5020463070 Molex
Виробник: MolexDescription: CONN RCPT 30P 0.049 GOLD SMD R/A
Packaging: Tape & Reel (TR)
Features: Pick and Place, Solder Retention
Connector Type: Receptacle
Voltage Rating: 50V
Current Rating (Amps): 1A
Mounting Type: Surface Mount, Right Angle
Number of Positions: 30
Style: Board to Cable/Wire
Operating Temperature: -25°C ~ 85°C
Contact Type: Forked
Fastening Type: Detent Lock
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Natural
Pitch - Mating: 0.049" (1.25mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 3.90µin (0.099µm)
Contact Finish - Post: Tin
Part Status: Active
Insulation Height: 0.295" (7.50mm)
Number of Rows: 2
на замовлення 31850 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 650+ | 144.88 грн |
| 1300+ | 115.6 грн |
| 1950+ | 111.61 грн |
| 3250+ | 101 грн |
| 6500+ | 97.26 грн |
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Технічний опис 5020463070 Molex
Description: CONN RCPT 30P 0.049 GOLD SMD R/A, Packaging: Tape & Reel (TR), Features: Pick and Place, Solder Retention, Connector Type: Receptacle, Voltage Rating: 50V, Current Rating (Amps): 1A, Mounting Type: Surface Mount, Right Angle, Number of Positions: 30, Style: Board to Cable/Wire, Operating Temperature: -25°C ~ 85°C, Contact Type: Forked, Fastening Type: Detent Lock, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Insulation Color: Natural, Pitch - Mating: 0.049" (1.25mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 3.90µin (0.099µm), Contact Finish - Post: Tin, Part Status: Active, Insulation Height: 0.295" (7.50mm), Number of Rows: 2.
Інші пропозиції 5020463070 за ціною від 157.68 грн до 303.93 грн
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна без ПДВ | ||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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502046-3070 | Виробник : Molex |
Headers & Wire Housings 1.25 W/B R/A Rec 30C kt EmbsTp Pkg |
на замовлення 82 шт: термін постачання 21-30 дні (днів) |
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5020463070 | Виробник : Molex |
Description: CONN RCPT 30P 0.049 GOLD SMD R/A Packaging: Cut Tape (CT) Features: Pick and Place, Solder Retention Connector Type: Receptacle Voltage Rating: 50V Current Rating (Amps): 1A Mounting Type: Surface Mount, Right Angle Number of Positions: 30 Style: Board to Cable/Wire Operating Temperature: -25°C ~ 85°C Contact Type: Forked Fastening Type: Detent Lock Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Natural Pitch - Mating: 0.049" (1.25mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 3.90µin (0.099µm) Contact Finish - Post: Tin Part Status: Active Insulation Height: 0.295" (7.50mm) Number of Rows: 2 |
на замовлення 32461 шт: термін постачання 21-31 дні (днів) |
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502046-3070 | Виробник : MOLEX |
Description: MOLEX - 502046-3070 - Printbuchse, Wire-to-Board, 1.25 mm, 2 Reihe(n), 30 Kontakt(e), Oberflächenmontage tariffCode: 85366990 rohsCompliant: YES Kontaktüberzug: Vergoldete Kontakte hazardous: false rohsPhthalatesCompliant: YES Kontaktmaterial: Kupferlegierung Steckverbindermontage: Oberflächenmontage usEccn: EAR99 Anzahl der Kontakte: 30Contacts euEccn: NLR Steckverbindersysteme: Wire-to-Board Produktpalette: Duo-Clasp 502046 productTraceability: No Kontaktanschluss: Oberflächenmontage Anzahl der Reihen: 2Rows Rastermaß: 1.25mm |
товар відсутній |
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5020463070 | Виробник : Molex |
Conn Wire to Board RCP 30 POS 1.25mm Solder RA Side Entry SMD Duo-Clasp T/R |
товар відсутній |