TE0741-03-410-2IF Trenz Electronic GmbH
Виробник: Trenz Electronic GmbHDescription: MODULE FPGA KINTEX
Packaging: Box
Connector Type: Board-to-Board (BTB) Socket
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: -40°C ~ 85°C
Module/Board Type: FPGA Core
Core Processor: Xilinx Kintex-7 FPGA XC7K410T-2FBG676I
Flash Size: 32MB
Part Status: Obsolete
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Технічний опис TE0741-03-410-2IF Trenz Electronic GmbH
Description: MODULE FPGA KINTEX, Packaging: Box, Connector Type: Board-to-Board (BTB) Socket, Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm), Operating Temperature: -40°C ~ 85°C, Module/Board Type: FPGA Core, Core Processor: Xilinx Kintex-7 FPGA XC7K410T-2FBG676I, Flash Size: 32MB, Part Status: Obsolete.