Технічний опис 2180-6315-9UA-1902 3M Interconnect Solutions
Description: GRID ZIP 15 X 15, Features: Closed Frame, Packaging: Bulk, Mounting Type: Through Hole, Type: PGA, ZIF (ZIP), Operating Temperature: -55°C ~ 150°C, Number of Positions or Pins (Grid): 180 (15 x 15), Termination: Solder, Housing Material: Polyethersulfone (PES), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 30.0µin (0.76µm), Contact Material - Post: Beryllium Copper, Part Status: Discontinued at Digi-Key.
Інші пропозиції 2180-6315-9UA-1902
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна без ПДВ |
|---|---|---|---|---|---|
| 2180-6315-9UA-1902 | Виробник : 3M Interconnect Solutions |
 JE150906491 2180-6315-9UA-1902= GRID ZIP (15 X 15) |
товар відсутній |
||
 |
2180-6315-9UA-1902 | Виробник : 3M |
Description: GRID ZIP 15 X 15 Features: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: PGA, ZIF (ZIP) Operating Temperature: -55°C ~ 150°C Number of Positions or Pins (Grid): 180 (15 x 15) Termination: Solder Housing Material: Polyethersulfone (PES) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30.0µin (0.76µm) Contact Material - Post: Beryllium Copper Part Status: Discontinued at Digi-Key |
товар відсутній |