0430450618 Molex
на замовлення 41800 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1800+ | 85.11 грн |
| 5400+ | 71.91 грн |
| 10800+ | 65.22 грн |
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Технічний опис 0430450618 Molex
Description: CONN HEADER SMD 6POS 3MM, Packaging: Tape & Reel (TR), Features: Solder Retention, Connector Type: Header, Voltage Rating: 600V, Current Rating (Amps): Varies by Wire Gauge, Mounting Type: Surface Mount, Number of Positions: 6, Number of Rows: 2, Style: Board to Cable/Wire, Operating Temperature: -40°C ~ 105°C, Contact Type: Male Pin, Fastening Type: Locking Ramp, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Contact Material: Brass Alloy, Insulation Color: Black, Pitch - Mating: 0.118" (3.00mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 60.0µin (1.52µm), Contact Finish - Post: Tin, Part Status: Active, Contact Shape: Square, Insulation Height: 0.390" (9.91mm), Shrouding: Shrouded - 4 Wall, Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled, Row Spacing - Mating: 0.118" (3.00mm).
Інші пропозиції 0430450618 за ціною від 102.74 грн до 248.82 грн
| Фото | Назва | Виробник | Інформація |
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0430450618 | Виробник : Molex |
 Conn Wire to Board HDR 6Power POS 3mm Solder ST Top Entry SMD Micro-Fit 3.0 T/R |
на замовлення 386 шт: термін постачання 21-31 дні (днів) |
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0430450618 | Виробник : Molex |
Description: CONN HEADER SMD 6POS 3MM Packaging: Tape & Reel (TR) Features: Solder Retention Connector Type: Header Voltage Rating: 600V Current Rating (Amps): Varies by Wire Gauge Mounting Type: Surface Mount Number of Positions: 6 Number of Rows: 2 Style: Board to Cable/Wire Operating Temperature: -40°C ~ 105°C Contact Type: Male Pin Fastening Type: Locking Ramp Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Brass Alloy Insulation Color: Black Pitch - Mating: 0.118" (3.00mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 60.0µin (1.52µm) Contact Finish - Post: Tin Part Status: Active Contact Shape: Square Insulation Height: 0.390" (9.91mm) Shrouding: Shrouded - 4 Wall Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled Row Spacing - Mating: 0.118" (3.00mm) |
на замовлення 28400 шт: термін постачання 21-31 дні (днів) |
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0430450618 | Виробник : Molex |
Description: CONN HEADER SMD 6POS 3MM Features: Solder Retention Packaging: Cut Tape (CT) Connector Type: Header Voltage Rating: 600V Current Rating (Amps): Varies by Wire Gauge Mounting Type: Surface Mount Number of Positions: 6 Number of Rows: 2 Style: Board to Cable/Wire Operating Temperature: -40°C ~ 105°C Contact Type: Male Pin Fastening Type: Locking Ramp Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Brass Alloy Insulation Color: Black Pitch - Mating: 0.118" (3.00mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 60.0µin (1.52µm) Contact Finish - Post: Tin Part Status: Active Contact Shape: Square Insulation Height: 0.390" (9.91mm) Shrouding: Shrouded - 4 Wall Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled Row Spacing - Mating: 0.118" (3.00mm) |
на замовлення 28682 шт: термін постачання 21-31 дні (днів) |
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0430450618 | Виробник : Molex |
Conn Wire to Board HDR 6Power POS 3mm Solder ST Top Entry SMD Micro-Fit 3.0 T/R |
товар відсутній |