5040500891 - Connectors, Interconnect - Other Connectors
On stock/available
Technical description 5040500891
Price 5040500891 From 0.85 $ to 13.55 $
 Manufacturer: Molex Description: CONN HEADER SMD R/A 8POS 1.5MM Contact Finish - Mating: Gold Contact Shape: Rectangular Insulation Height: 0.079" (2.00mm) Fastening Type: Detent Lock Termination: Solder Mounting Type: Surface Mount, Right Angle Shrouding: Shrouded - 4 Wall Style: Board to Cable/Wire Number of Positions Loaded: All Number of Rows: 1 Number of Positions: 8 Pitch - Mating: 0.059" (1.50mm) Contact Type: Male Blade Base Part Number: 504050 Manufacturer: Molex Applications: Automotive, General Purpose, Industrial, Lighting, Telecommunications Connector Type: Header Part Status: Active Packaging: Tape & Reel (TR) Voltage Rating: 150V Current Rating (Amps): Varies by Wire Gauge Insulation Color: Black Material Flammability Rating: UL94 V-0 Operating Temperature: -40°C ~ 105°C Features: Solder Retention Insulation Material: Polyamide (PA), Nylon Contact Material: Copper Alloy Contact Finish - Post: Gold Contact Finish Thickness - Mating: 3.94µin (0.100µm) 
|
available 21600 pc(s)  lead time 7-22 days |
|
|
||||||||||
|
Manufacturer: Molex Description: CONN HEADER SMD R/A 8POS 1.5MM Packaging: Cut Tape (CT) Manufacturer: Molex Insulation Height: 0.079" (2.00mm) Fastening Type: Detent Lock Applications: Automotive, General Purpose, Industrial, Lighting, Telecommunications Voltage Rating: 150V Current Rating (Amps): Varies by Wire Gauge Insulation Color: Black Material Flammability Rating: UL94 V-0 Termination: Solder Mounting Type: Surface Mount, Right Angle Shrouding: Shrouded - 4 Wall Style: Board to Cable/Wire Number of Positions Loaded: All Number of Rows: 1 Number of Positions: 8 Pitch - Mating: 0.059" (1.50mm) Contact Type: Male Blade Connector Type: Header Base Part Number: 504050 Operating Temperature: -40°C ~ 105°C Features: Solder Retention Insulation Material: Polyamide (PA), Nylon Contact Material: Copper Alloy Contact Finish - Post: Gold Contact Finish Thickness - Mating: 3.94µin (0.100µm) Contact Finish - Mating: Gold Contact Shape: Rectangular Part Status: Active
|
available 23019 pc(s) lead time 7-22 days |
|
|
||||||||||
|
5040500891 Manufacturer: Molex Conn Wire to Board HDR 8 POS 1.5mm Solder RA SMD Pico-Lock™ T/R
|
available 7465 pc(s) lead time 6-21 days |
|
|
||||||||||
 Manufacturer: Molex Headers & Wire Housings PicoLock 1.5 W/B HDR ASSY EMBTP PKG 8P
|
available 3229 pc(s) lead time 8-21 days |
|
|
||||||||||
 Manufacturer: Molex Description: CONN HEADER SMD R/A 8POS 1.5MM Number of Positions: 8 Pitch - Mating: 0.059" (1.50mm) Contact Type: Male Blade Connector Type: Header Fastening Type: Detent Lock Termination: Solder Features: Solder Retention Part Status: Active Packaging: Digi-Reel® (Surcharge for the reel of $7) Applications: Automotive, General Purpose, Industrial, Lighting, Telecommunications Mounting Type: Surface Mount, Right Angle Insulation Material: Polyamide (PA), Nylon Contact Material: Copper Alloy Contact Finish - Post: Gold Contact Finish Thickness - Mating: 3.94µin (0.100µm) Shrouding: Shrouded - 4 Wall Style: Board to Cable/Wire Number of Positions Loaded: All Number of Rows: 1 Voltage Rating: 150V Current Rating (Amps): Varies by Wire Gauge Insulation Color: Black Material Flammability Rating: UL94 V-0 Operating Temperature: -40°C ~ 105°C Contact Finish - Mating: Gold Contact Shape: Rectangular Insulation Height: 0.079" (2.00mm)
|
available 2969 pc(s) lead time 7-22 days |
|
|
||||||||||
|
5040500891 Manufacturer: Molex Conn Wire to Board HDR 8 POS 1.5mm Solder RA SMD Pico-Lock™ T/R
|
available 5400 pc(s) lead time 6-21 days |
|
|