LT18CJ1922 Laird Technologies EMI
Виробник: Laird Technologies EMI
Description: VSLMT,STR,BF 0.11*0.32*2.039*0.1
Packaging: Bulk
Material: Beryllium Copper
Length: 4.657" (118.28mm)
Type: Fingerstock
Width: 0.320" (8.13mm)
Height: 0.110" (2.79mm)
Attachment Method: Slot
Plating: Tin
Plating - Thickness: 299.99µin (7.62µm)
Part Status: Active
Description: VSLMT,STR,BF 0.11*0.32*2.039*0.1
Packaging: Bulk
Material: Beryllium Copper
Length: 4.657" (118.28mm)
Type: Fingerstock
Width: 0.320" (8.13mm)
Height: 0.110" (2.79mm)
Attachment Method: Slot
Plating: Tin
Plating - Thickness: 299.99µin (7.62µm)
Part Status: Active
на замовлення 500 шт:
термін постачання 21-31 дні (днів)
Кількість | Ціна без ПДВ |
---|---|
2+ | 230.65 грн |
10+ | 199.55 грн |
25+ | 188.68 грн |
100+ | 153.44 грн |
250+ | 145.57 грн |
500+ | 130.62 грн |
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Технічний опис LT18CJ1922 Laird Technologies EMI
Description: VSLMT,STR,BF 0.11*0.32*2.039*0.1, Packaging: Bulk, Material: Beryllium Copper, Length: 4.657" (118.28mm), Type: Fingerstock, Width: 0.320" (8.13mm), Height: 0.110" (2.79mm), Attachment Method: Slot, Plating: Tin, Plating - Thickness: 299.99µin (7.62µm), Part Status: Active.