Технічний опис 3-1571586-5 TE Connectivity
Description: CONN IC DIP SOCKET 64POS GOLD, Packaging: Tube, Features: Open Frame, Mounting Type: Through Hole, Type: DIP, 0.9" (22.86mm) Row Spacing, Operating Temperature: -55°C ~ 105°C, Number of Positions or Pins (Grid): 64 (2 x 32), Termination: Solder, Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 25.0µin (0.63µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 25.0µin (0.63µm), Contact Material - Post: Copper.
Інші пропозиції 3-1571586-5
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна без ПДВ |
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| 3-1571586-5 | Виробник : TE Connectivity AMP Connectors |
 Description: CONN IC DIP SOCKET 64POS GOLDPackaging: Tube Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.9" (22.86mm) Row Spacing Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 64 (2 x 32) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 25.0µin (0.63µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 25.0µin (0.63µm) Contact Material - Post: Copper |
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3-1571586-5 | Виробник : TE Connectivity |
IC & Component Sockets 864-AG11D-LF=800 DIP PCB,AU/SN |
товар відсутній |