235-3019-51-0602 3M Interconnect Solutions

Description: CONN ZIG-ZAG ZIF 35POS GOLD, Features: Closed Frame, Packaging: Bulk, Mounting Type: Through Hole, Type: Zig-Zag, ZIF (ZIP), Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 35 (1 x 17, 1 x 18), Termination: Solder, Housing Material: Polysulfone (PSU), Glass Filled, Pitch - Mating: 0.050" (1.27mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 30.0µin (0.76µm), Contact Material - Post: Beryllium Copper.