| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна без ПДВ |
|---|---|---|---|---|---|
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1SG280HU1F50E2VGAS | Intel |
 Description: IC FPGA 704 I/O 2397BGAPackaging: Tray Package / Case: 2397-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.77V ~ 0.97V Number of Logic Elements/Cells: 2800000 Supplier Device Package: 2397-FBGA, FC (50x50) Number of LABs/CLBs: 350000 Number of I/O: 704 DigiKey Programmable: Not Verified |
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1SG280HU1F50E2VG | Intel |
Description: IC FPGA 704 I/O 2397BGA Packaging: Tray Package / Case: 2397-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.77V ~ 0.97V Number of Logic Elements/Cells: 2800000 Supplier Device Package: 2397-FBGA, FC (50x50) Number of LABs/CLBs: 350000 Number of I/O: 704 DigiKey Programmable: Not Verified |
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1SG280HU1F50E2VGS3 | Intel |
Description: IC FPGA 704 I/O 2397FBGA Packaging: Tray Package / Case: 2397-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.77V ~ 0.97V Number of Logic Elements/Cells: 2800000 Supplier Device Package: 2397-FBGA, FC (50x50) Number of LABs/CLBs: 350000 Number of I/O: 704 DigiKey Programmable: Not Verified |
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1SG280HU1F50I2LG | Intel |
Description: IC FPGA 704 I/O 2397BGA Packaging: Tray Package / Case: 2397-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.82V ~ 0.88V Number of Logic Elements/Cells: 2800000 Supplier Device Package: 2397-FBGA, FC (50x50) Number of LABs/CLBs: 350000 Number of I/O: 704 DigiKey Programmable: Not Verified |
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1SG280HU2F50E2VGAS | Intel |
Description: IC FPGA 704 I/O 2397BGA Packaging: Tray Package / Case: 2397-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.77V ~ 0.97V Number of Logic Elements/Cells: 2800000 Supplier Device Package: 2397-FBGA, FC (50x50) Number of LABs/CLBs: 350000 Number of I/O: 704 DigiKey Programmable: Not Verified |
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1SG280HU2F50E2VG | Intel |
Description: IC FPGA 704 I/O 2397BGA Packaging: Tray Package / Case: 2397-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.77V ~ 0.97V Number of Logic Elements/Cells: 2800000 Supplier Device Package: 2397-FBGA, FC (50x50) Number of LABs/CLBs: 350000 Number of I/O: 704 DigiKey Programmable: Not Verified |
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1SG280HU2F50E2VGS3 | Intel |
Description: IC FPGA 704 I/O 2397FBGA Packaging: Tray Package / Case: 2397-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.77V ~ 0.97V Number of Logic Elements/Cells: 2800000 Supplier Device Package: 2397-FBGA, FC (50x50) Number of LABs/CLBs: 350000 Number of I/O: 704 DigiKey Programmable: Not Verified |
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1SG280HU2F50I1VG | Intel |
Description: IC FPGA 704 I/O 2397BGA Packaging: Tray Package / Case: 2397-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.77V ~ 0.97V Number of Logic Elements/Cells: 2800000 Supplier Device Package: 2397-FBGA, FC (50x50) Number of LABs/CLBs: 350000 Number of I/O: 704 DigiKey Programmable: Not Verified |
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1SG280HU2F50I2VG | Intel |
Description: IC FPGA 704 I/O 2397BGA Packaging: Tray Package / Case: 2397-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.77V ~ 0.97V Number of Logic Elements/Cells: 2800000 Supplier Device Package: 2397-FBGA, FC (50x50) Number of LABs/CLBs: 350000 Number of I/O: 704 DigiKey Programmable: Not Verified |
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1SG280HU3F50E2LG | Intel |
Description: IC FPGA 704 I/O 2397BGA Packaging: Tray Package / Case: 2397-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.82V ~ 0.88V Number of Logic Elements/Cells: 2800000 Supplier Device Package: 2397-FBGA, FC (50x50) Number of LABs/CLBs: 350000 Number of I/O: 704 DigiKey Programmable: Not Verified |
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1SG280HU3F50E2LGS3 | Intel |
Description: IC FPGA 704 I/O 2397FBGA Packaging: Tray Package / Case: 2397-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.82V ~ 0.88V Number of Logic Elements/Cells: 2800000 Supplier Device Package: 2397-FBGA, FC (50x50) Number of LABs/CLBs: 350000 Number of I/O: 704 DigiKey Programmable: Not Verified |
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1SG280LU3F50I3XGAS | Intel |
Description: IC FPGA 704 I/O 2397BGA Packaging: Tray Package / Case: 2397-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.82V ~ 0.88V Number of Logic Elements/Cells: 2800000 Supplier Device Package: 2397-FBGA, FC (50x50) Number of LABs/CLBs: 350000 Number of I/O: 704 DigiKey Programmable: Not Verified |
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1SG280LU3F50I3XG | Intel |
Description: IC FPGA 704 I/O 2397BGA Packaging: Tray Package / Case: 2397-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.82V ~ 0.88V Number of Logic Elements/Cells: 2800000 Supplier Device Package: 2397-FBGA, FC (50x50) Number of LABs/CLBs: 350000 Number of I/O: 704 DigiKey Programmable: Not Verified |
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1SX250HH1F55E1VG | Intel |
Description: IC FPGA STRATIX 10 2912FBGA Packaging: Tray Package / Case: 2912-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2500K Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 2912-FBGA, FC (55x55) Architecture: MCU, FPGA |
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1SX250HH1F55E2LG | Intel |
Description: IC FPGA STRATIX 10 2912FBGA Packaging: Tray Package / Case: 2912-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2500K Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 2912-FBGA, FC (55x55) Architecture: MCU, FPGA |
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1SX250HH1F55I2LG | Intel |
Description: IC FPGA STRATIX 10 2912FBGA Packaging: Tray Package / Case: 2912-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2500K Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 2912-FBGA, FC (55x55) Architecture: MCU, FPGA |
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1SX250HH2F55E2LG | Intel |
Description: IC FPGA STRATIX 10 2912FBGA Packaging: Tray Package / Case: 2912-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2500K Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 2912-FBGA, FC (55x55) Architecture: MCU, FPGA |
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1SX250HH2F55I2VG | Intel |
Description: IC FPGA STRATIX 10 2912FBGA Packaging: Tray Package / Case: 2912-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2500K Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 2912-FBGA, FC (55x55) Architecture: MCU, FPGA |
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1SX250HH3F55I3XG | Intel |
Description: IC FPGA STRATIX 10 2912FBGA Packaging: Tray Package / Case: 2912-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2500K Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 2912-FBGA, FC (55x55) Architecture: MCU, FPGA |
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1SX250HN2F43I1VG | Intel |
Description: IC FPGA STRATIX 10 1760FBGA Packaging: Tray Package / Case: 1760-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2500K Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1760-FBGA (42.5x42.5) Architecture: MCU, FPGA |
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1SX250HU1F50I2LG | Intel |
Description: IC FPGA STRATIX 10 2397FBGA Packaging: Tray Package / Case: 2397-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2500K Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 2397-FBGA, FC (50x50) Architecture: MCU, FPGA |
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1SX250HU2F50E2LG | Intel |
Description: IC FPGA STRATIX 10 2397FBGA Packaging: Tray Package / Case: 2397-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2500K Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 2397-FBGA, FC (50x50) Architecture: MCU, FPGA |
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1SX250HU2F50I2LG | Intel |
Description: IC FPGA STRATIX 10 2397FBGA Packaging: Tray Package / Case: 2397-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2500K Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 2397-FBGA, FC (50x50) Architecture: MCU, FPGA |
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1SX250HU2F50I2VG | Intel |
Description: IC FPGA STRATIX 10 2397FBGA Packaging: Tray Package / Case: 2397-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2500K Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 2397-FBGA, FC (50x50) Architecture: MCU, FPGA |
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1SX250HU3F50E1VG | Intel |
Description: IC FPGA STRATIX 10 2397FBGA Packaging: Tray Package / Case: 2397-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2500K Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 2397-FBGA, FC (50x50) Architecture: MCU, FPGA |
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1SX250HU3F50E2VG | Intel |
Description: IC FPGA STRATIX 10 2397FBGA Packaging: Tray Package / Case: 2397-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2500K Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 2397-FBGA, FC (50x50) Architecture: MCU, FPGA |
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1SX250HU3F50I3VG | Intel |
Description: IC FPGA STRATIX 10 2397FBGA Packaging: Tray Package / Case: 2397-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2500K Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 2397-FBGA, FC (50x50) Architecture: MCU, FPGA |
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1SX250LU3F50I3XG | Intel |
Description: IC FPGA STRATIX 10 2397FBGA Packaging: Tray Package / Case: 2397-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2500K Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 2397-FBGA, FC (50x50) Architecture: MCU, FPGA |
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1SX280HH2F55I2LG | Intel |
Description: IC FPGA STRATIX 10 2912FBGA Packaging: Tray Package / Case: 2912-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2800K Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 2912-FBGA, FC (55x55) Architecture: MCU, FPGA |
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1SX280HN1F43E2VGS3 | Intel |
Description: IC FPGA STRATIX 10 1760FBGA Packaging: Tray Package / Case: 1760-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2800K Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1760-FBGA (42.5x42.5) Architecture: MCU, FPGA |
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1SX280HN1F43I1VG | Intel |
Description: IC FPGA STRATIX 10 1760FBGA Packaging: Tray Package / Case: 1760-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2800K Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1760-FBGA (42.5x42.5) Architecture: MCU, FPGA |
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1SX280HN3F43E2VGS3 | Intel |
Description: IC FPGA STRATIX 10 1760FBGA Packaging: Tray Package / Case: 1760-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2800K Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1760-FBGA (42.5x42.5) Architecture: MCU, FPGA |
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1SX280HU1F50E2LGS3 | Intel |
Description: IC FPGA STRATIX 10 2397FBGA Packaging: Tray Package / Case: 2397-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2800K Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 2397-FBGA, FC (50x50) Architecture: MCU, FPGA |
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EP1K10FC256-1 | Intel |
Description: IC FPGA 136 I/O 256FBGA Packaging: Tray Package / Case: 256-BGA Mounting Type: Surface Mount Number of Gates: 56000 Operating Temperature: 0°C ~ 70°C (TA) Voltage - Supply: 2.375V ~ 2.625V Number of Logic Elements/Cells: 576 Supplier Device Package: 256-FBGA (17x17) Number of LABs/CLBs: 72 Total RAM Bits: 12288 Number of I/O: 136 DigiKey Programmable: Not Verified |
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EPM7512BBC256-10 | Intel |
Description: IC CPLD 512MC 10NS 256BGA Packaging: Tray Package / Case: 256-LBGA Mounting Type: Surface Mount Programmable Type: In System Programmable Number of Gates: 10000 Number of Macrocells: 512 Operating Temperature: 0°C ~ 70°C (TA) Delay Time tpd(1) Max: 10 ns Supplier Device Package: 256-BGA (27x27) Number of Logic Elements/Blocks: 32 Voltage Supply - Internal: 2.375V ~ 2.625V Number of I/O: 212 DigiKey Programmable: Not Verified |
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EPM7512BBC256-7 | Intel |
Description: IC CPLD 512MC 7.5NS 256BGA Packaging: Tray Package / Case: 256-LBGA Mounting Type: Surface Mount Programmable Type: In System Programmable Number of Gates: 10000 Number of Macrocells: 512 Operating Temperature: 0°C ~ 70°C (TA) Delay Time tpd(1) Max: 7.5 ns Supplier Device Package: 256-BGA (27x27) Number of Logic Elements/Blocks: 32 Voltage Supply - Internal: 2.375V ~ 2.625V Number of I/O: 212 DigiKey Programmable: Not Verified |
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| IP-OM-3D-LUT | Intel |
Description: PROTOTYPE Packaging: Bulk |
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EP4SGX180DF29C4G | Intel |
Description: IC FPGA 372 I/O 780FBGA Packaging: Tray DigiKey Programmable: Not Verified |
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| EP4SGX180FF35C4G | Intel |
Description: IC FPGA 564 I/O 1152FBGA Packaging: Tray DigiKey Programmable: Not Verified |
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EP4SGX180HF35C4G | Intel |
Description: IC FPGA 564 I/O 1152FBGA Packaging: Tray DigiKey Programmable: Not Verified |
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EP4SGX180KF40C4G | Intel |
Description: IC FPGA 744 I/O 1517FBGA Packaging: Tray DigiKey Programmable: Not Verified |
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EP4SGX180DF29I4G | Intel |
Description: IC FPGA 372 I/O 780FBGA Packaging: Tray DigiKey Programmable: Not Verified |
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EP4SGX180DF29C3G | Intel |
Description: IC FPGA 372 I/O 780FBGA Packaging: Tray DigiKey Programmable: Not Verified |
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| EP4SGX180FF35I4G | Intel |
Description: IC FPGA 564 I/O 1152FBGA Packaging: Tray DigiKey Programmable: Not Verified |
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EP4SGX180FF35C3G | Intel |
Description: IC FPGA 564 I/O 1152FBGA Packaging: Tray DigiKey Programmable: Not Verified |
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EP4SGX180HF35I4G | Intel |
Description: IC FPGA 564 I/O 1152FBGA Packaging: Tray DigiKey Programmable: Not Verified |
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EP4SGX180HF35C3G | Intel |
Description: IC FPGA 564 I/O 1152FBGA Packaging: Tray DigiKey Programmable: Not Verified |
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| EP4SGX180KF40C3G | Intel |
Description: IC FPGA 744 I/O 1517FBGA Packaging: Tray DigiKey Programmable: Not Verified |
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EP4SGX180KF40I4G | Intel |
Description: IC FPGA 744 I/O 1517FBGA Packaging: Tray DigiKey Programmable: Not Verified |
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EP4SGX180DF29I3G | Intel |
Description: IC FPGA 372 I/O 780FBGA Packaging: Tray DigiKey Programmable: Not Verified |
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EP4SGX180DF29C2XG | Intel |
Description: IC FPGA 372 I/O 780FBGA Packaging: Tray DigiKey Programmable: Not Verified |
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EP4SGX180FF35C2XG | Intel |
Description: IC FPGA 564 I/O 1152FBGA Packaging: Tray DigiKey Programmable: Not Verified |
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| EP4SGX180FF35I3G | Intel |
Description: IC FPGA 564 I/O 1152FBGA Packaging: Tray DigiKey Programmable: Not Verified |
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EP4SGX180HF35I3G | Intel |
Description: IC FPGA 564 I/O 1152FBGA Packaging: Tray DigiKey Programmable: Not Verified |
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EP4SGX180HF35C2G | Intel |
Description: IC FPGA 564 I/O 1152FBGA Packaging: Tray DigiKey Programmable: Not Verified |
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EP4SGX180KF40C2G | Intel |
Description: IC FPGA 744 I/O 1517FBGA Packaging: Tray DigiKey Programmable: Not Verified |
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EP4SGX180KF40I3G | Intel |
Description: IC FPGA 744 I/O 1517FBGA Packaging: Tray DigiKey Programmable: Not Verified |
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EPF10K200SRC240-1X | Intel |
Description: IC FPGA 182 I/O 240RQFP Packaging: Tray Package / Case: 240-BFQFP Exposed Pad Mounting Type: Surface Mount Number of Gates: 513000 Operating Temperature: 0°C ~ 70°C (TA) Voltage - Supply: 2.375V ~ 2.625V Number of Logic Elements/Cells: 9984 Supplier Device Package: 240-RQFP (32x32) Number of LABs/CLBs: 1248 Total RAM Bits: 98304 Number of I/O: 182 DigiKey Programmable: Not Verified |
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EPF10K200SFC484-3 | Intel |
Description: IC FPGA 369 I/O 484FBGA Packaging: Tray Package / Case: 484-BBGA Mounting Type: Surface Mount Number of Gates: 513000 Operating Temperature: 0°C ~ 70°C (TA) Voltage - Supply: 2.375V ~ 2.625V Number of Logic Elements/Cells: 9984 Supplier Device Package: 484-FBGA (23x23) Number of LABs/CLBs: 1248 Total RAM Bits: 98304 Number of I/O: 369 DigiKey Programmable: Not Verified |
товар відсутній |
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EPF10K200SRC240-2 | Intel |
Description: IC FPGA 182 I/O 240RQFP Packaging: Tray Package / Case: 240-BFQFP Exposed Pad Mounting Type: Surface Mount Number of Gates: 513000 Operating Temperature: 0°C ~ 70°C (TA) Voltage - Supply: 2.375V ~ 2.625V Number of Logic Elements/Cells: 9984 Supplier Device Package: 240-RQFP (32x32) Number of LABs/CLBs: 1248 Total RAM Bits: 98304 Number of I/O: 182 DigiKey Programmable: Not Verified |
товар відсутній |
| 1SG280HU1F50E2VGAS |
|
Виробник: Intel
Description: IC FPGA 704 I/O 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2397-FBGA, FC (50x50)
Number of LABs/CLBs: 350000
Number of I/O: 704
DigiKey Programmable: Not Verified
Description: IC FPGA 704 I/O 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2397-FBGA, FC (50x50)
Number of LABs/CLBs: 350000
Number of I/O: 704
DigiKey Programmable: Not Verified
товар відсутній
| 1SG280HU1F50E2VG |
|
Виробник: Intel
Description: IC FPGA 704 I/O 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2397-FBGA, FC (50x50)
Number of LABs/CLBs: 350000
Number of I/O: 704
DigiKey Programmable: Not Verified
Description: IC FPGA 704 I/O 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2397-FBGA, FC (50x50)
Number of LABs/CLBs: 350000
Number of I/O: 704
DigiKey Programmable: Not Verified
товар відсутній
| 1SG280HU1F50E2VGS3 |
|
Виробник: Intel
Description: IC FPGA 704 I/O 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2397-FBGA, FC (50x50)
Number of LABs/CLBs: 350000
Number of I/O: 704
DigiKey Programmable: Not Verified
Description: IC FPGA 704 I/O 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2397-FBGA, FC (50x50)
Number of LABs/CLBs: 350000
Number of I/O: 704
DigiKey Programmable: Not Verified
товар відсутній
| 1SG280HU1F50I2LG |
|
Виробник: Intel
Description: IC FPGA 704 I/O 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2397-FBGA, FC (50x50)
Number of LABs/CLBs: 350000
Number of I/O: 704
DigiKey Programmable: Not Verified
Description: IC FPGA 704 I/O 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2397-FBGA, FC (50x50)
Number of LABs/CLBs: 350000
Number of I/O: 704
DigiKey Programmable: Not Verified
товар відсутній
| 1SG280HU2F50E2VGAS |
|
Виробник: Intel
Description: IC FPGA 704 I/O 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2397-FBGA, FC (50x50)
Number of LABs/CLBs: 350000
Number of I/O: 704
DigiKey Programmable: Not Verified
Description: IC FPGA 704 I/O 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2397-FBGA, FC (50x50)
Number of LABs/CLBs: 350000
Number of I/O: 704
DigiKey Programmable: Not Verified
товар відсутній
| 1SG280HU2F50E2VG |
|
Виробник: Intel
Description: IC FPGA 704 I/O 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2397-FBGA, FC (50x50)
Number of LABs/CLBs: 350000
Number of I/O: 704
DigiKey Programmable: Not Verified
Description: IC FPGA 704 I/O 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2397-FBGA, FC (50x50)
Number of LABs/CLBs: 350000
Number of I/O: 704
DigiKey Programmable: Not Verified
товар відсутній
| 1SG280HU2F50E2VGS3 |
|
Виробник: Intel
Description: IC FPGA 704 I/O 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2397-FBGA, FC (50x50)
Number of LABs/CLBs: 350000
Number of I/O: 704
DigiKey Programmable: Not Verified
Description: IC FPGA 704 I/O 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2397-FBGA, FC (50x50)
Number of LABs/CLBs: 350000
Number of I/O: 704
DigiKey Programmable: Not Verified
товар відсутній
| 1SG280HU2F50I1VG |
|
Виробник: Intel
Description: IC FPGA 704 I/O 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2397-FBGA, FC (50x50)
Number of LABs/CLBs: 350000
Number of I/O: 704
DigiKey Programmable: Not Verified
Description: IC FPGA 704 I/O 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2397-FBGA, FC (50x50)
Number of LABs/CLBs: 350000
Number of I/O: 704
DigiKey Programmable: Not Verified
товар відсутній
| 1SG280HU2F50I2VG |
|
Виробник: Intel
Description: IC FPGA 704 I/O 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2397-FBGA, FC (50x50)
Number of LABs/CLBs: 350000
Number of I/O: 704
DigiKey Programmable: Not Verified
Description: IC FPGA 704 I/O 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2397-FBGA, FC (50x50)
Number of LABs/CLBs: 350000
Number of I/O: 704
DigiKey Programmable: Not Verified
товар відсутній
| 1SG280HU3F50E2LG |
|
Виробник: Intel
Description: IC FPGA 704 I/O 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2397-FBGA, FC (50x50)
Number of LABs/CLBs: 350000
Number of I/O: 704
DigiKey Programmable: Not Verified
Description: IC FPGA 704 I/O 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2397-FBGA, FC (50x50)
Number of LABs/CLBs: 350000
Number of I/O: 704
DigiKey Programmable: Not Verified
товар відсутній
| 1SG280HU3F50E2LGS3 |
|
Виробник: Intel
Description: IC FPGA 704 I/O 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2397-FBGA, FC (50x50)
Number of LABs/CLBs: 350000
Number of I/O: 704
DigiKey Programmable: Not Verified
Description: IC FPGA 704 I/O 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2397-FBGA, FC (50x50)
Number of LABs/CLBs: 350000
Number of I/O: 704
DigiKey Programmable: Not Verified
товар відсутній
| 1SG280LU3F50I3XGAS |
|
Виробник: Intel
Description: IC FPGA 704 I/O 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2397-FBGA, FC (50x50)
Number of LABs/CLBs: 350000
Number of I/O: 704
DigiKey Programmable: Not Verified
Description: IC FPGA 704 I/O 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2397-FBGA, FC (50x50)
Number of LABs/CLBs: 350000
Number of I/O: 704
DigiKey Programmable: Not Verified
товар відсутній
| 1SG280LU3F50I3XG |
|
Виробник: Intel
Description: IC FPGA 704 I/O 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2397-FBGA, FC (50x50)
Number of LABs/CLBs: 350000
Number of I/O: 704
DigiKey Programmable: Not Verified
Description: IC FPGA 704 I/O 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2397-FBGA, FC (50x50)
Number of LABs/CLBs: 350000
Number of I/O: 704
DigiKey Programmable: Not Verified
товар відсутній
| 1SX250HH1F55E1VG |
Виробник: Intel
Description: IC FPGA STRATIX 10 2912FBGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2500K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Description: IC FPGA STRATIX 10 2912FBGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2500K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
товар відсутній
| 1SX250HH1F55E2LG |
Виробник: Intel
Description: IC FPGA STRATIX 10 2912FBGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2500K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Description: IC FPGA STRATIX 10 2912FBGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2500K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
товар відсутній
| 1SX250HH1F55I2LG |
Виробник: Intel
Description: IC FPGA STRATIX 10 2912FBGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2500K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Description: IC FPGA STRATIX 10 2912FBGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2500K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
товар відсутній
| 1SX250HH2F55E2LG |
Виробник: Intel
Description: IC FPGA STRATIX 10 2912FBGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2500K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Description: IC FPGA STRATIX 10 2912FBGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2500K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
товар відсутній
| 1SX250HH2F55I2VG |
Виробник: Intel
Description: IC FPGA STRATIX 10 2912FBGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2500K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Description: IC FPGA STRATIX 10 2912FBGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2500K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
товар відсутній
| 1SX250HH3F55I3XG |
Виробник: Intel
Description: IC FPGA STRATIX 10 2912FBGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2500K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Description: IC FPGA STRATIX 10 2912FBGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2500K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
товар відсутній
| 1SX250HN2F43I1VG |
Виробник: Intel
Description: IC FPGA STRATIX 10 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2500K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FBGA (42.5x42.5)
Architecture: MCU, FPGA
Description: IC FPGA STRATIX 10 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2500K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FBGA (42.5x42.5)
Architecture: MCU, FPGA
товар відсутній
| 1SX250HU1F50I2LG |
Виробник: Intel
Description: IC FPGA STRATIX 10 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2500K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Description: IC FPGA STRATIX 10 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2500K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
товар відсутній
| 1SX250HU2F50E2LG |
Виробник: Intel
Description: IC FPGA STRATIX 10 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2500K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Description: IC FPGA STRATIX 10 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2500K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
товар відсутній
| 1SX250HU2F50I2LG |
Виробник: Intel
Description: IC FPGA STRATIX 10 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2500K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Description: IC FPGA STRATIX 10 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2500K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
товар відсутній
| 1SX250HU2F50I2VG |
Виробник: Intel
Description: IC FPGA STRATIX 10 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2500K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Description: IC FPGA STRATIX 10 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2500K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
товар відсутній
| 1SX250HU3F50E1VG |
Виробник: Intel
Description: IC FPGA STRATIX 10 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2500K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Description: IC FPGA STRATIX 10 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2500K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
товар відсутній
| 1SX250HU3F50E2VG |
Виробник: Intel
Description: IC FPGA STRATIX 10 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2500K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Description: IC FPGA STRATIX 10 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2500K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
товар відсутній
| 1SX250HU3F50I3VG |
Виробник: Intel
Description: IC FPGA STRATIX 10 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2500K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Description: IC FPGA STRATIX 10 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2500K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
товар відсутній
| 1SX250LU3F50I3XG |
Виробник: Intel
Description: IC FPGA STRATIX 10 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2500K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Description: IC FPGA STRATIX 10 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2500K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
товар відсутній
| 1SX280HH2F55I2LG |
Виробник: Intel
Description: IC FPGA STRATIX 10 2912FBGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Description: IC FPGA STRATIX 10 2912FBGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
товар відсутній
| 1SX280HN1F43E2VGS3 |
Виробник: Intel
Description: IC FPGA STRATIX 10 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FBGA (42.5x42.5)
Architecture: MCU, FPGA
Description: IC FPGA STRATIX 10 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FBGA (42.5x42.5)
Architecture: MCU, FPGA
товар відсутній
| 1SX280HN1F43I1VG |
Виробник: Intel
Description: IC FPGA STRATIX 10 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FBGA (42.5x42.5)
Architecture: MCU, FPGA
Description: IC FPGA STRATIX 10 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FBGA (42.5x42.5)
Architecture: MCU, FPGA
товар відсутній
| 1SX280HN3F43E2VGS3 |
Виробник: Intel
Description: IC FPGA STRATIX 10 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FBGA (42.5x42.5)
Architecture: MCU, FPGA
Description: IC FPGA STRATIX 10 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FBGA (42.5x42.5)
Architecture: MCU, FPGA
товар відсутній
| 1SX280HU1F50E2LGS3 |
Виробник: Intel
Description: IC FPGA STRATIX 10 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Description: IC FPGA STRATIX 10 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
товар відсутній
| EP1K10FC256-1 |
|
Виробник: Intel
Description: IC FPGA 136 I/O 256FBGA
Packaging: Tray
Package / Case: 256-BGA
Mounting Type: Surface Mount
Number of Gates: 56000
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 2.375V ~ 2.625V
Number of Logic Elements/Cells: 576
Supplier Device Package: 256-FBGA (17x17)
Number of LABs/CLBs: 72
Total RAM Bits: 12288
Number of I/O: 136
DigiKey Programmable: Not Verified
Description: IC FPGA 136 I/O 256FBGA
Packaging: Tray
Package / Case: 256-BGA
Mounting Type: Surface Mount
Number of Gates: 56000
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 2.375V ~ 2.625V
Number of Logic Elements/Cells: 576
Supplier Device Package: 256-FBGA (17x17)
Number of LABs/CLBs: 72
Total RAM Bits: 12288
Number of I/O: 136
DigiKey Programmable: Not Verified
товар відсутній
| EPM7512BBC256-10 |
|
Виробник: Intel
Description: IC CPLD 512MC 10NS 256BGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Gates: 10000
Number of Macrocells: 512
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 10 ns
Supplier Device Package: 256-BGA (27x27)
Number of Logic Elements/Blocks: 32
Voltage Supply - Internal: 2.375V ~ 2.625V
Number of I/O: 212
DigiKey Programmable: Not Verified
Description: IC CPLD 512MC 10NS 256BGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Gates: 10000
Number of Macrocells: 512
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 10 ns
Supplier Device Package: 256-BGA (27x27)
Number of Logic Elements/Blocks: 32
Voltage Supply - Internal: 2.375V ~ 2.625V
Number of I/O: 212
DigiKey Programmable: Not Verified
товар відсутній
| EPM7512BBC256-7 |
|
Виробник: Intel
Description: IC CPLD 512MC 7.5NS 256BGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Gates: 10000
Number of Macrocells: 512
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 7.5 ns
Supplier Device Package: 256-BGA (27x27)
Number of Logic Elements/Blocks: 32
Voltage Supply - Internal: 2.375V ~ 2.625V
Number of I/O: 212
DigiKey Programmable: Not Verified
Description: IC CPLD 512MC 7.5NS 256BGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Gates: 10000
Number of Macrocells: 512
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 7.5 ns
Supplier Device Package: 256-BGA (27x27)
Number of Logic Elements/Blocks: 32
Voltage Supply - Internal: 2.375V ~ 2.625V
Number of I/O: 212
DigiKey Programmable: Not Verified
товар відсутній
| EP4SGX180DF29C4G |
Виробник: Intel
Description: IC FPGA 372 I/O 780FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Description: IC FPGA 372 I/O 780FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
товар відсутній
| EP4SGX180FF35C4G |
Виробник: Intel
Description: IC FPGA 564 I/O 1152FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Description: IC FPGA 564 I/O 1152FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
товар відсутній
| EP4SGX180HF35C4G |
Виробник: Intel
Description: IC FPGA 564 I/O 1152FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Description: IC FPGA 564 I/O 1152FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
товар відсутній
| EP4SGX180KF40C4G |
Виробник: Intel
Description: IC FPGA 744 I/O 1517FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Description: IC FPGA 744 I/O 1517FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
товар відсутній
| EP4SGX180DF29I4G |
Виробник: Intel
Description: IC FPGA 372 I/O 780FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Description: IC FPGA 372 I/O 780FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
товар відсутній
| EP4SGX180DF29C3G |
Виробник: Intel
Description: IC FPGA 372 I/O 780FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Description: IC FPGA 372 I/O 780FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
товар відсутній
| EP4SGX180FF35I4G |
Виробник: Intel
Description: IC FPGA 564 I/O 1152FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Description: IC FPGA 564 I/O 1152FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
товар відсутній
| EP4SGX180FF35C3G |
Виробник: Intel
Description: IC FPGA 564 I/O 1152FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Description: IC FPGA 564 I/O 1152FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
товар відсутній
| EP4SGX180HF35I4G |
Виробник: Intel
Description: IC FPGA 564 I/O 1152FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Description: IC FPGA 564 I/O 1152FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
товар відсутній
| EP4SGX180HF35C3G |
Виробник: Intel
Description: IC FPGA 564 I/O 1152FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Description: IC FPGA 564 I/O 1152FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
товар відсутній
| EP4SGX180KF40C3G |
Виробник: Intel
Description: IC FPGA 744 I/O 1517FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Description: IC FPGA 744 I/O 1517FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
товар відсутній
| EP4SGX180KF40I4G |
Виробник: Intel
Description: IC FPGA 744 I/O 1517FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Description: IC FPGA 744 I/O 1517FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
товар відсутній
| EP4SGX180DF29I3G |
Виробник: Intel
Description: IC FPGA 372 I/O 780FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Description: IC FPGA 372 I/O 780FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
товар відсутній
| EP4SGX180DF29C2XG |
Виробник: Intel
Description: IC FPGA 372 I/O 780FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Description: IC FPGA 372 I/O 780FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
товар відсутній
| EP4SGX180FF35C2XG |
Виробник: Intel
Description: IC FPGA 564 I/O 1152FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Description: IC FPGA 564 I/O 1152FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
товар відсутній
| EP4SGX180FF35I3G |
Виробник: Intel
Description: IC FPGA 564 I/O 1152FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Description: IC FPGA 564 I/O 1152FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
товар відсутній
| EP4SGX180HF35I3G |
Виробник: Intel
Description: IC FPGA 564 I/O 1152FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Description: IC FPGA 564 I/O 1152FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
товар відсутній
| EP4SGX180HF35C2G |
Виробник: Intel
Description: IC FPGA 564 I/O 1152FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Description: IC FPGA 564 I/O 1152FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
товар відсутній
| EP4SGX180KF40C2G |
Виробник: Intel
Description: IC FPGA 744 I/O 1517FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Description: IC FPGA 744 I/O 1517FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
товар відсутній
| EP4SGX180KF40I3G |
Виробник: Intel
Description: IC FPGA 744 I/O 1517FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Description: IC FPGA 744 I/O 1517FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
товар відсутній
| EPF10K200SRC240-1X |
|
Виробник: Intel
Description: IC FPGA 182 I/O 240RQFP
Packaging: Tray
Package / Case: 240-BFQFP Exposed Pad
Mounting Type: Surface Mount
Number of Gates: 513000
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 2.375V ~ 2.625V
Number of Logic Elements/Cells: 9984
Supplier Device Package: 240-RQFP (32x32)
Number of LABs/CLBs: 1248
Total RAM Bits: 98304
Number of I/O: 182
DigiKey Programmable: Not Verified
Description: IC FPGA 182 I/O 240RQFP
Packaging: Tray
Package / Case: 240-BFQFP Exposed Pad
Mounting Type: Surface Mount
Number of Gates: 513000
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 2.375V ~ 2.625V
Number of Logic Elements/Cells: 9984
Supplier Device Package: 240-RQFP (32x32)
Number of LABs/CLBs: 1248
Total RAM Bits: 98304
Number of I/O: 182
DigiKey Programmable: Not Verified
товар відсутній
| EPF10K200SFC484-3 |
|
Виробник: Intel
Description: IC FPGA 369 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BBGA
Mounting Type: Surface Mount
Number of Gates: 513000
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 2.375V ~ 2.625V
Number of Logic Elements/Cells: 9984
Supplier Device Package: 484-FBGA (23x23)
Number of LABs/CLBs: 1248
Total RAM Bits: 98304
Number of I/O: 369
DigiKey Programmable: Not Verified
Description: IC FPGA 369 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BBGA
Mounting Type: Surface Mount
Number of Gates: 513000
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 2.375V ~ 2.625V
Number of Logic Elements/Cells: 9984
Supplier Device Package: 484-FBGA (23x23)
Number of LABs/CLBs: 1248
Total RAM Bits: 98304
Number of I/O: 369
DigiKey Programmable: Not Verified
товар відсутній
| EPF10K200SRC240-2 |
|
Виробник: Intel
Description: IC FPGA 182 I/O 240RQFP
Packaging: Tray
Package / Case: 240-BFQFP Exposed Pad
Mounting Type: Surface Mount
Number of Gates: 513000
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 2.375V ~ 2.625V
Number of Logic Elements/Cells: 9984
Supplier Device Package: 240-RQFP (32x32)
Number of LABs/CLBs: 1248
Total RAM Bits: 98304
Number of I/O: 182
DigiKey Programmable: Not Verified
Description: IC FPGA 182 I/O 240RQFP
Packaging: Tray
Package / Case: 240-BFQFP Exposed Pad
Mounting Type: Surface Mount
Number of Gates: 513000
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 2.375V ~ 2.625V
Number of Logic Elements/Cells: 9984
Supplier Device Package: 240-RQFP (32x32)
Number of LABs/CLBs: 1248
Total RAM Bits: 98304
Number of I/O: 182
DigiKey Programmable: Not Verified
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