
Packaging: Tray
Package / Case: 676-BGA
Mounting Type: Surface Mount
Number of Gates: 1800000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 37440
Supplier Device Package: 676-FBGA (27x27)
Number of LABs/CLBs: 4160
Total RAM Bits: 1548288
Number of I/O: 519
DigiKey Programmable: Not Verified
на замовлення 4 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 7670.07 грн |
| XC3SD1800A-4FGG676I |
|
Виробник: AMD
Description: IC FPGA 519 I/O 676FBGA
Packaging: Tray
Package / Case: 676-BGA
Mounting Type: Surface Mount
Number of Gates: 1800000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 37440
Supplier Device Package: 676-FBGA (27x27)
Number of LABs/CLBs: 4160
Total RAM Bits: 1548288
Number of I/O: 519
DigiKey Programmable: Not Verified
Description: IC FPGA 519 I/O 676FBGA
Packaging: Tray
Package / Case: 676-BGA
Mounting Type: Surface Mount
Number of Gates: 1800000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 37440
Supplier Device Package: 676-FBGA (27x27)
Number of LABs/CLBs: 4160
Total RAM Bits: 1548288
Number of I/O: 519
DigiKey Programmable: Not Verified
на замовлення 3 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 8817.52 грн |
| XCAU15P-1FFVB676I |
|
Виробник: AMD
Description: IC FPGA ARTIXUP 676BGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.698V ~ 0.742V
Number of Logic Elements/Cells: 170100
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 9720
Total RAM Bits: 5347738
Number of I/O: 228
DigiKey Programmable: Not Verified
Description: IC FPGA ARTIXUP 676BGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.698V ~ 0.742V
Number of Logic Elements/Cells: 170100
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 9720
Total RAM Bits: 5347738
Number of I/O: 228
DigiKey Programmable: Not Verified
на замовлення 56 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 20959.07 грн |
| XCS30-4BG256C |
|
Виробник: AMD
Description: IC FPGA 192 I/O 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Number of Gates: 30000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Logic Elements/Cells: 1368
Supplier Device Package: 256-PBGA (27x27)
Number of LABs/CLBs: 576
Total RAM Bits: 18432
Number of I/O: 192
DigiKey Programmable: Not Verified
Description: IC FPGA 192 I/O 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Number of Gates: 30000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Logic Elements/Cells: 1368
Supplier Device Package: 256-PBGA (27x27)
Number of LABs/CLBs: 576
Total RAM Bits: 18432
Number of I/O: 192
DigiKey Programmable: Not Verified
товар відсутній
| XC7A200T-1SBG484C |
|
Виробник: AMD
Description: IC FPGA 285 I/O 484FCBGA
Packaging: Tray
Package / Case: 484-FBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 215360
Supplier Device Package: 484-FCBGA (19x19)
Number of LABs/CLBs: 16825
Total RAM Bits: 13455360
Number of I/O: 285
DigiKey Programmable: Not Verified
Description: IC FPGA 285 I/O 484FCBGA
Packaging: Tray
Package / Case: 484-FBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 215360
Supplier Device Package: 484-FCBGA (19x19)
Number of LABs/CLBs: 16825
Total RAM Bits: 13455360
Number of I/O: 285
DigiKey Programmable: Not Verified
на замовлення 7 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 19421.06 грн |
| XCVM1502-1MSENFVB1369 |
|
Виробник: AMD
Description: IC VERSALPRIME ACAP FPGA 1369BGA
Packaging: Tray
Package / Case: 1369-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1369-FCBGA (35x35)
Architecture: MPU, FPGA
Description: IC VERSALPRIME ACAP FPGA 1369BGA
Packaging: Tray
Package / Case: 1369-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1369-FCBGA (35x35)
Architecture: MPU, FPGA
товар відсутній
| XCVM1502-1LSENFVB1369 |
|
Виробник: AMD
Description: IC VERSALPRIME ACAP FPGA 1369BGA
Packaging: Tray
Package / Case: 1369-BFBGA, FCBGA
Speed: 400MHz, 1GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1369-FCBGA (35x35)
Architecture: MPU, FPGA
Description: IC VERSALPRIME ACAP FPGA 1369BGA
Packaging: Tray
Package / Case: 1369-BFBGA, FCBGA
Speed: 400MHz, 1GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1369-FCBGA (35x35)
Architecture: MPU, FPGA
товар відсутній
| XCVM1502-2MSENFVB1369 |
|
Виробник: AMD
Description: IC VERSALPRIME ACAP FPGA 1369BGA
Packaging: Tray
Package / Case: 1369-BFBGA, FCBGA
Speed: 600MHz, 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1369-FCBGA (35x35)
Architecture: MPU, FPGA
Description: IC VERSALPRIME ACAP FPGA 1369BGA
Packaging: Tray
Package / Case: 1369-BFBGA, FCBGA
Speed: 600MHz, 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1369-FCBGA (35x35)
Architecture: MPU, FPGA
товар відсутній
| XCVM1502-1MSINFVB1369 |
|
Виробник: AMD
Description: IC VERSALPRIME ACAP FPGA 1369BGA
Packaging: Tray
Package / Case: 1369-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1369-FCBGA (35x35)
Architecture: MPU, FPGA
Description: IC VERSALPRIME ACAP FPGA 1369BGA
Packaging: Tray
Package / Case: 1369-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1369-FCBGA (35x35)
Architecture: MPU, FPGA
товар відсутній
| XCVM1502-1LSINFVB1369 |
|
Виробник: AMD
Description: IC VERSALPRIME ACAP FPGA 1369BGA
Packaging: Tray
Package / Case: 1369-BFBGA, FCBGA
Speed: 400MHz, 1GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1369-FCBGA (35x35)
Architecture: MPU, FPGA
Description: IC VERSALPRIME ACAP FPGA 1369BGA
Packaging: Tray
Package / Case: 1369-BFBGA, FCBGA
Speed: 400MHz, 1GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1369-FCBGA (35x35)
Architecture: MPU, FPGA
товар відсутній
| XCVM1502-1MLINFVB1369 |
|
Виробник: AMD
Description: IC VERSALPRIME ACAP FPGA 1369BGA
Packaging: Tray
Package / Case: 1369-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1369-FCBGA (35x35)
Architecture: MPU, FPGA
Description: IC VERSALPRIME ACAP FPGA 1369BGA
Packaging: Tray
Package / Case: 1369-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1369-FCBGA (35x35)
Architecture: MPU, FPGA
товар відсутній
| XCVM1502-2MLENFVB1369 |
|
Виробник: AMD
Description: IC VERSALPRIME ACAP FPGA 1369BGA
Packaging: Tray
Package / Case: 1369-BFBGA, FCBGA
Speed: 600MHz, 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1369-FCBGA (35x35)
Architecture: MPU, FPGA
Description: IC VERSALPRIME ACAP FPGA 1369BGA
Packaging: Tray
Package / Case: 1369-BFBGA, FCBGA
Speed: 600MHz, 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1369-FCBGA (35x35)
Architecture: MPU, FPGA
товар відсутній
| XCVM1502-2LSENFVB1369 |
|
Виробник: AMD
Description: IC VERSALPRIME ACAP FPGA 1369BGA
Packaging: Tray
Package / Case: 1369-BFBGA, FCBGA
Speed: 450MHz, 1.08GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1369-FCBGA (35x35)
Architecture: MPU, FPGA
Description: IC VERSALPRIME ACAP FPGA 1369BGA
Packaging: Tray
Package / Case: 1369-BFBGA, FCBGA
Speed: 450MHz, 1.08GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1369-FCBGA (35x35)
Architecture: MPU, FPGA
товар відсутній
| XCVM1502-2MSINFVB1369 |
|
Виробник: AMD
Description: IC VERSALPRIME ACAP FPGA 1369BGA
Packaging: Tray
Package / Case: 1369-BFBGA, FCBGA
Speed: 600MHz, 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1369-FCBGA (35x35)
Architecture: MPU, FPGA
Description: IC VERSALPRIME ACAP FPGA 1369BGA
Packaging: Tray
Package / Case: 1369-BFBGA, FCBGA
Speed: 600MHz, 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1369-FCBGA (35x35)
Architecture: MPU, FPGA
товар відсутній
| XCVM1502-1LLINFVB1369 |
|
Виробник: AMD
Description: IC VERSALPRIME ACAP FPGA 1369BGA
Packaging: Tray
Package / Case: 1369-BFBGA, FCBGA
Speed: 400MHz, 1GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1369-FCBGA (35x35)
Architecture: MPU, FPGA
Description: IC VERSALPRIME ACAP FPGA 1369BGA
Packaging: Tray
Package / Case: 1369-BFBGA, FCBGA
Speed: 400MHz, 1GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1369-FCBGA (35x35)
Architecture: MPU, FPGA
товар відсутній
| XCVM1502-2LLENFVB1369 |
|
Виробник: AMD
Description: IC VERSALPRIME ACAP FPGA 1369BGA
Packaging: Tray
Package / Case: 1369-BFBGA, FCBGA
Speed: 450MHz, 1.08GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1369-FCBGA (35x35)
Architecture: MPU, FPGA
Description: IC VERSALPRIME ACAP FPGA 1369BGA
Packaging: Tray
Package / Case: 1369-BFBGA, FCBGA
Speed: 450MHz, 1.08GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1369-FCBGA (35x35)
Architecture: MPU, FPGA
товар відсутній
| XCVM1502-2MLINFVB1369 |
|
Виробник: AMD
Description: IC VERSALPRIME ACAP FPGA 1369BGA
Packaging: Tray
Package / Case: 1369-BFBGA, FCBGA
Speed: 600MHz, 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1369-FCBGA (35x35)
Architecture: MPU, FPGA
Description: IC VERSALPRIME ACAP FPGA 1369BGA
Packaging: Tray
Package / Case: 1369-BFBGA, FCBGA
Speed: 600MHz, 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1369-FCBGA (35x35)
Architecture: MPU, FPGA
товар відсутній
| XC7A15T-3CPG236E |
|
Виробник: AMD
Description: IC FPGA 106 I/O 238CSBGA
Packaging: Tray
Package / Case: 238-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 16640
Supplier Device Package: 238-CSBGA (10x10)
Number of LABs/CLBs: 1300
Total RAM Bits: 921600
Number of I/O: 106
DigiKey Programmable: Not Verified
Description: IC FPGA 106 I/O 238CSBGA
Packaging: Tray
Package / Case: 238-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 16640
Supplier Device Package: 238-CSBGA (10x10)
Number of LABs/CLBs: 1300
Total RAM Bits: 921600
Number of I/O: 106
DigiKey Programmable: Not Verified
товар відсутній
| EK-VMK180-G-J |
|
Виробник: AMD
Description: EVAL VMK180 VERSAL PRIME NO PWR
Packaging: Box
For Use With/Related Products: XCVM1802
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s) - Power Supply Not Included -
Platform: Versal Prime Adaptive SoC VMK180 Japan PCIe Card
Description: EVAL VMK180 VERSAL PRIME NO PWR
Packaging: Box
For Use With/Related Products: XCVM1802
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s) - Power Supply Not Included -
Platform: Versal Prime Adaptive SoC VMK180 Japan PCIe Card
товар відсутній
| EK-VMK180-G-ED-J |
|
Виробник: AMD
Description: EVAL VMK180 VERSAL PRIME NO PWR
Packaging: Box
For Use With/Related Products: XCVM1802
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s) - Power Supply Not Included -
Platform: Versal Prime Adaptive SoC VMK180 Encryption Disabled Japan PCIe Card
Description: EVAL VMK180 VERSAL PRIME NO PWR
Packaging: Box
For Use With/Related Products: XCVM1802
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s) - Power Supply Not Included -
Platform: Versal Prime Adaptive SoC VMK180 Encryption Disabled Japan PCIe Card
товар відсутній
| XC3S100E-4VQG100I |
|
Виробник: AMD
Description: IC FPGA 66 I/O 100VQFP
Packaging: Tray
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Number of Gates: 100000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 2160
Supplier Device Package: 100-VQFP (14x14)
Number of LABs/CLBs: 240
Total RAM Bits: 73728
Number of I/O: 66
DigiKey Programmable: Not Verified
Description: IC FPGA 66 I/O 100VQFP
Packaging: Tray
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Number of Gates: 100000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 2160
Supplier Device Package: 100-VQFP (14x14)
Number of LABs/CLBs: 240
Total RAM Bits: 73728
Number of I/O: 66
DigiKey Programmable: Not Verified
товар відсутній
| XC3S100E-5VQG100C |
|
Виробник: AMD
Description: IC FPGA 66 I/O 100VQFP
Packaging: Tray
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Number of Gates: 100000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 2160
Supplier Device Package: 100-VQFP (14x14)
Number of LABs/CLBs: 240
Total RAM Bits: 73728
Number of I/O: 66
DigiKey Programmable: Not Verified
Description: IC FPGA 66 I/O 100VQFP
Packaging: Tray
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Number of Gates: 100000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 2160
Supplier Device Package: 100-VQFP (14x14)
Number of LABs/CLBs: 240
Total RAM Bits: 73728
Number of I/O: 66
DigiKey Programmable: Not Verified
товар відсутній
| XC3S100E-4CPG132C |
|
Виробник: AMD
Description: IC FPGA 83 I/O 132CSBGA
Packaging: Tray
Package / Case: 132-TFBGA, CSPBGA
Mounting Type: Surface Mount
Number of Gates: 100000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 2160
Supplier Device Package: 132-CSPBGA (8x8)
Number of LABs/CLBs: 240
Total RAM Bits: 73728
Number of I/O: 83
DigiKey Programmable: Not Verified
Description: IC FPGA 83 I/O 132CSBGA
Packaging: Tray
Package / Case: 132-TFBGA, CSPBGA
Mounting Type: Surface Mount
Number of Gates: 100000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 2160
Supplier Device Package: 132-CSPBGA (8x8)
Number of LABs/CLBs: 240
Total RAM Bits: 73728
Number of I/O: 83
DigiKey Programmable: Not Verified
товар відсутній
| XC3S100E-4CPG132I |
|
Виробник: AMD
Description: IC FPGA 83 I/O 132CSBGA
Packaging: Tray
Package / Case: 132-TFBGA, CSPBGA
Mounting Type: Surface Mount
Number of Gates: 100000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 2160
Supplier Device Package: 132-CSPBGA (8x8)
Number of LABs/CLBs: 240
Total RAM Bits: 73728
Number of I/O: 83
DigiKey Programmable: Not Verified
Description: IC FPGA 83 I/O 132CSBGA
Packaging: Tray
Package / Case: 132-TFBGA, CSPBGA
Mounting Type: Surface Mount
Number of Gates: 100000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 2160
Supplier Device Package: 132-CSPBGA (8x8)
Number of LABs/CLBs: 240
Total RAM Bits: 73728
Number of I/O: 83
DigiKey Programmable: Not Verified
товар відсутній