799288-1 TE Connectivity AMP Connectors

Description: CONN IC DIP SOCKET 16POS TINLEAD, Features: Closed Frame, Elevated, Packaging: Box, Mounting Type: Through Hole, Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 16 (2 x 8), Termination: Solder, Housing Material: Thermoplastic, Polyester, Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin-Lead, Contact Finish Thickness - Mating: 3.00µin (0.076µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin-Lead, Contact Finish Thickness - Post: 5.00µin (0.127µm), Contact Material - Post: Brass.