2350616-1 TE Connectivity AMP Connectors
Виробник: TE Connectivity AMP ConnectorsDescription: DUAL LGA,250 POS, DMD SOCKET
Packaging: Tray
Features: Board Guide, Open Frame
Mounting Type: Surface Mount
Type: LGA
Operating Temperature: -25°C ~ 100°C
Number of Positions or Pins (Grid): 250 (16 x 25)
Termination: Solder
Housing Material: Thermoplastic
Pitch - Mating: 0.039" (1.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 3.00µin (0.076µm)
Contact Material - Mating: Copper Alloy
Part Status: Active
на замовлення 4140 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 10+ | 929.15 грн |
| 30+ | 861.88 грн |
| 150+ | 844.76 грн |
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Технічний опис 2350616-1 TE Connectivity AMP Connectors
Description: DUAL LGA,250 POS, DMD SOCKET, Packaging: Tray, Features: Board Guide, Open Frame, Mounting Type: Surface Mount, Type: LGA, Operating Temperature: -25°C ~ 100°C, Number of Positions or Pins (Grid): 250 (16 x 25), Termination: Solder, Housing Material: Thermoplastic, Pitch - Mating: 0.039" (1.00mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 3.00µin (0.076µm), Contact Material - Mating: Copper Alloy, Part Status: Active.
Інші пропозиції 2350616-1
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна без ПДВ |
|---|---|---|---|---|---|
| 2350616-1 | Виробник : TE Connectivity AMP Connectors |
Description: DUAL LGA,250 POS, DMD SOCKET Packaging: Tray Features: Board Guide, Open Frame Mounting Type: Surface Mount Type: LGA Operating Temperature: -25°C ~ 100°C Number of Positions or Pins (Grid): 250 (16 x 25) Termination: Solder Housing Material: Thermoplastic Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 3.00µin (0.076µm) Contact Material - Mating: Copper Alloy Part Status: Active |
товар відсутній |
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2350616-1 | Виробник : TE Connectivity |
Sockets & Adapters DUAL LGA,250 POS DMD SOCKET |
товар відсутній |