117-93-656-41-005000

117-93-656-41-005000 Mill-Max Manufacturing Corp.


2017-11%3A125.pdf Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 56POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 56 (2 x 28)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.070" (1.78mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.070" (1.78mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
на замовлення 70 шт:

термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1+682.12 грн
10+ 591.24 грн
25+ 556.98 грн
50+ 509.31 грн
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Технічний опис 117-93-656-41-005000 Mill-Max Manufacturing Corp.

Description: CONN IC DIP SOCKET 56POS GOLD, Features: Open Frame, Packaging: Tube, Mounting Type: Through Hole, Type: DIP, 0.6" (15.24mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 56 (2 x 28), Termination: Solder, Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Pitch - Mating: 0.070" (1.78mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.070" (1.78mm), Contact Finish - Post: Tin-Lead, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Material - Post: Brass Alloy, Part Status: Active.

Інші пропозиції 117-93-656-41-005000

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117-93-656-41-005000 Виробник : Mill-Max MMMC_S_A0003128386_1-2554734.pdf IC & Component Sockets 56 PIN SOLDER TAIL
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