Виробник: Phoenix Contact
Description: CBL CIRC 4POS MALE TO WIRE 3.28'
Packaging: Bulk
Color: Green
Length: 3.28' (1.00m)
Shielding: Shielded
Cable Type: Round
Usage: Cat5, Industrial Environments
Ingress Protection: IP65/IP67 - Dust Tight, Water Resistant, Waterproof
1st Connector Number of Positions Loaded: All
1st Connector Gender: Male Pins
1st Connector Shell Size - Insert: M12
1st Connector Orientation: D
1st Connector Mounting Type: Free Hanging (In-Line)
1st Connector Type: Receptacle
2nd Connector Type: Wire Leads
Assembly Configuration: Standard
Cable Material: Polyvinyl Chloride (PVC)
1st Connector Number of Positions: 4 (Data)

Виробник: YAGEO
Description: RES SMD 576 OHM 0.25% 1/16W 0402
Packaging: Tape & Reel (TR)
Power (Watts): 0.063W, 1/16W
Tolerance: ±0.25%
Package / Case: 0402 (1005 Metric)
Temperature Coefficient: ±100ppm/°C
Size / Dimension: 0.039" L x 0.020" W (1.00mm x 0.50mm)
Composition: Thin Film
Operating Temperature: -55°C ~ 155°C
Number of Terminations: 2
Supplier Device Package: 0402
Height - Seated (Max): 0.014" (0.35mm)
Resistance: 576 Ohms

Виробник: YAGEO
Description: RES SMD 5.76K OHM 1/16W 0402
Packaging: Tape & Reel (TR)
Power (Watts): 0.063W, 1/16W
Tolerance: ±0.25%
Package / Case: 0402 (1005 Metric)
Temperature Coefficient: ±100ppm/°C
Size / Dimension: 0.039" L x 0.020" W (1.00mm x 0.50mm)
Composition: Thin Film
Operating Temperature: -55°C ~ 155°C
Number of Terminations: 2
Supplier Device Package: 0402
Height - Seated (Max): 0.014" (0.35mm)
Resistance: 5.76 kOhms

Виробник: YAGEO
Description: RES SMD 57.6K OHM 1/16W 0402
Packaging: Tape & Reel (TR)
Power (Watts): 0.063W, 1/16W
Tolerance: ±0.25%
Package / Case: 0402 (1005 Metric)
Temperature Coefficient: ±100ppm/°C
Size / Dimension: 0.039" L x 0.020" W (1.00mm x 0.50mm)
Composition: Thin Film
Operating Temperature: -55°C ~ 155°C
Number of Terminations: 2
Supplier Device Package: 0402
Height - Seated (Max): 0.014" (0.35mm)
Resistance: 57.6 kOhms

Виробник: YAGEO
Description: RES SMD 57.6OHM 0.25% 1/16W 0402
Packaging: Tape & Reel (TR)
Power (Watts): 0.063W, 1/16W
Tolerance: ±0.25%
Package / Case: 0402 (1005 Metric)
Temperature Coefficient: ±100ppm/°C
Size / Dimension: 0.039" L x 0.020" W (1.00mm x 0.50mm)
Composition: Thin Film
Operating Temperature: -55°C ~ 155°C
Number of Terminations: 2
Supplier Device Package: 0402
Height - Seated (Max): 0.014" (0.35mm)
Part Status: Obsolete
Resistance: 57.6 Ohms

Виробник: NXP Semiconductors
Power Switch Hi Side 0.01Ohm Automotive 23-Pin QFN EP Tray

Виробник: NXP Semiconductors
Power Management IC 2.7V to 5.5V 56-Pin HVQFN EP Tray

Виробник: NXP USA Inc.
Description: IC POWER MANAGEMENT I.MX8QM
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Supplier Device Package: 56-HVQFN (8x8)

Виробник: NXP Semiconductors
High Performance Current Limit Switch

Виробник: NXP USA Inc.
Description: IC MCU 16BIT 512KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 24x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 119
DigiKey Programmable: Not Verified

Виробник: NXP Semiconductors
MCU 16-bit HCS12X RISC 512KB Flash 1.8V/2.8V/5V Automotive 144-Pin LQFP Tray

Виробник: NXP Semiconductors
SOC i.MX 8QuadXPlus ARM Cortex A53/ARM Cortex M4F 609-Pin FBGA Tray

Виробник: NXP USA Inc.
Description: I.MX 8QUADXPLUS 21X21
Packaging: Tray
Package / Case: 609-BFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz, 264MHz
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 609-FBGA (21x21)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Number of Cores/Bus Width: 3 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
Additional Interfaces: CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART

Виробник: NXP Semiconductors
MCU 32-bit ARM Cortex M0+ RISC 64KB Flash 1.8V/2.5V/3.3V Automotive Tray

Виробник: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 80FQFP
Packaging: Tube
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 20x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: FlexIO, I2C, IrDA, SPI, UART/USART
Peripherals: DMA, LCD, PWM, WDT
Supplier Device Package: 80-FQFP (12x12)
Number of I/O: 70
DigiKey Programmable: Not Verified

Виробник: NXP Semiconductors
MPU PowerQUICC II Pro MPC83xx Processor RISC 32bit 0.13um 400MHz 1.8V/2.5V/3.3V 740-Pin TBGA Tray

Виробник: NXP USA Inc.
Description: IC MPU MPC85XX 1.0GHZ 783FCPBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 90°C (TA)
Core Processor: PowerPC e500v2
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, HSSI, I2C, PCI

Виробник: LEGRAND
Category: Circuit Breakers
Description: Circuit breaker; 400VAC; Inom: 4A; Poles: 3; for DIN rail mounting
Type of protection: circuit breaker
Current rating: 4A
Number of poles: 3
Mounting: for DIN rail mounting
Characteristics: B
Short circuit breaking capacity: 6kA
IP rating: IP20
Cross section of connecting wires: 1...35mm²
Operating temperature: -25...70°C
Mechanical durability: 20000 cycles
Electrical life: 10000 cycles
Conform to the norm: IEC EN 60898-1
Manufacturer series: S300 DX
Trade name: MCB
Rated voltage: 400V AC

Виробник: LEGRAND
Category: Circuit Breakers
Description: Circuit breaker; 400VAC; Inom: 4A; Poles: 3; for DIN rail mounting
Type of protection: circuit breaker
Current rating: 4A
Number of poles: 3
Mounting: for DIN rail mounting
Characteristics: B
Short circuit breaking capacity: 6kA
IP rating: IP20
Cross section of connecting wires: 1...35mm²
Operating temperature: -25...70°C
Mechanical durability: 20000 cycles
Electrical life: 10000 cycles
Conform to the norm: IEC EN 60898-1
Manufacturer series: S300 DX
Trade name: MCB
Rated voltage: 400V AC
кількість в упаковці: 1 шт

Виробник: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 32LQFP
Packaging: Bulk
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 6x10b; D/A 1x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 19
DigiKey Programmable: Not Verified

Виробник: NXP Semiconductors
MCU 16-bit S12Z CISC 128KB Flash 3.3V/5V Automotive 32-Pin LQFP Tray

Виробник: NXP Semiconductors
MCU 32-bit e200z0h RISC 512KB Flash 3.3V Automotive 64-Pin LQFP Tray

Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 4x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 39
DigiKey Programmable: Not Verified

Виробник: NXP USA Inc.
Description: IC MCU 32BIT 768KB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 29x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 149
DigiKey Programmable: Not Verified