Результат пошуку "566589" : 7
Вид перегляду :
Фото | Назва | Виробник | Інформація |
Доступність |
Ціна без ПДВ |
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SFTW-203-1/2-48-Black | 3M |
Description: HEATSHRINK 1/2" BLK 4'PC 12/BOX Features: Chemical Resistant, Corrosive Resistant, Flame Retardant, Self Extinguishing Packaging: Bulk Color: Black Material: Polyolefin (PO) Length: 4.00' (1.22m) Type: Tubing, Flexible Operating Temperature: -55°C ~ 135°C Shrinkage Ratio: 3 to 1 Inner Diameter - Supplied: 0.472" (11.99mm) Inner Diameter - Recovered: 0.157" (3.99mm) Recovered Wall Thickness: 0.030" (0.76mm) Shrink Temperature: 100°C Part Status: Active Storage/Refrigeration Temperature: 50°F ~ 80°F (10°C ~ 27°C) Shelf Life: 120 Months |
на замовлення 1 шт: термін постачання 21-31 дні (днів) |
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CYT4BFBCJDQ0BZEGST | Infineon Technologies | MCU 32-bit ARM Cortex M7/ARM Cortex M0+ RISC 8640KB Flash 3.3V/5V Automotive AEC-Q100 272-Pin BGA T/R |
товар відсутній |
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CYT4BFBCJDQ0BZEGST | Infineon Technologies |
Description: IC MCU 32BT 8.1875MB FLSH 272BGA Packaging: Tape & Reel (TR) Package / Case: 272-LFBGA Mounting Type: Surface Mount Speed: 100MHz, 350MHz Program Memory Size: 8.1875MB (8.1875M x 8) RAM Size: 1M x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 256 x 8 Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M4F Data Converters: A/D 114x12b SAR Core Size: 32-Bit Quad-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Supplier Device Package: 272-BGA (16x16) Part Status: Active Number of I/O: 220 DigiKey Programmable: Not Verified |
товар відсутній |
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CYT4BFBCJDQ0BZSGS | Infineon Technologies |
Description: IC MCU 32BT 8.1875MB FLSH 272BGA Packaging: Tray Package / Case: 272-LFBGA Mounting Type: Surface Mount Speed: 100MHz, 350MHz Program Memory Size: 8.1875MB (8.1875M x 8) RAM Size: 1M x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 256 x 8 Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M4F Data Converters: A/D 114x12b SAR Core Size: 32-Bit Quad-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Supplier Device Package: 272-BGA (16x16) Part Status: Active Number of I/O: 220 DigiKey Programmable: Not Verified |
товар відсутній |
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CYT4BFBCJDQ0BZSGS | Infineon Technologies | MCU 32-bit ARM Cortex M7/ARM Cortex M0+ RISC 8640KB Flash 3.3V/5V 272-Pin BGA Tray |
товар відсутній |
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CYT4BFBCJDQ0BZSGST | Infineon Technologies |
Description: IC MCU 32BT 8.1875MB FLSH 272BGA Packaging: Tape & Reel (TR) Package / Case: 272-LFBGA Mounting Type: Surface Mount Speed: 100MHz, 350MHz Program Memory Size: 8.1875MB (8.1875M x 8) RAM Size: 1M x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 256 x 8 Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M4F Data Converters: A/D 114x12b SAR Core Size: 32-Bit Quad-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Supplier Device Package: 272-BGA (16x16) Part Status: Active Number of I/O: 220 DigiKey Programmable: Not Verified |
товар відсутній |
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CYT4BFBCJDQ0BZSGST | Infineon Technologies | MCU 32-bit ARM Cortex M7/ARM Cortex M0+ RISC 8640KB Flash 3.3V/5V Automotive 272-Pin BGA T/R |
товар відсутній |
SFTW-203-1/2-48-Black |
Виробник: 3M
Description: HEATSHRINK 1/2" BLK 4'PC 12/BOX
Features: Chemical Resistant, Corrosive Resistant, Flame Retardant, Self Extinguishing
Packaging: Bulk
Color: Black
Material: Polyolefin (PO)
Length: 4.00' (1.22m)
Type: Tubing, Flexible
Operating Temperature: -55°C ~ 135°C
Shrinkage Ratio: 3 to 1
Inner Diameter - Supplied: 0.472" (11.99mm)
Inner Diameter - Recovered: 0.157" (3.99mm)
Recovered Wall Thickness: 0.030" (0.76mm)
Shrink Temperature: 100°C
Part Status: Active
Storage/Refrigeration Temperature: 50°F ~ 80°F (10°C ~ 27°C)
Shelf Life: 120 Months
Description: HEATSHRINK 1/2" BLK 4'PC 12/BOX
Features: Chemical Resistant, Corrosive Resistant, Flame Retardant, Self Extinguishing
Packaging: Bulk
Color: Black
Material: Polyolefin (PO)
Length: 4.00' (1.22m)
Type: Tubing, Flexible
Operating Temperature: -55°C ~ 135°C
Shrinkage Ratio: 3 to 1
Inner Diameter - Supplied: 0.472" (11.99mm)
Inner Diameter - Recovered: 0.157" (3.99mm)
Recovered Wall Thickness: 0.030" (0.76mm)
Shrink Temperature: 100°C
Part Status: Active
Storage/Refrigeration Temperature: 50°F ~ 80°F (10°C ~ 27°C)
Shelf Life: 120 Months
на замовлення 1 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 4407.61 грн |
CYT4BFBCJDQ0BZEGST |
Виробник: Infineon Technologies
MCU 32-bit ARM Cortex M7/ARM Cortex M0+ RISC 8640KB Flash 3.3V/5V Automotive AEC-Q100 272-Pin BGA T/R
MCU 32-bit ARM Cortex M7/ARM Cortex M0+ RISC 8640KB Flash 3.3V/5V Automotive AEC-Q100 272-Pin BGA T/R
товар відсутній
CYT4BFBCJDQ0BZEGST |
Виробник: Infineon Technologies
Description: IC MCU 32BT 8.1875MB FLSH 272BGA
Packaging: Tape & Reel (TR)
Package / Case: 272-LFBGA
Mounting Type: Surface Mount
Speed: 100MHz, 350MHz
Program Memory Size: 8.1875MB (8.1875M x 8)
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M4F
Data Converters: A/D 114x12b SAR
Core Size: 32-Bit Quad-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 272-BGA (16x16)
Part Status: Active
Number of I/O: 220
DigiKey Programmable: Not Verified
Description: IC MCU 32BT 8.1875MB FLSH 272BGA
Packaging: Tape & Reel (TR)
Package / Case: 272-LFBGA
Mounting Type: Surface Mount
Speed: 100MHz, 350MHz
Program Memory Size: 8.1875MB (8.1875M x 8)
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M4F
Data Converters: A/D 114x12b SAR
Core Size: 32-Bit Quad-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 272-BGA (16x16)
Part Status: Active
Number of I/O: 220
DigiKey Programmable: Not Verified
товар відсутній
CYT4BFBCJDQ0BZSGS |
Виробник: Infineon Technologies
Description: IC MCU 32BT 8.1875MB FLSH 272BGA
Packaging: Tray
Package / Case: 272-LFBGA
Mounting Type: Surface Mount
Speed: 100MHz, 350MHz
Program Memory Size: 8.1875MB (8.1875M x 8)
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M4F
Data Converters: A/D 114x12b SAR
Core Size: 32-Bit Quad-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 272-BGA (16x16)
Part Status: Active
Number of I/O: 220
DigiKey Programmable: Not Verified
Description: IC MCU 32BT 8.1875MB FLSH 272BGA
Packaging: Tray
Package / Case: 272-LFBGA
Mounting Type: Surface Mount
Speed: 100MHz, 350MHz
Program Memory Size: 8.1875MB (8.1875M x 8)
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M4F
Data Converters: A/D 114x12b SAR
Core Size: 32-Bit Quad-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 272-BGA (16x16)
Part Status: Active
Number of I/O: 220
DigiKey Programmable: Not Verified
товар відсутній
CYT4BFBCJDQ0BZSGS |
Виробник: Infineon Technologies
MCU 32-bit ARM Cortex M7/ARM Cortex M0+ RISC 8640KB Flash 3.3V/5V 272-Pin BGA Tray
MCU 32-bit ARM Cortex M7/ARM Cortex M0+ RISC 8640KB Flash 3.3V/5V 272-Pin BGA Tray
товар відсутній
CYT4BFBCJDQ0BZSGST |
Виробник: Infineon Technologies
Description: IC MCU 32BT 8.1875MB FLSH 272BGA
Packaging: Tape & Reel (TR)
Package / Case: 272-LFBGA
Mounting Type: Surface Mount
Speed: 100MHz, 350MHz
Program Memory Size: 8.1875MB (8.1875M x 8)
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M4F
Data Converters: A/D 114x12b SAR
Core Size: 32-Bit Quad-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 272-BGA (16x16)
Part Status: Active
Number of I/O: 220
DigiKey Programmable: Not Verified
Description: IC MCU 32BT 8.1875MB FLSH 272BGA
Packaging: Tape & Reel (TR)
Package / Case: 272-LFBGA
Mounting Type: Surface Mount
Speed: 100MHz, 350MHz
Program Memory Size: 8.1875MB (8.1875M x 8)
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M4F
Data Converters: A/D 114x12b SAR
Core Size: 32-Bit Quad-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 272-BGA (16x16)
Part Status: Active
Number of I/O: 220
DigiKey Programmable: Not Verified
товар відсутній
CYT4BFBCJDQ0BZSGST |
Виробник: Infineon Technologies
MCU 32-bit ARM Cortex M7/ARM Cortex M0+ RISC 8640KB Flash 3.3V/5V Automotive 272-Pin BGA T/R
MCU 32-bit ARM Cortex M7/ARM Cortex M0+ RISC 8640KB Flash 3.3V/5V Automotive 272-Pin BGA T/R
товар відсутній