70-3205-1810 Kester Solder
Виробник: Kester SolderDescription: SOLDER PASTE NXG1 NO CLEAN 500GM
Packaging: Bulk
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Solder Paste
Melting Point: 441°F (227°C)
Form: Jar, 17.64 oz (500g)
Process: Lead Free
Flux Type: No-Clean
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 8 Months
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Технічний опис 70-3205-1810 Kester Solder
Description: SOLDER PASTE NXG1 NO CLEAN 500GM, Packaging: Bulk, Composition: Sn99.3Cu0.7 (99.3/0.7), Type: Solder Paste, Melting Point: 441°F (227°C), Form: Jar, 17.64 oz (500g), Process: Lead Free, Flux Type: No-Clean, Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C), Shelf Life Start: Date of Manufacture, Shelf Life: 8 Months.