5020462070 Molex
Виробник: Molex
Description: CONN RCPT 20P 0.049 GOLD SMD R/A
Features: Pick and Place, Solder Retention
Packaging: Tape & Reel (TR)
Connector Type: Receptacle
Voltage Rating: 50V
Current Rating (Amps): 1A
Mounting Type: Surface Mount, Right Angle
Number of Positions: 20
Style: Board to Cable/Wire
Operating Temperature: -25°C ~ 85°C
Contact Type: Forked
Fastening Type: Detent Lock
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Natural
Pitch - Mating: 0.049" (1.25mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 3.90µin (0.099µm)
Contact Finish - Post: Tin
Part Status: Active
Insulation Height: 0.295" (7.50mm)
Number of Rows: 2
Description: CONN RCPT 20P 0.049 GOLD SMD R/A
Features: Pick and Place, Solder Retention
Packaging: Tape & Reel (TR)
Connector Type: Receptacle
Voltage Rating: 50V
Current Rating (Amps): 1A
Mounting Type: Surface Mount, Right Angle
Number of Positions: 20
Style: Board to Cable/Wire
Operating Temperature: -25°C ~ 85°C
Contact Type: Forked
Fastening Type: Detent Lock
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Natural
Pitch - Mating: 0.049" (1.25mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 3.90µin (0.099µm)
Contact Finish - Post: Tin
Part Status: Active
Insulation Height: 0.295" (7.50mm)
Number of Rows: 2
на замовлення 8450 шт:
термін постачання 21-31 дні (днів)
Кількість | Ціна без ПДВ |
---|---|
650+ | 160.89 грн |
1300+ | 128.37 грн |
1950+ | 123.94 грн |
3250+ | 112.16 грн |
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Технічний опис 5020462070 Molex
Description: CONN RCPT 20P 0.049 GOLD SMD R/A, Features: Pick and Place, Solder Retention, Packaging: Tape & Reel (TR), Connector Type: Receptacle, Voltage Rating: 50V, Current Rating (Amps): 1A, Mounting Type: Surface Mount, Right Angle, Number of Positions: 20, Style: Board to Cable/Wire, Operating Temperature: -25°C ~ 85°C, Contact Type: Forked, Fastening Type: Detent Lock, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Insulation Color: Natural, Pitch - Mating: 0.049" (1.25mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 3.90µin (0.099µm), Contact Finish - Post: Tin, Part Status: Active, Insulation Height: 0.295" (7.50mm), Number of Rows: 2.
Інші пропозиції 5020462070 за ціною від 96.85 грн до 229.49 грн
Фото | Назва | Виробник | Інформація |
Доступність |
Ціна без ПДВ | ||||||||||||||||
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502046-2070 | Виробник : Molex | Headers & Wire Housings 1.25 W/B R/A Rec 20C kt EmbsTp Pkg |
на замовлення 222 шт: термін постачання 21-30 дні (днів) |
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5020462070 | Виробник : Molex |
Description: CONN RCPT 20P 0.049 GOLD SMD R/A Features: Pick and Place, Solder Retention Packaging: Cut Tape (CT) Connector Type: Receptacle Voltage Rating: 50V Current Rating (Amps): 1A Mounting Type: Surface Mount, Right Angle Number of Positions: 20 Style: Board to Cable/Wire Operating Temperature: -25°C ~ 85°C Contact Type: Forked Fastening Type: Detent Lock Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Natural Pitch - Mating: 0.049" (1.25mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 3.90µin (0.099µm) Contact Finish - Post: Tin Part Status: Active Insulation Height: 0.295" (7.50mm) Number of Rows: 2 |
на замовлення 8486 шт: термін постачання 21-31 дні (днів) |
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5020462070 | Виробник : Molex | Conn Wire to Board RCP 20 POS 1.25mm Solder RA SMD Duo-Clasp™ T/R |
товар відсутній |