5570, 300MMX20MX1MM 3M Interconnect Solutions
Виробник: 3M Interconnect Solutions
Therm.cond. pad,filled Acrylelastomer, filler material: ceramic, easily adhere on both sides, with Polyester-Liner, heat coefficientt: 1,3 W/m-K 20 m
Therm.cond. pad,filled Acrylelastomer, filler material: ceramic, easily adhere on both sides, with Polyester-Liner, heat coefficientt: 1,3 W/m-K 20 m
товар відсутній
Відгуки про товар
Написати відгук
Технічний опис 5570, 300MMX20MX1MM 3M Interconnect Solutions
Therm.cond. pad,filled Acrylelastomer, filler material: ceramic, easily adhere on both sides, with Polyester-Liner, heat coefficientt: 1,3 W/m-K 20 m.