28-3551-18 Aries Electronics

Description: CONN IC DIP SOCKET ZIF 28POS, Features: Closed Frame, Packaging: Bulk, Mounting Type: Through Hole, Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing, Operating Temperature: -55°C ~ 250°C, Number of Positions or Pins (Grid): 28 (2 x 14), Termination: Solder, Housing Material: Polyetheretherketone (PEEK), Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Nickel Boron, Contact Finish Thickness - Mating: 50.0µin (1.27µm), Contact Material - Mating: Beryllium Nickel, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Nickel Boron, Contact Finish Thickness - Post: 50.0µin (1.27µm), Contact Material - Post: Beryllium Nickel, Part Status: Active.