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1SG250HH3F55E3XG

1SG250HH3F55E3XG Intel


10_GX_SX_Device_Overview.pdf Виробник: Intel
Description: IC FPGA 1160 I/O 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 2500000
Supplier Device Package: 2912-FBGA, FC (55x55)
Number of LABs/CLBs: 312500
Number of I/O: 1160
DigiKey Programmable: Not Verified
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Технічний опис 1SG250HH3F55E3XG Intel

Description: IC FPGA 1160 I/O 2912BGA, Packaging: Tray, Package / Case: 2912-BBGA, FCBGA, Mounting Type: Surface Mount, Operating Temperature: 0°C ~ 100°C (TJ), Voltage - Supply: 0.82V ~ 0.88V, Number of Logic Elements/Cells: 2500000, Supplier Device Package: 2912-FBGA, FC (55x55), Number of LABs/CLBs: 312500, Number of I/O: 1160, DigiKey Programmable: Not Verified.