| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна без ПДВ |
|---|---|---|---|---|---|
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5ASXBB5D4F40C5N | Intel |
 Description: IC SOC CORTEX-A9 800MHZ 1517FBGAPackaging: Tray Package / Case: 1517-BBGA, FCBGA Speed: 800MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 462K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 1517-FBGA, FC (40x40) Architecture: MCU, FPGA |
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| 5ASXBB5D6F40C6N | Intel |
Description: IC SOC CORTEX-A9 700MHZ 1517FBGA Packaging: Tray Package / Case: 1517-BBGA, FCBGA Speed: 700MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 462K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 1517-FBGA, FC (40x40) Architecture: MCU, FPGA |
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5ASXFB3G4F35C4N | Intel |
Description: IC SOC CORTEX-A9 925MHZ 1152FBGA |
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5ASXFB3G4F35C5N | Intel |
Description: IC SOC CORTEX-A9 800MHZ 1152FBGA |
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5ASXFB3G4F35C6N | Intel |
Description: IC SOC CORTEX-A9 700MHZ 1152FBGA |
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5ASXFB3G4F35I3N | Intel |
Description: IC SOC CORTEX-A9 1.05GHZ 1152BGA |
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5ASXFB3G4F35I5N | Intel |
Description: IC SOC CORTEX-A9 800MHZ 1152FBGA |
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5ASXFB3G6F35C6N | Intel |
Description: IC SOC CORTEX-A9 700MHZ 1152FBGA |
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| 5ASXFB3H4F40C4N | Intel |
Description: IC SOC CORTEX-A9 925MHZ 1517FBGA |
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| 5ASXFB3H4F40C5N | Intel |
Description: IC SOC CORTEX-A9 800MHZ 1517FBGA |
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| 5ASXFB3H4F40C6N | Intel |
Description: IC SOC CORTEX-A9 700MHZ 1517FBGA |
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| 5ASXFB3H4F40I3N | Intel |
Description: IC SOC CORTEX-A9 1.05GHZ 1517BGA |
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| 5ASXFB3H4F40I5N | Intel |
Description: IC SOC CORTEX-A9 800MHZ 1517FBGA |
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5ASXFB5G4F35C5N | Intel |
Description: IC SOC CORTEX-A9 800MHZ 1152FBGA |
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5ASXFB5G4F35I5N | Intel |
Description: IC SOC CORTEX-A9 800MHZ 1152FBGA Packaging: Tray Package / Case: 1152-BBGA, FCBGA Speed: 800MHz RAM Size: 64KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 462K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 1152-FBGA, FC (35x35) Architecture: MCU, FPGA |
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| 5ASXFB5G6F35C6N | Intel |
Description: IC SOC CORTEX-A9 700MHZ 1152FBGA Packaging: Tray Package / Case: 1152-BBGA, FCBGA Speed: 700MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 462K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 1152-FBGA, FC (35x35) Architecture: MCU, FPGA |
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5ASXFB5H4F40C4N | Intel |
Description: IC SOC CORTEX-A9 925MHZ 1517FBGA Packaging: Tray Package / Case: 1517-BBGA, FCBGA Speed: 925MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 462K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 1517-FBGA, FC (40x40) Architecture: MCU, FPGA |
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| 5ASXFB5H4F40C5N | Intel |
Description: IC SOC CORTEX-A9 800MHZ 1517FBGA |
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| 5ASXFB5H4F40C6N | Intel |
Description: IC SOC CORTEX-A9 700MHZ 1517FBGA |
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5ASXFB5H4F40I3N | Intel |
Description: IC SOC CORTEX-A9 1.05GHZ 1517BGA Packaging: Tray Package / Case: 1517-BBGA, FCBGA Speed: 1.05GHz RAM Size: 64KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 462K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 1517-FBGA, FC (40x40) Architecture: MCU, FPGA |
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| 5ASXFB5H4F40I5N | Intel |
Description: IC SOC CORTEX-A9 800MHZ 1517FBGA |
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5ASXFB5H6F40C6N | Intel |
Description: IC SOC CORTEX-A9 700MHZ 1517FBGA Packaging: Tray Package / Case: 1517-BBGA, FCBGA Speed: 700MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 462K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 1517-FBGA, FC (40x40) Architecture: MCU, FPGA |
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| 5ASXFB5H6F40C6NES | Intel |
Description: IC SOC CORTEX-A9 700MHZ 1517FBGA |
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5ASXMB3E4F31C4N | Intel |
Description: IC SOC CORTEX-A9 925MHZ 896FBGA Packaging: Tray Package / Case: 896-BBGA, FCBGA Speed: 925MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 350K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 896-FBGA, FC (31x31) Architecture: MCU, FPGA |
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5ASXMB3E4F31I5N | Intel |
Description: IC SOC CORTEX-A9 800MHZ 896FBGA Packaging: Tray Package / Case: 896-BBGA, FCBGA Speed: 800MHz RAM Size: 64KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 350K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 896-FBGA, FC (31x31) Architecture: MCU, FPGA |
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5ASXMB3E6F31C6N | Intel |
Description: IC SOC CORTEX-A9 700MHZ 896FBGA Packaging: Tray Package / Case: 896-BBGA, FCBGA Speed: 700MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 350K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 896-FBGA, FC (31x31) Architecture: MCU, FPGA |
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| 5ASXMB3G4F40C4N | Intel |
Description: IC SOC CORTEX-A9 925MHZ 1517FBGA Packaging: Tray Package / Case: 1517-BBGA, FCBGA Speed: 925MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 350K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 1517-FBGA, FC (40x40) Architecture: MCU, FPGA |
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5ASXMB5E4F31I5N | Intel |
Description: IC SOC CORTEX-A9 800MHZ 896FBGA Packaging: Tray Package / Case: 896-BBGA, FCBGA Speed: 800MHz RAM Size: 64KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 462K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 896-FBGA, FC (31x31) Architecture: MCU, FPGA |
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5ASXFB5G4F35I3N | Intel |
Description: IC SOC CORTEX-A9 1.05GHZ 1152BGA |
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| 5ASXMB5G4F40C4N | Intel |
Description: IC SOC CORTEX-A9 925MHZ 1517FBGA Packaging: Tray Package / Case: 1517-BBGA, FCBGA Speed: 925MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 462K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 1517-FBGA, FC (40x40) Architecture: MCU, FPGA |
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5CSXFC6C6U23I7NES | Intel |
Description: IC SOC CORTEX-A9 800MHZ 672UBGA Packaging: Tray Package / Case: 672-FBGA Speed: 800MHz RAM Size: 64KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 110K Logic Elements Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 672-UBGA (23x23) Architecture: MCU, FPGA Part Status: Obsolete |
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EP20K30ETC144-1X | Intel |
Description: IC FPGA 92 I/O 144TQFP |
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| 5ASXFB3H6F40C6N | Intel |
Description: IC SOC CORTEX-A9 700MHZ 1517FBGA |
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| 5ASXMB3G4F40C5N | Intel |
Description: IC SOC CORTEX-A9 800MHZ 1517FBGA Packaging: Tray Package / Case: 1517-BBGA, FCBGA Speed: 800MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 350K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 1517-FBGA, FC (40x40) Architecture: MCU, FPGA |
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5ASXFB5G4F35C4N | Intel |
Description: IC SOC CORTEX-A9 925MHZ 1152FBGA |
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| 5ASTFD5K3F40I5N | Intel |
Description: IC SOC CORTEX-A9 800MHZ 1517FBGA |
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5ASXFB5G4F35C6N | Intel |
Description: IC SOC CORTEX-A9 700MHZ 1152FBGA |
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5CGXFC9A6U19A7N | Intel |
Description: IC FPGA 240 I/O 484UBGA |
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| DK-100G-5SGXEA7N | Intel |
Description: KIT DEV 100G STRATIX V GX Packaging: Bulk For Use With/Related Products: 5SGXEA7 Type: FPGA Contents: Board(s) Platform: Stratix V GX FPGA 100G |
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| DK-AS-5SGXEA7N | Intel |
Description: KIT DEV STRATIX VGX W/ QII Packaging: Bulk For Use With/Related Products: 5SGXEA7 Type: FPGA Contents: Board(s) Platform: Stratix V GX FPGA |
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SW-QII-SEPARATION | Intel |
Description: DEV SOFTWARE W/QUARTUS II |
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| ESW-SOCEDS-DS5-FIX | Intel |
Description: DEV SOFTWARE |
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10AS066H2F34I2SGES | Intel |
Description: IC SOC CORTEX-A9 1.5GHZ 1152FBGA Packaging: Tray Package / Case: 1152-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 660K Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 1152-FBGA, FC (35x35) Architecture: MCU, FPGA Part Status: Discontinued at Digi-Key |
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| DK-100G-5SGXEA7NES | Intel |
Description: KIT DEVELOPMENT STRATIX V GX Packaging: Box For Use With/Related Products: 5SGXEA7 Type: FPGA Contents: Board(s) Platform: Stratix V GX FPGA 100G |
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| DK-DEV-3SL150N/ES | Intel |
Description: KIT DEVELOPMENT STRATIX II ES Packaging: Box For Use With/Related Products: EP3SL150 Type: FPGA Contents: Board(s), Cable(s) Platform: Cyclone III L FPGA |
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| DK-DEV-5CEA7N/P | Intel |
Description: KIT DEVELOPMENT CYCLONE V E Packaging: Box For Use With/Related Products: 5CEFA7 Type: FPGA Contents: Board(s), Cable(s), Power Supply Platform: Cyclone V E FPGA |
товар відсутній |
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| DK-DEV-5CEA7NESP | Intel |
Description: KIT DEVELOPMENT CYCLONE V E Packaging: Box For Use With/Related Products: 5CEFA7 Type: FPGA Contents: Board(s), Cable(s), Power Supply Platform: Cyclone V E FPGA |
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| DK-DEV-5CGXC7NES/P | Intel |
Description: KIT DEVELOPMENT CYCLONE V GX Packaging: Box For Use With/Related Products: 5CGXFC7 Type: FPGA Contents: Board(s) Platform: Cyclone V GX FPGA |
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| DK-START-4CGX15N/P | Intel |
Description: KIT DEVELOPMENT CYCLONE IV GX Packaging: Box For Use With/Related Products: EP4CGX15 Type: FPGA Contents: Board(s), Cable(s), Power Supply Platform: Cyclone IV GX FPGA PCIe Card |
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| PLED610 | Intel |
Description: PROG ADAPTER FOR EP600/610 |
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| PLES610 | Intel |
Description: SOIC ADAPTER FOR EP610S Packaging: Box For Use With/Related Products: Altera Devices Module/Board Type: Socket Adapter |
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| PLMB7000-256 | Intel |
Description: SPECIAL ADAPTER FOR EMC Packaging: Box For Use With/Related Products: Altera Devices Module/Board Type: Socket Adapter Part Status: Obsolete |
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| PLMF3000-256 | Intel | Description: PKG PROG ADAPTER FBGA256 MAX3K |
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| PLMG9000-280 | Intel |
Description: PLMG9000-280 Packaging: Box For Use With/Related Products: Altera Devices Module/Board Type: Socket Adapter Part Status: Obsolete |
товар відсутній |
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| PLMJ3000-44 | Intel |
Description: PROG ADAPTER FOR 3000A Packaging: Box For Use With/Related Products: Altera Devices Module/Board Type: Socket Adapter |
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| PLMJ7000-68 | Intel |
Description: PROG ADAPTER MAX7 68 PIN |
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| PLMJ7000-84 | Intel |
Description: PROG ADAPTER MAX7 84 PIN J-LD |
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| PLMJ9400-84 | Intel |
Description: MAX 9400 84-PIN J-LD ADAPTER |
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| PLMQ7000-100 | Intel |
Description: PROG ADAPTER MAX7 100 PIN QFP |
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| PLMQ7000-100NC | Intel |
Description: MAX7K/7KS 100PIN QFP ADAPTER |
товар відсутній |
| 5ASXBB5D4F40C5N |
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Виробник: Intel
Description: IC SOC CORTEX-A9 800MHZ 1517FBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 462K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 1517-FBGA, FC (40x40)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A9 800MHZ 1517FBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 462K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 1517-FBGA, FC (40x40)
Architecture: MCU, FPGA
товар відсутній
| 5ASXBB5D6F40C6N |
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Виробник: Intel
Description: IC SOC CORTEX-A9 700MHZ 1517FBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Speed: 700MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 462K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 1517-FBGA, FC (40x40)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A9 700MHZ 1517FBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Speed: 700MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 462K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 1517-FBGA, FC (40x40)
Architecture: MCU, FPGA
товар відсутній
| 5ASXFB5G4F35I5N |
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Виробник: Intel
Description: IC SOC CORTEX-A9 800MHZ 1152FBGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 462K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 1152-FBGA, FC (35x35)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A9 800MHZ 1152FBGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 462K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 1152-FBGA, FC (35x35)
Architecture: MCU, FPGA
товар відсутній
| 5ASXFB5G6F35C6N |
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Виробник: Intel
Description: IC SOC CORTEX-A9 700MHZ 1152FBGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Speed: 700MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 462K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 1152-FBGA, FC (35x35)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A9 700MHZ 1152FBGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Speed: 700MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 462K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 1152-FBGA, FC (35x35)
Architecture: MCU, FPGA
товар відсутній
| 5ASXFB5H4F40C4N |
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Виробник: Intel
Description: IC SOC CORTEX-A9 925MHZ 1517FBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Speed: 925MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 462K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 1517-FBGA, FC (40x40)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A9 925MHZ 1517FBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Speed: 925MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 462K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 1517-FBGA, FC (40x40)
Architecture: MCU, FPGA
товар відсутній
| 5ASXFB5H4F40I3N |
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Виробник: Intel
Description: IC SOC CORTEX-A9 1.05GHZ 1517BGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Speed: 1.05GHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 462K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 1517-FBGA, FC (40x40)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A9 1.05GHZ 1517BGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Speed: 1.05GHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 462K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 1517-FBGA, FC (40x40)
Architecture: MCU, FPGA
товар відсутній
| 5ASXFB5H6F40C6N |
|
Виробник: Intel
Description: IC SOC CORTEX-A9 700MHZ 1517FBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Speed: 700MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 462K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 1517-FBGA, FC (40x40)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A9 700MHZ 1517FBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Speed: 700MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 462K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 1517-FBGA, FC (40x40)
Architecture: MCU, FPGA
товар відсутній
| 5ASXMB3E4F31C4N |
|
Виробник: Intel
Description: IC SOC CORTEX-A9 925MHZ 896FBGA
Packaging: Tray
Package / Case: 896-BBGA, FCBGA
Speed: 925MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 350K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 896-FBGA, FC (31x31)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A9 925MHZ 896FBGA
Packaging: Tray
Package / Case: 896-BBGA, FCBGA
Speed: 925MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 350K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 896-FBGA, FC (31x31)
Architecture: MCU, FPGA
товар відсутній
| 5ASXMB3E4F31I5N |
|
Виробник: Intel
Description: IC SOC CORTEX-A9 800MHZ 896FBGA
Packaging: Tray
Package / Case: 896-BBGA, FCBGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 350K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 896-FBGA, FC (31x31)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A9 800MHZ 896FBGA
Packaging: Tray
Package / Case: 896-BBGA, FCBGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 350K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 896-FBGA, FC (31x31)
Architecture: MCU, FPGA
товар відсутній
| 5ASXMB3E6F31C6N |
|
Виробник: Intel
Description: IC SOC CORTEX-A9 700MHZ 896FBGA
Packaging: Tray
Package / Case: 896-BBGA, FCBGA
Speed: 700MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 350K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 896-FBGA, FC (31x31)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A9 700MHZ 896FBGA
Packaging: Tray
Package / Case: 896-BBGA, FCBGA
Speed: 700MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 350K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 896-FBGA, FC (31x31)
Architecture: MCU, FPGA
товар відсутній
| 5ASXMB3G4F40C4N |
|
Виробник: Intel
Description: IC SOC CORTEX-A9 925MHZ 1517FBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Speed: 925MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 350K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 1517-FBGA, FC (40x40)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A9 925MHZ 1517FBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Speed: 925MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 350K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 1517-FBGA, FC (40x40)
Architecture: MCU, FPGA
товар відсутній
| 5ASXMB5E4F31I5N |
|
Виробник: Intel
Description: IC SOC CORTEX-A9 800MHZ 896FBGA
Packaging: Tray
Package / Case: 896-BBGA, FCBGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 462K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 896-FBGA, FC (31x31)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A9 800MHZ 896FBGA
Packaging: Tray
Package / Case: 896-BBGA, FCBGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 462K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 896-FBGA, FC (31x31)
Architecture: MCU, FPGA
товар відсутній
| 5ASXMB5G4F40C4N |
|
Виробник: Intel
Description: IC SOC CORTEX-A9 925MHZ 1517FBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Speed: 925MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 462K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 1517-FBGA, FC (40x40)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A9 925MHZ 1517FBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Speed: 925MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 462K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 1517-FBGA, FC (40x40)
Architecture: MCU, FPGA
товар відсутній
| 5CSXFC6C6U23I7NES |
|
Виробник: Intel
Description: IC SOC CORTEX-A9 800MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 110K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Part Status: Obsolete
Description: IC SOC CORTEX-A9 800MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 110K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Part Status: Obsolete
товар відсутній
| 5ASXMB3G4F40C5N |
|
Виробник: Intel
Description: IC SOC CORTEX-A9 800MHZ 1517FBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 350K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 1517-FBGA, FC (40x40)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A9 800MHZ 1517FBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 350K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 1517-FBGA, FC (40x40)
Architecture: MCU, FPGA
товар відсутній
| DK-100G-5SGXEA7N |
|
Виробник: Intel
Description: KIT DEV 100G STRATIX V GX
Packaging: Bulk
For Use With/Related Products: 5SGXEA7
Type: FPGA
Contents: Board(s)
Platform: Stratix V GX FPGA 100G
Description: KIT DEV 100G STRATIX V GX
Packaging: Bulk
For Use With/Related Products: 5SGXEA7
Type: FPGA
Contents: Board(s)
Platform: Stratix V GX FPGA 100G
товар відсутній
| DK-AS-5SGXEA7N |
|
Виробник: Intel
Description: KIT DEV STRATIX VGX W/ QII
Packaging: Bulk
For Use With/Related Products: 5SGXEA7
Type: FPGA
Contents: Board(s)
Platform: Stratix V GX FPGA
Description: KIT DEV STRATIX VGX W/ QII
Packaging: Bulk
For Use With/Related Products: 5SGXEA7
Type: FPGA
Contents: Board(s)
Platform: Stratix V GX FPGA
товар відсутній
| 10AS066H2F34I2SGES |
|
Виробник: Intel
Description: IC SOC CORTEX-A9 1.5GHZ 1152FBGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 660K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 1152-FBGA, FC (35x35)
Architecture: MCU, FPGA
Part Status: Discontinued at Digi-Key
Description: IC SOC CORTEX-A9 1.5GHZ 1152FBGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 660K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 1152-FBGA, FC (35x35)
Architecture: MCU, FPGA
Part Status: Discontinued at Digi-Key
товар відсутній
| DK-100G-5SGXEA7NES |
|
Виробник: Intel
Description: KIT DEVELOPMENT STRATIX V GX
Packaging: Box
For Use With/Related Products: 5SGXEA7
Type: FPGA
Contents: Board(s)
Platform: Stratix V GX FPGA 100G
Description: KIT DEVELOPMENT STRATIX V GX
Packaging: Box
For Use With/Related Products: 5SGXEA7
Type: FPGA
Contents: Board(s)
Platform: Stratix V GX FPGA 100G
товар відсутній
| DK-DEV-3SL150N/ES |
|
Виробник: Intel
Description: KIT DEVELOPMENT STRATIX II ES
Packaging: Box
For Use With/Related Products: EP3SL150
Type: FPGA
Contents: Board(s), Cable(s)
Platform: Cyclone III L FPGA
Description: KIT DEVELOPMENT STRATIX II ES
Packaging: Box
For Use With/Related Products: EP3SL150
Type: FPGA
Contents: Board(s), Cable(s)
Platform: Cyclone III L FPGA
товар відсутній
| DK-DEV-5CEA7N/P |
|
Виробник: Intel
Description: KIT DEVELOPMENT CYCLONE V E
Packaging: Box
For Use With/Related Products: 5CEFA7
Type: FPGA
Contents: Board(s), Cable(s), Power Supply
Platform: Cyclone V E FPGA
Description: KIT DEVELOPMENT CYCLONE V E
Packaging: Box
For Use With/Related Products: 5CEFA7
Type: FPGA
Contents: Board(s), Cable(s), Power Supply
Platform: Cyclone V E FPGA
товар відсутній
| DK-DEV-5CEA7NESP |
|
Виробник: Intel
Description: KIT DEVELOPMENT CYCLONE V E
Packaging: Box
For Use With/Related Products: 5CEFA7
Type: FPGA
Contents: Board(s), Cable(s), Power Supply
Platform: Cyclone V E FPGA
Description: KIT DEVELOPMENT CYCLONE V E
Packaging: Box
For Use With/Related Products: 5CEFA7
Type: FPGA
Contents: Board(s), Cable(s), Power Supply
Platform: Cyclone V E FPGA
товар відсутній
| DK-DEV-5CGXC7NES/P |
|
Виробник: Intel
Description: KIT DEVELOPMENT CYCLONE V GX
Packaging: Box
For Use With/Related Products: 5CGXFC7
Type: FPGA
Contents: Board(s)
Platform: Cyclone V GX FPGA
Description: KIT DEVELOPMENT CYCLONE V GX
Packaging: Box
For Use With/Related Products: 5CGXFC7
Type: FPGA
Contents: Board(s)
Platform: Cyclone V GX FPGA
товар відсутній
| DK-START-4CGX15N/P |
|
Виробник: Intel
Description: KIT DEVELOPMENT CYCLONE IV GX
Packaging: Box
For Use With/Related Products: EP4CGX15
Type: FPGA
Contents: Board(s), Cable(s), Power Supply
Platform: Cyclone IV GX FPGA PCIe Card
Description: KIT DEVELOPMENT CYCLONE IV GX
Packaging: Box
For Use With/Related Products: EP4CGX15
Type: FPGA
Contents: Board(s), Cable(s), Power Supply
Platform: Cyclone IV GX FPGA PCIe Card
товар відсутній
| PLES610 |
|
Виробник: Intel
Description: SOIC ADAPTER FOR EP610S
Packaging: Box
For Use With/Related Products: Altera Devices
Module/Board Type: Socket Adapter
Description: SOIC ADAPTER FOR EP610S
Packaging: Box
For Use With/Related Products: Altera Devices
Module/Board Type: Socket Adapter
товар відсутній
| PLMB7000-256 |
|
Виробник: Intel
Description: SPECIAL ADAPTER FOR EMC
Packaging: Box
For Use With/Related Products: Altera Devices
Module/Board Type: Socket Adapter
Part Status: Obsolete
Description: SPECIAL ADAPTER FOR EMC
Packaging: Box
For Use With/Related Products: Altera Devices
Module/Board Type: Socket Adapter
Part Status: Obsolete
товар відсутній
| PLMG9000-280 |
|
Виробник: Intel
Description: PLMG9000-280
Packaging: Box
For Use With/Related Products: Altera Devices
Module/Board Type: Socket Adapter
Part Status: Obsolete
Description: PLMG9000-280
Packaging: Box
For Use With/Related Products: Altera Devices
Module/Board Type: Socket Adapter
Part Status: Obsolete
товар відсутній
| PLMJ3000-44 |
|
Виробник: Intel
Description: PROG ADAPTER FOR 3000A
Packaging: Box
For Use With/Related Products: Altera Devices
Module/Board Type: Socket Adapter
Description: PROG ADAPTER FOR 3000A
Packaging: Box
For Use With/Related Products: Altera Devices
Module/Board Type: Socket Adapter
товар відсутній