70-1903-0810 Kester Solder
Виробник: Kester Solder
Description: SOLDER 500G JAR,SN96.5 AG3.0
Packaging: Jar
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 424°F (217 ~ 218°C)
Form: Jar, 17.64 oz (500g)
Mesh Type: 3
Process: Lead Free
Flux Type: Water Soluble
Part Status: Active
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 4 Months
Description: SOLDER 500G JAR,SN96.5 AG3.0
Packaging: Jar
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 424°F (217 ~ 218°C)
Form: Jar, 17.64 oz (500g)
Mesh Type: 3
Process: Lead Free
Flux Type: Water Soluble
Part Status: Active
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 4 Months
на замовлення 5 шт:
термін постачання 21-31 дні (днів)
Кількість | Ціна без ПДВ |
---|---|
1+ | 13204.14 грн |
Відгуки про товар
Написати відгук
Технічний опис 70-1903-0810 Kester Solder
Description: SOLDER 500G JAR,SN96.5 AG3.0, Packaging: Jar, Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Type: Solder Paste, Melting Point: 423 ~ 424°F (217 ~ 218°C), Form: Jar, 17.64 oz (500g), Mesh Type: 3, Process: Lead Free, Flux Type: Water Soluble, Part Status: Active, Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C), Shelf Life Start: Date of Manufacture, Shelf Life: 4 Months.