Продукція > HARIMATEC INC. > Всі товари виробника HARIMATEC INC. (111) > Сторінка 2 з 2
Обрати Сторінку:
[ << Попередня Сторінка ]
1
2
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна без ПДВ |
||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
386851 | Harimatec Inc. |
 Description: 63/37 CRYSL 502 2% .022DIA 23AWGPackaging: Bulk Diameter: 0.022" (0.56mm) Wire Gauge: 23 AWG, 24 SWG Composition: Sn63Pb37 (63/37) Type: Wire Solder Melting Point: 361°F (183°C) Form: Spool, 1 lb (454 g) Process: Leaded Flux Type: No-Clean Part Status: Active |
на замовлення 34 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||
 |
386862 | Harimatec Inc. |
Description: 63/37 CRYSL 502 2% .032DIA 20AWG Packaging: Bulk Diameter: 0.032" (0.81mm) Wire Gauge: 20 AWG, 21 SWG Composition: Sn63Pb37 (63/37) Type: Wire Solder Melting Point: 361°F (183°C) Form: Spool, 1 lb (454 g) Process: Leaded Flux Type: No-Clean Part Status: Active |
на замовлення 36 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||
 |
386876 | Harimatec Inc. |
Description: 63/37 400 2% .024DIA 22AWG Packaging: Bulk Diameter: 0.024" (0.61mm) Wire Gauge: 22 AWG, 23 SWG Composition: Sn63Pb37 (63/37) Type: Wire Solder Melting Point: 361°F (183°C) Form: Spool, 1 lb (454 g) Process: Leaded Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C) |
на замовлення 39 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||
 |
386927 | Harimatec Inc. |
Description: 63/37 400 2% .032DIA 20AWG Packaging: Bulk Diameter: 0.032" (0.81mm) Wire Gauge: 20 AWG, 21 SWG Composition: Sn63Pb37 (63/37) Type: Wire Solder Melting Point: 361°F (183°C) Form: Spool, 1 lb (454 g) Process: Leaded Flux Type: No-Clean |
на замовлення 20 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||
 |
389261 | Harimatec Inc. |
Description: 60/40 370 3% .015DIA 27AWG Packaging: Bulk Diameter: 0.015" (0.38mm) Wire Gauge: 27 AWG, 28 SWG Composition: Sn60Pb40 (60/40) Type: Wire Solder Melting Point: 361 ~ 374°F (183 ~ 190°C) Form: Spool, 8.8 oz (250g) Process: Leaded Flux Type: Rosin Activated (RA) Part Status: Active |
на замовлення 69 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||
| 389283 | Harimatec Inc. |
Description: 63/37 HX 3C 0.38MM 0.25KG .015" Packaging: Bulk Diameter: 0.015" (0.38mm) Wire Gauge: 27 AWG, 28 SWG Composition: Sn63Pb37 (63/37) Type: Wire Solder Melting Point: 361°F (183°C) Form: Spool, 8.8 oz (250g) Process: Leaded Flux Type: Water Soluble |
товар відсутній |
||||||||||||||
 |
392249 | Harimatec Inc. |
Description: 63/37 400 2% .064DIA 14AWG Packaging: Bulk Diameter: 0.064" (1.63mm) Wire Gauge: 14 AWG, 16 SWG Composition: Sn63Pb37 (63/37) Type: Wire Solder Melting Point: 361°F (183°C) Form: Spool, 1 lb (454 g) Process: Leaded Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C) |
товар відсутній |
|||||||||||||
 |
395437 | Harimatec Inc. |
Description: HMP 366 3% .028DIA 21AWG Packaging: Bulk Diameter: 0.028" (0.71mm) Wire Gauge: 21 AWG, 22 SWG Composition: Pb93.5Sn5Ag1.5 (93.5/5/1.5) Type: Wire Solder Melting Point: 565 ~ 574°F (296 ~ 301°C) Form: Spool, 17.64 oz (500g) Process: Leaded Flux Type: Rosin Activated (RA) |
на замовлення 21 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||
 |
395439 | Harimatec Inc. |
Description: HMP 366 3% .050DIA 16AWG Packaging: Bulk Diameter: 0.050" (1.27mm) Wire Gauge: 16 AWG, 18 SWG Composition: Pb93.5Sn5Ag1.5 (93.5/5/1.5) Type: Wire Solder Melting Point: 565 ~ 574°F (296 ~ 301°C) Form: Spool, 17.64 oz (500g) Process: Leaded Flux Type: Rosin Activated (RA) |
на замовлення 33 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||
 |
395451 | Harimatec Inc. |
Description: 63/37 CRYSL 502 3% .032DIA 20AWG Packaging: Bulk Diameter: 0.032" (0.81mm) Wire Gauge: 20 AWG, 21 SWG Composition: Sn63Pb37 (63/37) Type: Wire Solder Melting Point: 361°F (183°C) Form: Spool, 1 lb (454 g) Process: Leaded Flux Type: No-Clean Part Status: Active |
на замовлення 25 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||
 |
395465 | Harimatec Inc. |
Description: 63/37 CRYSL 502 3% .064DIA 14AWG Packaging: Bulk Diameter: 0.064" (1.63mm) Wire Gauge: 14 AWG, 16 SWG Composition: Sn63Pb37 (63/37) Type: Wire Solder Melting Point: 361°F (183°C) Form: Spool, 1 lb (454 g) Process: Leaded Flux Type: No-Clean Part Status: Active |
на замовлення 29 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||
| 395467 | Harimatec Inc. |
Description: 60/40 370 5C 1.22MM 0.5KG AM Packaging: Bulk Diameter: 0.048" (1.22mm) Wire Gauge: 16 AWG, 18 SWG Composition: Sn60Pb40 (60/40) Type: Wire Solder Melting Point: 361 ~ 374°F (183 ~ 190°C) Form: Spool, 17.64 oz (500g) Process: Leaded Flux Type: Rosin Activated (RA) Part Status: Active |
на замовлення 16 шт: термін постачання 21-31 дні (днів) |
|
|||||||||||||
 |
397102 | Harimatec Inc. |
Description: 63/37 400 2% .048DIA 16AWG Packaging: Bulk Diameter: 0.048" (1.22mm) Wire Gauge: 16 AWG, 18 SWG Composition: Sn63Pb37 (63/37) Type: Wire Solder Melting Point: 361°F (183°C) Form: Spool, 1 lb (454 g) Process: Leaded Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C) |
на замовлення 24 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||
 |
397127 | Harimatec Inc. |
Description: SN62 370 3% .024DIA 22AWG Packaging: Spool Diameter: 0.024" (0.61mm) Wire Gauge: 22 AWG, 23 SWG Composition: Sn62Pb38 (62/38) Type: Wire Solder Melting Point: 361°F (183°C) Form: Spool, 17.64 oz (500g) Process: Leaded Flux Type: Rosin Activated (RA) |
товар відсутній |
|||||||||||||
 |
397952 | Harimatec Inc. |
Description: HMP 366 3% .022DIA. 23AWG Packaging: Bulk Diameter: 0.022" (0.56mm) Wire Gauge: 23 AWG, 24 SWG Composition: Pb93.5Sn5Ag1.5 (93.5/5/1.5) Type: Wire Solder Melting Point: 565 ~ 574°F (296 ~ 301°C) Form: Spool, 8.8 oz (250g) Process: Leaded Flux Type: Rosin Activated (RA) |
товар відсутній |
|||||||||||||
 |
397982 | Harimatec Inc. |
Description: 63/37 CRYSL 502 3% .015DIA 27AWG Packaging: Spool Diameter: 0.015" (0.38mm) Wire Gauge: 27 AWG, 28 SWG Composition: Sn63Pb37 (63/37) Type: Wire Solder Melting Point: 361°F (183°C) Form: Spool, 8.8 oz (250g) Process: Leaded Flux Type: No-Clean Part Status: Obsolete |
товар відсутній |
|||||||||||||
| 412183 | Harimatec Inc. |
Description: 96SC C511 3C 1.02MM 0.5KG .040" Packaging: Bulk Diameter: 0.040" (1.02mm) Wire Gauge: 18 AWG, 19 SWG Composition: Sn95.5Ag3.8Cu0.7 (95.5/3.8/0.7) Type: Wire Solder Melting Point: 423°F (217°C) Form: Spool, 1 lb (454 g) Process: Lead Free Flux Type: No-Clean Part Status: Obsolete Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C) |
товар відсутній |
||||||||||||||
| 412185 | Harimatec Inc. |
Description: 96SC C502 5C 0.56MM 0.25KG.022" |
товар відсутній |
||||||||||||||
 |
450314 | Harimatec Inc. |
Description: 63/37 400 2% .022DIA 23AWG Packaging: Bulk Diameter: 0.022" (0.56mm) Wire Gauge: 23 AWG, 24 SWG Composition: Sn63Pb37 (63/37) Type: Wire Solder Melting Point: 361°F (183°C) Form: Spool, 1 lb (454 g) Process: Leaded Flux Type: No-Clean Part Status: Active |
на замовлення 37 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||
 |
519430 | Harimatec Inc. |
Description: MP200 RWF SOLDER FLUX NO CLEAN Packaging: Bulk Shipping Info: Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. Type: Flux - No Clean, Tacky Solder Form: Syringe, 0.35 oz (10g), 10cc Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
на замовлення 23 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||
| 536290 | Harimatec Inc. |
Description: 97CU3 ARAX 4C 3.25MM 10KG AM Packaging: Bulk Diameter: 0.128" (3.25mm) Wire Gauge: 8 AWG, 10 SWG Composition: Sn97Cu3 (97/3) Type: Wire Solder Form: Spool, 22.05 lbs (10kg) Process: Lead Free Part Status: Obsolete |
товар відсутній |
||||||||||||||
| 544784 | Harimatec Inc. |
Description: WS200 RWF 30G SYRINGE Packaging: Bulk Composition: Sn63Pb37 (63/37) Type: Solder Paste Melting Point: 361°F (183°C) Mesh Type: 3 Process: Leaded Flux Type: Water Soluble Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
товар відсутній |
||||||||||||||
 |
583489 | Harimatec Inc. |
Description: 63/37 MP200 SOLDER FLUX 25GM Packaging: Cartridge Composition: Sn63Pb37 (63/37) Type: Solder Paste Melting Point: 361°F (183°C) Form: Cartridge, 0.88 oz (25g) Process: Leaded Flux Type: No-Clean Storage/Refrigeration Temperature: Room Temperature Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
товар відсутній |
|||||||||||||
| 605500 | Harimatec Inc. |
Description: 96SC C511 5C 0.56MM 0.25KG Packaging: Bulk Diameter: 0.022" (0.56mm) Wire Gauge: 23 AWG, 24 SWG Composition: Sn95.5Ag3.8Cu0.7 (95.5/3.8/0.7) Type: Wire Solder Melting Point: 423°F (217°C) Form: Spool, 5.51 lbs (2.5kg) Process: Lead Free Flux Type: No-Clean Part Status: Obsolete Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C) |
товар відсутній |
||||||||||||||
 |
673828 | Harimatec Inc. |
Description: 97SC 400 2% .022DIA 23AWG Packaging: Bulk Diameter: 0.022" (0.56mm) Wire Gauge: 23 AWG, 24 SWG Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Wire Solder Melting Point: 423°F (217°C) Form: Spool, 8.8 oz (250g) Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C) |
на замовлення 17 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||
 |
673829 | Harimatec Inc. |
Description: 97SC 400 2% .032DIA 20AWG Packaging: Bulk Diameter: 0.032" (0.81mm) Wire Gauge: 20 AWG, 21 SWG Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Wire Solder Melting Point: 423°F (217°C) Form: Spool, 1 lb (454 g) Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C) |
на замовлення 80 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||
 |
673831 | Harimatec Inc. |
Description: 97SC 400 2% .048DIA 16AWG Packaging: Bulk Diameter: 0.048" (1.22mm) Wire Gauge: 16 AWG, 18 SWG Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Wire Solder Melting Point: 423°F (217°C) Form: Spool, 1 lb (454 g) Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C) |
товар відсутній |
|||||||||||||
 |
673832 | Harimatec Inc. |
Description: 97SC 400 2% .064DIA 14AWG Packaging: Bulk Diameter: 0.064" (1.63mm) Wire Gauge: 14 AWG, 16 SWG Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Wire Solder Melting Point: 423°F (217°C) Form: Spool, 1 lb (454 g) Process: Lead Free Flux Type: No-Clean Part Status: Active |
на замовлення 16 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||
 |
680290 | Harimatec Inc. |
Description: 99C BAR SOLDER 2LB +/- 0.2LB Packaging: Bulk Composition: Sn99.3Cu0.7 (99.3/0.7) Type: Bar Solder Melting Point: 440 ~ 464°F (227 ~ 240°C) Form: Bar, 2.5 lbs (1.13kg) Process: Lead Free Part Status: Obsolete Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C) |
товар відсутній |
|||||||||||||
| 692857 | Harimatec Inc. |
Description: 96SC C511 5C 0.81MM 0.5KG AM Packaging: Bulk Diameter: 0.032" (0.81mm) Wire Gauge: 20 AWG, 21 SWG Composition: Sn95.5Ag3.8Cu0.7 (95.5/3.8/0.7) Type: Wire Solder Melting Point: 423°F (217°C) Form: Spool, 1 lb (454 g) Process: Lead Free Flux Type: No-Clean Part Status: Obsolete Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C) |
товар відсутній |
||||||||||||||
 |
706397 | Harimatec Inc. |
Description: SOLDER TIP TINNER (ACTIVATOR)1PC Packaging: Bulk Type: Tip Tinner (Activator) Part Status: Obsolete |
товар відсутній |
|||||||||||||
| 716856 | Harimatec Inc. |
Description: 99C C511 3C 1.63MM 1KG AM Packaging: Bulk Diameter: 0.064" (1.63mm) Wire Gauge: 14 AWG, 16 SWG Composition: Sn99.3Cu0.7 (99.3/0.7) Type: Wire Solder Melting Point: 440 ~ 464°F (227 ~ 240°C) Form: Spool, 2.20 lbs (1kg) Process: Lead Free Flux Type: No-Clean Part Status: Obsolete |
товар відсутній |
||||||||||||||
| 721440 | Harimatec Inc. |
Description: LOCTITE LF 318 97SCAGS885V 500G |
товар відсутній |
||||||||||||||
| 721471 | Harimatec Inc. |
Description: LOCTITE LF 318 97SCAGS885V 600G Packaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423°F (217°C) Form: Cartridge, 21.16 oz (600g) Mesh Type: 3 Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
на замовлення 4 шт: термін постачання 21-31 дні (днів) |
|
|||||||||||||
| 721473 | Harimatec Inc. |
Description: LF318 TACKY FLUX Packaging: Bulk Type: Solder Paste Form: Syringe, 1.06 oz (30g) Mesh Type: 3 Process: Lead Free Flux Type: No-Clean Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
товар відсутній |
||||||||||||||
| 727190 | Harimatec Inc. |
Description: 99C C511 3C 0.56MM 0.5KG Packaging: Bulk Diameter: 0.022" (0.56mm) Wire Gauge: 23 AWG, 24 SWG Composition: Sn99.3Cu0.7 (99.3/0.7) Type: Wire Solder Melting Point: 440 ~ 464°F (227 ~ 240°C) Form: Spool, 1 lb (454 g) Process: Lead Free Flux Type: No-Clean Part Status: Obsolete |
товар відсутній |
||||||||||||||
 |
732998 | Harimatec Inc. |
Description: 97SC C511 2% .064DIA 14AWG Packaging: Bulk Diameter: 0.064" (1.63mm) Wire Gauge: 14 AWG, 16 SWG Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Wire Solder Melting Point: 423°F (217°C) Form: Spool, 1 lb (454 g) Process: Lead Free Flux Type: No-Clean Part Status: Active |
на замовлення 2 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||
| 732999 | Harimatec Inc. |
Description: 97SC C511 3C 1.22MM 0.5KG Packaging: Bulk Diameter: 0.048" (1.22mm) Wire Gauge: 16 AWG, 18 SWG Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Wire Solder Melting Point: 423°F (217°C) Form: Spool, 1 lb (454 g) Process: Lead Free Flux Type: No-Clean |
товар відсутній |
||||||||||||||
 |
733001 | Harimatec Inc. |
Description: 97SC C511 2% .022DIA 22AWG 24SWG Packaging: Bulk Diameter: 0.022" (0.56mm) Wire Gauge: 23 AWG, 24 SWG Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Wire Solder Melting Point: 423°F (217°C) Form: Spool, 8.8 oz (250g) Process: Lead Free Flux Type: No-Clean Part Status: Active |
на замовлення 953 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||
 |
733002 | Harimatec Inc. |
Description: 97SC C511 2% .032DIA 20AWG Packaging: Bulk Diameter: 0.032" (0.81mm) Wire Gauge: 20 AWG, 21 SWG Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Wire Solder Melting Point: 423°F (217°C) Form: Spool, 1 lb (454 g) Process: Lead Free Flux Type: No-Clean Part Status: Active |
на замовлення 118 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||
| 733010 | Harimatec Inc. |
Description: 96SC C511 3C 0.81MM 0.5KG .032" Packaging: Bulk Diameter: 0.032" (0.81mm) Wire Gauge: 20 AWG, 21 SWG Composition: Sn95.5Ag3.8Cu0.7 (95.5/3.8/0.7) Type: Wire Solder Melting Point: 423°F (217°C) Form: Spool, 1 lb (454 g) Process: Lead Free Flux Type: No-Clean Part Status: Obsolete |
товар відсутній |
||||||||||||||
| 733024 | Harimatec Inc. |
Description: 96SC C400 3C 0.56MM 0.25KG.022" Packaging: Bulk Diameter: 0.022" (0.56mm) Wire Gauge: 23 AWG, 24 SWG Composition: Sn95.5Ag3.8Cu0.7 (95.5/3.8/0.7) Type: Wire Solder Melting Point: 423°F (217°C) Form: Spool, 8.8 oz (250g) Process: Lead Free Flux Type: No-Clean Part Status: Obsolete Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C) |
товар відсутній |
||||||||||||||
| 760088 | Harimatec Inc. |
Description: FLUX - NO CLEAN PEN Packaging: Bulk Type: Flux - No Clean Form: Pen, 0.34 oz (9.64g) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
товар відсутній |
||||||||||||||
 |
796037 | Harimatec Inc. |
Description: 97SC C511 2% .015DIA 27AWG Packaging: Bulk Diameter: 0.015" (0.38mm) Wire Gauge: 27 AWG, 28 SWG Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Wire Solder Melting Point: 423°F (217°C) Form: Spool, 8.8 oz (250g) Process: Lead Free Flux Type: Rosin Mildly Activated (RMA) Part Status: Active |
на замовлення 20 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||
 |
796065 | Harimatec Inc. |
Description: 97SC 400 2% 0.38 DIA Packaging: Bulk Diameter: 0.015" (0.38mm) Wire Gauge: 27 AWG, 28 SWG Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Wire Solder Melting Point: 423°F (217°C) Form: Spool, 8.8 oz (250g) Process: Lead Free Flux Type: No-Clean Part Status: Active |
товар відсутній |
|||||||||||||
| 818006 | Harimatec Inc. |
Description: 63/37 C400 5C 0.71MM 0.5KG AM Packaging: Bulk Diameter: 0.028" (0.71mm) Wire Gauge: 21 AWG, 22 SWG Composition: Sn63Pb37 (63/37) Type: Wire Solder Melting Point: 361°F (183°C) Form: Spool, 1 lb (454 g) Process: Leaded Flux Type: No-Clean Part Status: Active |
товар відсутній |
||||||||||||||
| 838498 | Harimatec Inc. |
Description: 97SC C502 3C 0.25MM 0.25KG AM Packaging: Bulk Diameter: 0.025" (0.64mm) Wire Gauge: 22 AWG, 23 SWG Type: Wire Solder Melting Point: 361°F (183°C) Form: Spool, 8.8 oz (250g) Flux Type: No-Clean Part Status: Obsolete |
товар відсутній |
||||||||||||||
| 848874 | Harimatec Inc. |
Description: 97SC C502 3C 0.81MM 0.5KG AM Packaging: Bulk Diameter: 0.032" (0.81mm) Wire Gauge: 20 AWG, 21 SWG Type: Wire Solder Melting Point: 361°F (183°C) Form: Spool, 1 lb (454 g) Flux Type: No-Clean |
на замовлення 19 шт: термін постачання 21-31 дні (днів) |
|
|||||||||||||
| 865940 | Harimatec Inc. |
Description: 99C C511 3C 0.81MM 0.5KG AM Packaging: Bulk Diameter: 0.032" (0.81mm) Wire Gauge: 20 AWG, 21 SWG Composition: Sn99.3Cu0.7 (99.3/0.7) Type: Wire Solder Melting Point: 440 ~ 464°F (227 ~ 240°C) Form: Spool, 1 lb (454 g) Process: Lead Free Flux Type: No-Clean Part Status: Active |
на замовлення 28 шт: термін постачання 21-31 дні (днів) |
|
|||||||||||||
| 893357 | Harimatec Inc. |
Description: 97SC HYDRO-X 3C0.38MM 0.25KG AM Packaging: Bulk Diameter: 0.015" (0.38mm) Wire Gauge: 27 AWG, 28 SWG Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Wire Solder Melting Point: 423°F (217°C) Form: Spool, 8.8 oz (250g) Process: Lead Free Flux Type: Water Soluble |
товар відсутній |
||||||||||||||
 |
981501 | Harimatec Inc. |
Description: SAC305 BAR SOLDR 2.5LB +/- 0.2LB Packaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Bar Solder Melting Point: 423°F (217°C) Form: Bar, 2.5 lbs (1.13kg) Process: Lead Free |
товар відсутній |
| 386851 |
|
Виробник: Harimatec Inc.
Description: 63/37 CRYSL 502 2% .022DIA 23AWG
Packaging: Bulk
Diameter: 0.022" (0.56mm)
Wire Gauge: 23 AWG, 24 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Description: 63/37 CRYSL 502 2% .022DIA 23AWG
Packaging: Bulk
Diameter: 0.022" (0.56mm)
Wire Gauge: 23 AWG, 24 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
на замовлення 34 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 3936.93 грн |
| 5+ | 3438.64 грн |
| 10+ | 3086.03 грн |
| 386862 |
|
Виробник: Harimatec Inc.
Description: 63/37 CRYSL 502 2% .032DIA 20AWG
Packaging: Bulk
Diameter: 0.032" (0.81mm)
Wire Gauge: 20 AWG, 21 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Description: 63/37 CRYSL 502 2% .032DIA 20AWG
Packaging: Bulk
Diameter: 0.032" (0.81mm)
Wire Gauge: 20 AWG, 21 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
на замовлення 36 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 3998 грн |
| 10+ | 3048.11 грн |
| 386876 |
|
Виробник: Harimatec Inc.
Description: 63/37 400 2% .024DIA 22AWG
Packaging: Bulk
Diameter: 0.024" (0.61mm)
Wire Gauge: 22 AWG, 23 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C)
Description: 63/37 400 2% .024DIA 22AWG
Packaging: Bulk
Diameter: 0.024" (0.61mm)
Wire Gauge: 22 AWG, 23 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C)
на замовлення 39 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 3959.92 грн |
| 5+ | 3495.1 грн |
| 10+ | 3018.5 грн |
| 25+ | 2534.59 грн |
| 386927 |
|
Виробник: Harimatec Inc.
Description: 63/37 400 2% .032DIA 20AWG
Packaging: Bulk
Diameter: 0.032" (0.81mm)
Wire Gauge: 20 AWG, 21 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean
Description: 63/37 400 2% .032DIA 20AWG
Packaging: Bulk
Diameter: 0.032" (0.81mm)
Wire Gauge: 20 AWG, 21 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean
на замовлення 20 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 3875.13 грн |
| 5+ | 3420.65 грн |
| 10+ | 2954.15 грн |
| 389261 |
|
Виробник: Harimatec Inc.
Description: 60/40 370 3% .015DIA 27AWG
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Wire Gauge: 27 AWG, 28 SWG
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 374°F (183 ~ 190°C)
Form: Spool, 8.8 oz (250g)
Process: Leaded
Flux Type: Rosin Activated (RA)
Part Status: Active
Description: 60/40 370 3% .015DIA 27AWG
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Wire Gauge: 27 AWG, 28 SWG
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 374°F (183 ~ 190°C)
Form: Spool, 8.8 oz (250g)
Process: Leaded
Flux Type: Rosin Activated (RA)
Part Status: Active
на замовлення 69 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 3965.67 грн |
| 5+ | 3501.06 грн |
| 10+ | 3023.55 грн |
| 25+ | 2538.82 грн |
| 389283 |
|
Виробник: Harimatec Inc.
Description: 63/37 HX 3C 0.38MM 0.25KG .015"
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Wire Gauge: 27 AWG, 28 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 8.8 oz (250g)
Process: Leaded
Flux Type: Water Soluble
Description: 63/37 HX 3C 0.38MM 0.25KG .015"
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Wire Gauge: 27 AWG, 28 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 8.8 oz (250g)
Process: Leaded
Flux Type: Water Soluble
товар відсутній
| 392249 |
|
Виробник: Harimatec Inc.
Description: 63/37 400 2% .064DIA 14AWG
Packaging: Bulk
Diameter: 0.064" (1.63mm)
Wire Gauge: 14 AWG, 16 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C)
Description: 63/37 400 2% .064DIA 14AWG
Packaging: Bulk
Diameter: 0.064" (1.63mm)
Wire Gauge: 14 AWG, 16 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C)
товар відсутній
| 395437 |
|
Виробник: Harimatec Inc.
Description: HMP 366 3% .028DIA 21AWG
Packaging: Bulk
Diameter: 0.028" (0.71mm)
Wire Gauge: 21 AWG, 22 SWG
Composition: Pb93.5Sn5Ag1.5 (93.5/5/1.5)
Type: Wire Solder
Melting Point: 565 ~ 574°F (296 ~ 301°C)
Form: Spool, 17.64 oz (500g)
Process: Leaded
Flux Type: Rosin Activated (RA)
Description: HMP 366 3% .028DIA 21AWG
Packaging: Bulk
Diameter: 0.028" (0.71mm)
Wire Gauge: 21 AWG, 22 SWG
Composition: Pb93.5Sn5Ag1.5 (93.5/5/1.5)
Type: Wire Solder
Melting Point: 565 ~ 574°F (296 ~ 301°C)
Form: Spool, 17.64 oz (500g)
Process: Leaded
Flux Type: Rosin Activated (RA)
на замовлення 21 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 2909.4 грн |
| 5+ | 2568.33 грн |
| 10+ | 2218.07 грн |
| 395439 |
|
Виробник: Harimatec Inc.
Description: HMP 366 3% .050DIA 16AWG
Packaging: Bulk
Diameter: 0.050" (1.27mm)
Wire Gauge: 16 AWG, 18 SWG
Composition: Pb93.5Sn5Ag1.5 (93.5/5/1.5)
Type: Wire Solder
Melting Point: 565 ~ 574°F (296 ~ 301°C)
Form: Spool, 17.64 oz (500g)
Process: Leaded
Flux Type: Rosin Activated (RA)
Description: HMP 366 3% .050DIA 16AWG
Packaging: Bulk
Diameter: 0.050" (1.27mm)
Wire Gauge: 16 AWG, 18 SWG
Composition: Pb93.5Sn5Ag1.5 (93.5/5/1.5)
Type: Wire Solder
Melting Point: 565 ~ 574°F (296 ~ 301°C)
Form: Spool, 17.64 oz (500g)
Process: Leaded
Flux Type: Rosin Activated (RA)
на замовлення 33 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 3786.03 грн |
| 5+ | 3342.05 грн |
| 10+ | 2886.27 грн |
| 25+ | 2423.52 грн |
| 395451 |
|
Виробник: Harimatec Inc.
Description: 63/37 CRYSL 502 3% .032DIA 20AWG
Packaging: Bulk
Diameter: 0.032" (0.81mm)
Wire Gauge: 20 AWG, 21 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Description: 63/37 CRYSL 502 3% .032DIA 20AWG
Packaging: Bulk
Diameter: 0.032" (0.81mm)
Wire Gauge: 20 AWG, 21 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
на замовлення 25 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 3618.61 грн |
| 5+ | 3160.21 грн |
| 10+ | 2836.17 грн |
| 25+ | 2433.47 грн |
| 395465 |
|
Виробник: Harimatec Inc.
Description: 63/37 CRYSL 502 3% .064DIA 14AWG
Packaging: Bulk
Diameter: 0.064" (1.63mm)
Wire Gauge: 14 AWG, 16 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Description: 63/37 CRYSL 502 3% .064DIA 14AWG
Packaging: Bulk
Diameter: 0.064" (1.63mm)
Wire Gauge: 14 AWG, 16 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
на замовлення 29 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 3946.27 грн |
| 10+ | 3008.88 грн |
| 395467 |
|
Виробник: Harimatec Inc.
Description: 60/40 370 5C 1.22MM 0.5KG AM
Packaging: Bulk
Diameter: 0.048" (1.22mm)
Wire Gauge: 16 AWG, 18 SWG
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 374°F (183 ~ 190°C)
Form: Spool, 17.64 oz (500g)
Process: Leaded
Flux Type: Rosin Activated (RA)
Part Status: Active
Description: 60/40 370 5C 1.22MM 0.5KG AM
Packaging: Bulk
Diameter: 0.048" (1.22mm)
Wire Gauge: 16 AWG, 18 SWG
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 374°F (183 ~ 190°C)
Form: Spool, 17.64 oz (500g)
Process: Leaded
Flux Type: Rosin Activated (RA)
Part Status: Active
на замовлення 16 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 3796.81 грн |
| 10+ | 2894.23 грн |
| 397102 |
|
Виробник: Harimatec Inc.
Description: 63/37 400 2% .048DIA 16AWG
Packaging: Bulk
Diameter: 0.048" (1.22mm)
Wire Gauge: 16 AWG, 18 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C)
Description: 63/37 400 2% .048DIA 16AWG
Packaging: Bulk
Diameter: 0.048" (1.22mm)
Wire Gauge: 16 AWG, 18 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C)
на замовлення 24 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 3832.74 грн |
| 10+ | 2921.84 грн |
| 397127 |
|
Виробник: Harimatec Inc.
Description: SN62 370 3% .024DIA 22AWG
Packaging: Spool
Diameter: 0.024" (0.61mm)
Wire Gauge: 22 AWG, 23 SWG
Composition: Sn62Pb38 (62/38)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 17.64 oz (500g)
Process: Leaded
Flux Type: Rosin Activated (RA)
Description: SN62 370 3% .024DIA 22AWG
Packaging: Spool
Diameter: 0.024" (0.61mm)
Wire Gauge: 22 AWG, 23 SWG
Composition: Sn62Pb38 (62/38)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 17.64 oz (500g)
Process: Leaded
Flux Type: Rosin Activated (RA)
товар відсутній
| 397952 |
|
Виробник: Harimatec Inc.
Description: HMP 366 3% .022DIA. 23AWG
Packaging: Bulk
Diameter: 0.022" (0.56mm)
Wire Gauge: 23 AWG, 24 SWG
Composition: Pb93.5Sn5Ag1.5 (93.5/5/1.5)
Type: Wire Solder
Melting Point: 565 ~ 574°F (296 ~ 301°C)
Form: Spool, 8.8 oz (250g)
Process: Leaded
Flux Type: Rosin Activated (RA)
Description: HMP 366 3% .022DIA. 23AWG
Packaging: Bulk
Diameter: 0.022" (0.56mm)
Wire Gauge: 23 AWG, 24 SWG
Composition: Pb93.5Sn5Ag1.5 (93.5/5/1.5)
Type: Wire Solder
Melting Point: 565 ~ 574°F (296 ~ 301°C)
Form: Spool, 8.8 oz (250g)
Process: Leaded
Flux Type: Rosin Activated (RA)
товар відсутній
| 397982 |
|
Виробник: Harimatec Inc.
Description: 63/37 CRYSL 502 3% .015DIA 27AWG
Packaging: Spool
Diameter: 0.015" (0.38mm)
Wire Gauge: 27 AWG, 28 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 8.8 oz (250g)
Process: Leaded
Flux Type: No-Clean
Part Status: Obsolete
Description: 63/37 CRYSL 502 3% .015DIA 27AWG
Packaging: Spool
Diameter: 0.015" (0.38mm)
Wire Gauge: 27 AWG, 28 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 8.8 oz (250g)
Process: Leaded
Flux Type: No-Clean
Part Status: Obsolete
товар відсутній
| 412183 |
|
Виробник: Harimatec Inc.
Description: 96SC C511 3C 1.02MM 0.5KG .040"
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Wire Gauge: 18 AWG, 19 SWG
Composition: Sn95.5Ag3.8Cu0.7 (95.5/3.8/0.7)
Type: Wire Solder
Melting Point: 423°F (217°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Obsolete
Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C)
Description: 96SC C511 3C 1.02MM 0.5KG .040"
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Wire Gauge: 18 AWG, 19 SWG
Composition: Sn95.5Ag3.8Cu0.7 (95.5/3.8/0.7)
Type: Wire Solder
Melting Point: 423°F (217°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Obsolete
Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C)
товар відсутній
| 450314 |
|
Виробник: Harimatec Inc.
Description: 63/37 400 2% .022DIA 23AWG
Packaging: Bulk
Diameter: 0.022" (0.56mm)
Wire Gauge: 23 AWG, 24 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Description: 63/37 400 2% .022DIA 23AWG
Packaging: Bulk
Diameter: 0.022" (0.56mm)
Wire Gauge: 23 AWG, 24 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
на замовлення 37 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 4222.91 грн |
| 10+ | 3310.01 грн |
| 519430 |
|
Виробник: Harimatec Inc.
Description: MP200 RWF SOLDER FLUX NO CLEAN
Packaging: Bulk
Shipping Info: Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended.
Type: Flux - No Clean, Tacky Solder
Form: Syringe, 0.35 oz (10g), 10cc
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: MP200 RWF SOLDER FLUX NO CLEAN
Packaging: Bulk
Shipping Info: Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended.
Type: Flux - No Clean, Tacky Solder
Form: Syringe, 0.35 oz (10g), 10cc
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
на замовлення 23 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 3142.21 грн |
| 5+ | 2773.55 грн |
| 10+ | 2395.41 грн |
| 536290 |
|
Виробник: Harimatec Inc.
Description: 97CU3 ARAX 4C 3.25MM 10KG AM
Packaging: Bulk
Diameter: 0.128" (3.25mm)
Wire Gauge: 8 AWG, 10 SWG
Composition: Sn97Cu3 (97/3)
Type: Wire Solder
Form: Spool, 22.05 lbs (10kg)
Process: Lead Free
Part Status: Obsolete
Description: 97CU3 ARAX 4C 3.25MM 10KG AM
Packaging: Bulk
Diameter: 0.128" (3.25mm)
Wire Gauge: 8 AWG, 10 SWG
Composition: Sn97Cu3 (97/3)
Type: Wire Solder
Form: Spool, 22.05 lbs (10kg)
Process: Lead Free
Part Status: Obsolete
товар відсутній
| 544784 |
|
Виробник: Harimatec Inc.
Description: WS200 RWF 30G SYRINGE
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Mesh Type: 3
Process: Leaded
Flux Type: Water Soluble
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: WS200 RWF 30G SYRINGE
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Mesh Type: 3
Process: Leaded
Flux Type: Water Soluble
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
товар відсутній
| 583489 |
|
Виробник: Harimatec Inc.
Description: 63/37 MP200 SOLDER FLUX 25GM
Packaging: Cartridge
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Cartridge, 0.88 oz (25g)
Process: Leaded
Flux Type: No-Clean
Storage/Refrigeration Temperature: Room Temperature
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: 63/37 MP200 SOLDER FLUX 25GM
Packaging: Cartridge
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Cartridge, 0.88 oz (25g)
Process: Leaded
Flux Type: No-Clean
Storage/Refrigeration Temperature: Room Temperature
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
товар відсутній
| 605500 |
|
Виробник: Harimatec Inc.
Description: 96SC C511 5C 0.56MM 0.25KG
Packaging: Bulk
Diameter: 0.022" (0.56mm)
Wire Gauge: 23 AWG, 24 SWG
Composition: Sn95.5Ag3.8Cu0.7 (95.5/3.8/0.7)
Type: Wire Solder
Melting Point: 423°F (217°C)
Form: Spool, 5.51 lbs (2.5kg)
Process: Lead Free
Flux Type: No-Clean
Part Status: Obsolete
Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C)
Description: 96SC C511 5C 0.56MM 0.25KG
Packaging: Bulk
Diameter: 0.022" (0.56mm)
Wire Gauge: 23 AWG, 24 SWG
Composition: Sn95.5Ag3.8Cu0.7 (95.5/3.8/0.7)
Type: Wire Solder
Melting Point: 423°F (217°C)
Form: Spool, 5.51 lbs (2.5kg)
Process: Lead Free
Flux Type: No-Clean
Part Status: Obsolete
Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C)
товар відсутній
| 673828 |
|
Виробник: Harimatec Inc.
Description: 97SC 400 2% .022DIA 23AWG
Packaging: Bulk
Diameter: 0.022" (0.56mm)
Wire Gauge: 23 AWG, 24 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423°F (217°C)
Form: Spool, 8.8 oz (250g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C)
Description: 97SC 400 2% .022DIA 23AWG
Packaging: Bulk
Diameter: 0.022" (0.56mm)
Wire Gauge: 23 AWG, 24 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423°F (217°C)
Form: Spool, 8.8 oz (250g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C)
на замовлення 17 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 3964.95 грн |
| 10+ | 3107.9 грн |
| 673829 |
|
Виробник: Harimatec Inc.
Description: 97SC 400 2% .032DIA 20AWG
Packaging: Bulk
Diameter: 0.032" (0.81mm)
Wire Gauge: 20 AWG, 21 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423°F (217°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C)
Description: 97SC 400 2% .032DIA 20AWG
Packaging: Bulk
Diameter: 0.032" (0.81mm)
Wire Gauge: 20 AWG, 21 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423°F (217°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C)
на замовлення 80 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 6726.33 грн |
| 5+ | 5952.31 грн |
| 10+ | 5602.19 грн |
| 25+ | 4928.84 грн |
| 50+ | 4600.25 грн |
| 673831 |
|
Виробник: Harimatec Inc.
Description: 97SC 400 2% .048DIA 16AWG
Packaging: Bulk
Diameter: 0.048" (1.22mm)
Wire Gauge: 16 AWG, 18 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423°F (217°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C)
Description: 97SC 400 2% .048DIA 16AWG
Packaging: Bulk
Diameter: 0.048" (1.22mm)
Wire Gauge: 16 AWG, 18 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423°F (217°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C)
товар відсутній
| 673832 |
|
Виробник: Harimatec Inc.
Description: 97SC 400 2% .064DIA 14AWG
Packaging: Bulk
Diameter: 0.064" (1.63mm)
Wire Gauge: 14 AWG, 16 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423°F (217°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Description: 97SC 400 2% .064DIA 14AWG
Packaging: Bulk
Diameter: 0.064" (1.63mm)
Wire Gauge: 14 AWG, 16 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423°F (217°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
на замовлення 16 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 6218.32 грн |
| 5+ | 5502.69 грн |
| 10+ | 5178.93 грн |
| 680290 |
|
Виробник: Harimatec Inc.
Description: 99C BAR SOLDER 2LB +/- 0.2LB
Packaging: Bulk
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Bar Solder
Melting Point: 440 ~ 464°F (227 ~ 240°C)
Form: Bar, 2.5 lbs (1.13kg)
Process: Lead Free
Part Status: Obsolete
Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C)
Description: 99C BAR SOLDER 2LB +/- 0.2LB
Packaging: Bulk
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Bar Solder
Melting Point: 440 ~ 464°F (227 ~ 240°C)
Form: Bar, 2.5 lbs (1.13kg)
Process: Lead Free
Part Status: Obsolete
Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C)
товар відсутній
| 692857 |
|
Виробник: Harimatec Inc.
Description: 96SC C511 5C 0.81MM 0.5KG AM
Packaging: Bulk
Diameter: 0.032" (0.81mm)
Wire Gauge: 20 AWG, 21 SWG
Composition: Sn95.5Ag3.8Cu0.7 (95.5/3.8/0.7)
Type: Wire Solder
Melting Point: 423°F (217°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Obsolete
Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C)
Description: 96SC C511 5C 0.81MM 0.5KG AM
Packaging: Bulk
Diameter: 0.032" (0.81mm)
Wire Gauge: 20 AWG, 21 SWG
Composition: Sn95.5Ag3.8Cu0.7 (95.5/3.8/0.7)
Type: Wire Solder
Melting Point: 423°F (217°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Obsolete
Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C)
товар відсутній
| 706397 |
|
Виробник: Harimatec Inc.
Description: SOLDER TIP TINNER (ACTIVATOR)1PC
Packaging: Bulk
Type: Tip Tinner (Activator)
Part Status: Obsolete
Description: SOLDER TIP TINNER (ACTIVATOR)1PC
Packaging: Bulk
Type: Tip Tinner (Activator)
Part Status: Obsolete
товар відсутній
| 716856 |
|
Виробник: Harimatec Inc.
Description: 99C C511 3C 1.63MM 1KG AM
Packaging: Bulk
Diameter: 0.064" (1.63mm)
Wire Gauge: 14 AWG, 16 SWG
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 440 ~ 464°F (227 ~ 240°C)
Form: Spool, 2.20 lbs (1kg)
Process: Lead Free
Flux Type: No-Clean
Part Status: Obsolete
Description: 99C C511 3C 1.63MM 1KG AM
Packaging: Bulk
Diameter: 0.064" (1.63mm)
Wire Gauge: 14 AWG, 16 SWG
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 440 ~ 464°F (227 ~ 240°C)
Form: Spool, 2.20 lbs (1kg)
Process: Lead Free
Flux Type: No-Clean
Part Status: Obsolete
товар відсутній
| 721471 |
|
Виробник: Harimatec Inc.
Description: LOCTITE LF 318 97SCAGS885V 600G
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423°F (217°C)
Form: Cartridge, 21.16 oz (600g)
Mesh Type: 3
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: LOCTITE LF 318 97SCAGS885V 600G
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423°F (217°C)
Form: Cartridge, 21.16 oz (600g)
Mesh Type: 3
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
на замовлення 4 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 12220.35 грн |
| 721473 |
|
Виробник: Harimatec Inc.
Description: LF318 TACKY FLUX
Packaging: Bulk
Type: Solder Paste
Form: Syringe, 1.06 oz (30g)
Mesh Type: 3
Process: Lead Free
Flux Type: No-Clean
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: LF318 TACKY FLUX
Packaging: Bulk
Type: Solder Paste
Form: Syringe, 1.06 oz (30g)
Mesh Type: 3
Process: Lead Free
Flux Type: No-Clean
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
товар відсутній
| 727190 |
|
Виробник: Harimatec Inc.
Description: 99C C511 3C 0.56MM 0.5KG
Packaging: Bulk
Diameter: 0.022" (0.56mm)
Wire Gauge: 23 AWG, 24 SWG
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 440 ~ 464°F (227 ~ 240°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Obsolete
Description: 99C C511 3C 0.56MM 0.5KG
Packaging: Bulk
Diameter: 0.022" (0.56mm)
Wire Gauge: 23 AWG, 24 SWG
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 440 ~ 464°F (227 ~ 240°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Obsolete
товар відсутній
| 732998 |
|
Виробник: Harimatec Inc.
Description: 97SC C511 2% .064DIA 14AWG
Packaging: Bulk
Diameter: 0.064" (1.63mm)
Wire Gauge: 14 AWG, 16 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423°F (217°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Description: 97SC C511 2% .064DIA 14AWG
Packaging: Bulk
Diameter: 0.064" (1.63mm)
Wire Gauge: 14 AWG, 16 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423°F (217°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
на замовлення 2 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 6286.58 грн |
| 732999 |
|
Виробник: Harimatec Inc.
Description: 97SC C511 3C 1.22MM 0.5KG
Packaging: Bulk
Diameter: 0.048" (1.22mm)
Wire Gauge: 16 AWG, 18 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423°F (217°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: No-Clean
Description: 97SC C511 3C 1.22MM 0.5KG
Packaging: Bulk
Diameter: 0.048" (1.22mm)
Wire Gauge: 16 AWG, 18 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423°F (217°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: No-Clean
товар відсутній
| 733001 |
|
Виробник: Harimatec Inc.
Description: 97SC C511 2% .022DIA 22AWG 24SWG
Packaging: Bulk
Diameter: 0.022" (0.56mm)
Wire Gauge: 23 AWG, 24 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423°F (217°C)
Form: Spool, 8.8 oz (250g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Description: 97SC C511 2% .022DIA 22AWG 24SWG
Packaging: Bulk
Diameter: 0.022" (0.56mm)
Wire Gauge: 23 AWG, 24 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423°F (217°C)
Form: Spool, 8.8 oz (250g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
на замовлення 953 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 3971.42 грн |
| 5+ | 3468.12 грн |
| 10+ | 3112.4 грн |
| 25+ | 2670.48 грн |
| 50+ | 2503.59 грн |
| 100+ | 2336.68 грн |
| 733002 |
|
Виробник: Harimatec Inc.
Description: 97SC C511 2% .032DIA 20AWG
Packaging: Bulk
Diameter: 0.032" (0.81mm)
Wire Gauge: 20 AWG, 21 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423°F (217°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Description: 97SC C511 2% .032DIA 20AWG
Packaging: Bulk
Diameter: 0.032" (0.81mm)
Wire Gauge: 20 AWG, 21 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423°F (217°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
на замовлення 118 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 6645.14 грн |
| 5+ | 5880.21 грн |
| 10+ | 5534.31 грн |
| 25+ | 4869.1 грн |
| 50+ | 4544.5 грн |
| 733010 |
|
Виробник: Harimatec Inc.
Description: 96SC C511 3C 0.81MM 0.5KG .032"
Packaging: Bulk
Diameter: 0.032" (0.81mm)
Wire Gauge: 20 AWG, 21 SWG
Composition: Sn95.5Ag3.8Cu0.7 (95.5/3.8/0.7)
Type: Wire Solder
Melting Point: 423°F (217°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Obsolete
Description: 96SC C511 3C 0.81MM 0.5KG .032"
Packaging: Bulk
Diameter: 0.032" (0.81mm)
Wire Gauge: 20 AWG, 21 SWG
Composition: Sn95.5Ag3.8Cu0.7 (95.5/3.8/0.7)
Type: Wire Solder
Melting Point: 423°F (217°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Obsolete
товар відсутній
| 733024 |
|
Виробник: Harimatec Inc.
Description: 96SC C400 3C 0.56MM 0.25KG.022"
Packaging: Bulk
Diameter: 0.022" (0.56mm)
Wire Gauge: 23 AWG, 24 SWG
Composition: Sn95.5Ag3.8Cu0.7 (95.5/3.8/0.7)
Type: Wire Solder
Melting Point: 423°F (217°C)
Form: Spool, 8.8 oz (250g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Obsolete
Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C)
Description: 96SC C400 3C 0.56MM 0.25KG.022"
Packaging: Bulk
Diameter: 0.022" (0.56mm)
Wire Gauge: 23 AWG, 24 SWG
Composition: Sn95.5Ag3.8Cu0.7 (95.5/3.8/0.7)
Type: Wire Solder
Melting Point: 423°F (217°C)
Form: Spool, 8.8 oz (250g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Obsolete
Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C)
товар відсутній
| 760088 |
|
Виробник: Harimatec Inc.
Description: FLUX - NO CLEAN PEN
Packaging: Bulk
Type: Flux - No Clean
Form: Pen, 0.34 oz (9.64g)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: FLUX - NO CLEAN PEN
Packaging: Bulk
Type: Flux - No Clean
Form: Pen, 0.34 oz (9.64g)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
товар відсутній
| 796037 |
|
Виробник: Harimatec Inc.
Description: 97SC C511 2% .015DIA 27AWG
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Wire Gauge: 27 AWG, 28 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423°F (217°C)
Form: Spool, 8.8 oz (250g)
Process: Lead Free
Flux Type: Rosin Mildly Activated (RMA)
Part Status: Active
Description: 97SC C511 2% .015DIA 27AWG
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Wire Gauge: 27 AWG, 28 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423°F (217°C)
Form: Spool, 8.8 oz (250g)
Process: Lead Free
Flux Type: Rosin Mildly Activated (RMA)
Part Status: Active
на замовлення 20 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 4038.96 грн |
| 10+ | 3165.47 грн |
| 796065 |
|
Виробник: Harimatec Inc.
Description: 97SC 400 2% 0.38 DIA
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Wire Gauge: 27 AWG, 28 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423°F (217°C)
Form: Spool, 8.8 oz (250g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Description: 97SC 400 2% 0.38 DIA
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Wire Gauge: 27 AWG, 28 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423°F (217°C)
Form: Spool, 8.8 oz (250g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
товар відсутній
| 818006 |
|
Виробник: Harimatec Inc.
Description: 63/37 C400 5C 0.71MM 0.5KG AM
Packaging: Bulk
Diameter: 0.028" (0.71mm)
Wire Gauge: 21 AWG, 22 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Description: 63/37 C400 5C 0.71MM 0.5KG AM
Packaging: Bulk
Diameter: 0.028" (0.71mm)
Wire Gauge: 21 AWG, 22 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
товар відсутній
| 838498 |
|
Виробник: Harimatec Inc.
Description: 97SC C502 3C 0.25MM 0.25KG AM
Packaging: Bulk
Diameter: 0.025" (0.64mm)
Wire Gauge: 22 AWG, 23 SWG
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 8.8 oz (250g)
Flux Type: No-Clean
Part Status: Obsolete
Description: 97SC C502 3C 0.25MM 0.25KG AM
Packaging: Bulk
Diameter: 0.025" (0.64mm)
Wire Gauge: 22 AWG, 23 SWG
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 8.8 oz (250g)
Flux Type: No-Clean
Part Status: Obsolete
товар відсутній
| 848874 |
|
Виробник: Harimatec Inc.
Description: 97SC C502 3C 0.81MM 0.5KG AM
Packaging: Bulk
Diameter: 0.032" (0.81mm)
Wire Gauge: 20 AWG, 21 SWG
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 1 lb (454 g)
Flux Type: No-Clean
Description: 97SC C502 3C 0.81MM 0.5KG AM
Packaging: Bulk
Diameter: 0.032" (0.81mm)
Wire Gauge: 20 AWG, 21 SWG
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 1 lb (454 g)
Flux Type: No-Clean
на замовлення 19 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 6390.77 грн |
| 5+ | 5654.77 грн |
| 10+ | 5322.09 грн |
| 865940 |
|
Виробник: Harimatec Inc.
Description: 99C C511 3C 0.81MM 0.5KG AM
Packaging: Bulk
Diameter: 0.032" (0.81mm)
Wire Gauge: 20 AWG, 21 SWG
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 440 ~ 464°F (227 ~ 240°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Description: 99C C511 3C 0.81MM 0.5KG AM
Packaging: Bulk
Diameter: 0.032" (0.81mm)
Wire Gauge: 20 AWG, 21 SWG
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 440 ~ 464°F (227 ~ 240°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
на замовлення 28 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 4827.21 грн |
| 10+ | 3783.36 грн |
| 893357 |
|
Виробник: Harimatec Inc.
Description: 97SC HYDRO-X 3C0.38MM 0.25KG AM
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Wire Gauge: 27 AWG, 28 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423°F (217°C)
Form: Spool, 8.8 oz (250g)
Process: Lead Free
Flux Type: Water Soluble
Description: 97SC HYDRO-X 3C0.38MM 0.25KG AM
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Wire Gauge: 27 AWG, 28 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423°F (217°C)
Form: Spool, 8.8 oz (250g)
Process: Lead Free
Flux Type: Water Soluble
товар відсутній
| 981501 |
|
Виробник: Harimatec Inc.
Description: SAC305 BAR SOLDR 2.5LB +/- 0.2LB
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Bar Solder
Melting Point: 423°F (217°C)
Form: Bar, 2.5 lbs (1.13kg)
Process: Lead Free
Description: SAC305 BAR SOLDR 2.5LB +/- 0.2LB
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Bar Solder
Melting Point: 423°F (217°C)
Form: Bar, 2.5 lbs (1.13kg)
Process: Lead Free
товар відсутній
Обрати Сторінку:
[ << Попередня Сторінка ]
1
2