Результат пошуку "0501773" : 4
Вид перегляду :
Мінімальне замовлення: 6
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна без ПДВ |
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4820-3000-CP | 3M |
 Description: CONN IC DIP SOCKET 20POS TINFeatures: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -25°C ~ 85°C Number of Positions or Pins (Grid): 20 (2 x 10) Termination: Solder Housing Material: Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 35.4µin (0.90µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 35.0µin (0.90µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
на замовлення 7020 шт: термін постачання 21-31 дні (днів) |
|
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| 4820-3000-CP | 3M Interconnect Solutions |
Conn DIP Socket SKT 20 POS 2.54mm Solder ST Thru-Hole Box |
товар відсутній |
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|
|
4820-3000-CP | 3M Interconnect Solutions |
Conn DIP Socket SKT 20 POS 2.54mm Solder ST Thru-Hole Box |
товар відсутній |
|||||||||||||||||
|
|
4820-3000-CP | 3M Interconnect Solutions |
Conn DIP Socket SKT 20 POS 2.54mm Solder ST Thru-Hole Box |
товар відсутній |
| 4820-3000-CP |
|
Виробник: 3M
Description: CONN IC DIP SOCKET 20POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: CONN IC DIP SOCKET 20POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
на замовлення 7020 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 6+ | 52.61 грн |
| 20+ | 42.89 грн |
| 40+ | 40.27 грн |
| 100+ | 36.14 грн |
| 260+ | 32.86 грн |
| 500+ | 29.57 грн |
| 1000+ | 25.86 грн |
| 2500+ | 23.43 грн |
| 4820-3000-CP |
|
Виробник: 3M Interconnect Solutions
Conn DIP Socket SKT 20 POS 2.54mm Solder ST Thru-Hole Box
Conn DIP Socket SKT 20 POS 2.54mm Solder ST Thru-Hole Box
товар відсутній
| 4820-3000-CP |
|
Виробник: 3M Interconnect Solutions
Conn DIP Socket SKT 20 POS 2.54mm Solder ST Thru-Hole Box
Conn DIP Socket SKT 20 POS 2.54mm Solder ST Thru-Hole Box
товар відсутній
| 4820-3000-CP |
|
Виробник: 3M Interconnect Solutions
Conn DIP Socket SKT 20 POS 2.54mm Solder ST Thru-Hole Box
Conn DIP Socket SKT 20 POS 2.54mm Solder ST Thru-Hole Box
товар відсутній