PCB3001-1 Chip Quik Inc.
Виробник: Chip Quik Inc.
Description: SOIC28W/N AND SOP28 TO DIP SMT A
Packaging: Bulk
Size / Dimension: 0.800" x 1.400" (20.32mm x 35.56mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC, SOP
Part Status: Active
Description: SOIC28W/N AND SOP28 TO DIP SMT A
Packaging: Bulk
Size / Dimension: 0.800" x 1.400" (20.32mm x 35.56mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC, SOP
Part Status: Active
на замовлення 235 шт:
термін постачання 21-31 дні (днів)
Кількість | Ціна без ПДВ |
---|---|
2+ | 214.85 грн |
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Технічний опис PCB3001-1 Chip Quik Inc.
Description: SOIC28W/N AND SOP28 TO DIP SMT A, Packaging: Bulk, Size / Dimension: 0.800" x 1.400" (20.32mm x 35.56mm), Material: FR4 Epoxy Glass, Number of Positions: 28, Pitch: 0.050" (1.27mm), Board Thickness: 0.062" (1.57mm) 1/16", Proto Board Type: SMD to DIP, Package Accepted: SOIC, SOP, Part Status: Active.