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Фото | Назва | Виробник | Інформація |
Доступність |
Ціна без ПДВ |
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110-43-308-41-105000 | Mill-Max | IC & Component Sockets 8P SMT SKT 200u Sn |
на замовлення 1601 шт: термін постачання 21-30 дні (днів) |
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110-43-308-41-105000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 8POS GOLD Packaging: Tube Features: Open Frame Mounting Type: Surface Mount Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 8 (2 x 4) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
на замовлення 1140 шт: термін постачання 21-31 дні (днів) |
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110-47-308-41-105000 | Mill-Max | IC & Component Sockets STANDRD SOLDER TAIL DIP SOCKET |
на замовлення 490 шт: термін постачання 21-30 дні (днів) |
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110-47-308-41-105000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 8POS GOLD Packaging: Tube Features: Open Frame Mounting Type: Surface Mount Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 8 (2 x 4) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
на замовлення 360 шт: термін постачання 21-31 дні (днів) |
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110-83-308-41-105101 | Preci-Dip |
Description: CONN IC DIP SOCKET 8POS GOLD Features: Open Frame Packaging: Bulk Mounting Type: Surface Mount Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 8 (2 x 4) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass Part Status: Active |
на замовлення 101 шт: термін постачання 21-31 дні (днів) |
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110-87-308-41-105101 | Preci-Dip | Conn DIP Socket SKT 8 POS 2.54mm Solder ST SMD T/R |
на замовлення 36 шт: термін постачання 21-31 дні (днів) |
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110-87-308-41-105101 | Preci-dip | IC & Component Sockets 2.54mm, 8P, Surface mount, Gold Flash, 10.1x7.62x10.1x12.26 |
на замовлення 954 шт: термін постачання 21-30 дні (днів) |
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110-87-308-41-105161 | Preci-Dip | Conn DIP Socket SKT 8 POS 2.54mm Solder ST SMD T/R |
на замовлення 4497 шт: термін постачання 21-31 дні (днів) |
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110-87-308-41-105161 | Preci-dip | IC & Component Sockets |
на замовлення 272 шт: термін постачання 21-30 дні (днів) |
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110-87-308-41-105191 | Preci-Dip |
Description: CONN IC DIP SOCKET 8POS GOLD Features: Open Frame Packaging: Tape & Reel (TR) Mounting Type: Surface Mount Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 8 (2 x 4) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass Part Status: Active |
на замовлення 2100 шт: термін постачання 21-31 дні (днів) |
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110-87-308-41-105191 | Preci-Dip |
Description: CONN IC DIP SOCKET 8POS GOLD Features: Open Frame Packaging: Cut Tape (CT) Mounting Type: Surface Mount Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 8 (2 x 4) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass Part Status: Active |
на замовлення 2497 шт: термін постачання 21-31 дні (днів) |
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110-87-308-41-105191 | Preci-dip | IC & Component Sockets |
на замовлення 606 шт: термін постачання 21-30 дні (днів) |
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110-93-308-41-105000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 8POS GOLD Packaging: Tube Features: Open Frame Mounting Type: Surface Mount Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 8 (2 x 4) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy |
на замовлення 50 шт: термін постачання 21-31 дні (днів) |
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110-93-308-41-105000 | Mill-Max | IC & Component Sockets 8P SURF-MOUNT |
на замовлення 172 шт: термін постачання 21-30 дні (днів) |
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210-83-308-41-101000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 8POS GOLD Features: Closed Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 8 (2 x 4) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 300.0µin (7.62µm) Contact Material - Post: Brass Alloy Part Status: Obsolete |
на замовлення 27 шт: термін постачання 21-31 дні (днів) |
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310-87-108-41-105101 | Preci-dip | Headers & Wire Housings |
на замовлення 614 шт: термін постачання 21-30 дні (днів) |
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310-87-108-41-105191 | Preci-dip | Headers & Wire Housings |
на замовлення 650 шт: термін постачання 21-30 дні (днів) |
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510-87-084-11-002101 | Preci-dip | IC & Component Sockets |
на замовлення 150 шт: термін постачання 21-30 дні (днів) |
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510-87-084-11-041101 | Preci-dip | IC & Component Sockets |
на замовлення 138 шт: термін постачання 21-30 дні (днів) |
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510-87-084-11-042101 | Preci-dip | IC & Component Sockets |
на замовлення 139 шт: термін постачання 21-30 дні (днів) |
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M80-8411042 | Harwin Inc. |
Description: CONN HEADER R/A 10POS 2MM Features: Strain Relief Clips Packaging: Tube Connector Type: Header Voltage Rating: 120V Current Rating (Amps): 2.2A Mounting Type: Through Hole, Right Angle Number of Positions: 10 Number of Rows: 2 Style: Board to Board or Cable Operating Temperature: -55°C ~ 125°C Contact Type: Male Pin Fastening Type: Latch Holder Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Phosphor Bronze Insulation Color: Black Pitch - Mating: 0.079" (2.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Finish - Post: Tin Part Status: Active Contact Shape: Circular Contact Length - Post: 0.118" (3.00mm) Insulation Height: 0.235" (5.97mm) Shrouding: Shrouded - 4 Wall Insulation Material: Polyphenylene Sulfide (PPS), Glass Filled Row Spacing - Mating: 0.079" (2.00mm) |
на замовлення 300 шт: термін постачання 21-31 дні (днів) |
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M80-8411042 | Harwin | Headers & Wire Housings 5+5 POS DIL MALE R/A UNLATCHED TIN |
на замовлення 514 шт: термін постачання 21-30 дні (днів) |
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0015911102 | Molex |
Description: CONN HEADER SMD 10POS 2.54MM Packaging: Tube Features: Board Guide Connector Type: Header, Breakaway Mounting Type: Surface Mount Number of Positions: 10 Number of Rows: 2 Style: Board to Board or Cable Contact Type: Male Pin Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Copper Alloy Insulation Color: Black Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 15.0µin (0.38µm) Contact Finish - Post: Tin Part Status: Discontinued at Digi-Key Contact Shape: Square Insulation Height: 0.090" (2.29mm) Shrouding: Unshrouded Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled Row Spacing - Mating: 0.100" (2.54mm) Contact Length - Mating: 0.240" (6.10mm) |
на замовлення 123 шт: термін постачання 21-31 дні (днів) |
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15-91-1102 | Molex | Headers & Wire Housings 2.54MM 10P V HDR DR SMT SAU |
на замовлення 5874 шт: термін постачання 21-30 дні (днів) |
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411-87-208-41-001101 | Preci-Dip | Conn Socket Strip SKT 8 POS 2.54mm Solder ST Top Entry Thru-Hole |
на замовлення 1000 шт: термін постачання 21-31 дні (днів) |
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0638084110 | Molex |
Description: FA2 APPLICATOR - PNEUMATIC FEED Packaging: Bulk For Use With/Related Products: Rectangular Contacts Tool Type: Applicator for Bench Press Wire Gauge or Range - AWG: 16-18 AWG Tool Method: Pneumatic |
товар відсутній |
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10131318-0841100LF | Amphenol FCI | Power to the Board Minitek Power4.2HCC DR RATH HDR 8Pos 30Mic Au |
товар відсутній |
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10131318-084110PLF | Amphenol FCI | Power to the Board Minitek Power4.2HCC DR RATH HDR 8Pos 30Mic Au |
товар відсутній |
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10131318-084110RLF | Amphenol FCI | Power to the Board Minitek Power4.2HCC DR RATH HDR 8Pos 30Mic Au |
товар відсутній |
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10131319-0841100LF | Amphenol FCI | Power to the Board Minitek Power4.2HCC DR VTH HDR 8Pos 30Mic Au |
товар відсутній |
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10131319-084110PLF | Amphenol FCI | Power to the Board Minitek Power4.2HCC DR VTH HDR 8Pos 30Mic Au |
товар відсутній |
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10131319-084110PLF | Amphenol ICC (FCI) |
Description: CONN HEADER VERT Packaging: Tray Features: Board Lock Connector Type: Header Voltage Rating: 600VAC/DC Current Rating (Amps): Varies by Wire Gauge Mounting Type: Through Hole Number of Positions: 8 Number of Rows: 2 Style: Board to Cable/Wire Operating Temperature: -40°C ~ 105°C Contact Type: Male Pin Fastening Type: Locking Ramp Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Copper Alloy Insulation Color: Natural Pitch - Mating: 0.165" (4.20mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Part Status: Active Contact Shape: Square Contact Length - Post: 0.138" (3.50mm) Insulation Height: 0.504" (12.80mm) Shrouding: Shrouded - 4 Wall Insulation Material: Polyamide (PA66), Nylon 6/6 Row Spacing - Mating: 0.165" (4.20mm) |
товар відсутній |
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10131319-084110RLF | Amphenol FCI | Power to the Board Minitek Power4.2HCC DR VTH HDR 8Pos 30Mic Au |
товар відсутній |
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10131319-084110TLF | Amphenol FCI | Power to the Board Minitek Power4.2HCC DR VTH HDR 8Pos 30Mic Au |
товар відсутній |
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110-41-308-41-105000 | Mill-Max | IC & Component Sockets DIP Dual In Line Socket |
товар відсутній |
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110-41-308-41-105000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Features: Open Frame Packaging: Tube Mounting Type: Surface Mount Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 8 (2 x 4) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
товар відсутній |
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110-83-308-41-105101 | Preci-Dip | Conn DIP Socket SKT 8 POS 2.54mm Solder ST SMD T/R |
товар відсутній |
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110-83-308-41-105101 | Preci-dip | IC & Component Sockets 2.54mm, 8P, Surface mount, .75 Au, 10.1x7.62x10.1x12.26 |
товар відсутній |
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110-83-308-41-105161 | Preci-Dip | Conn DIP Socket SKT 8 POS 2.54mm Solder ST SMD T/R |
товар відсутній |
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110-83-308-41-105161 | Preci-Dip |
Description: CONN IC DIP SOCKET 8POS GOLD Features: Open Frame Packaging: Bulk Mounting Type: Surface Mount Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 8 (2 x 4) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
товар відсутній |
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110-83-308-41-105161 | Preci-dip | IC & Component Sockets |
товар відсутній |
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110-83-308-41-105191 | Preci-Dip | CONN IC DIP SOCKET 8POS GOLD |
товар відсутній |
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110-83-308-41-105191 | Preci-Dip |
Description: CONN IC DIP SOCKET 8POS GOLD Features: Open Frame Packaging: Bulk Mounting Type: Surface Mount Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 8 (2 x 4) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass Part Status: Active |
товар відсутній |
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110-83-308-41-105191 | Preci-dip | IC & Component Sockets |
товар відсутній |
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110-87-308-41-105101 | Preci-Dip |
Description: CONN IC DIP SOCKET 8POS GOLD Features: Open Frame Packaging: Bulk Mounting Type: Surface Mount Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 8 (2 x 4) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass Part Status: Active |
товар відсутній |
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110-87-308-41-105161 | Preci-Dip |
Description: CONN IC DIP SOCKET 8POS GOLD Features: Open Frame Packaging: Bulk Mounting Type: Surface Mount Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 8 (2 x 4) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
товар відсутній |
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110-87-308-41-105191 | Preci-Dip | Conn DIP Socket SKT 8 POS 1.54mm Solder ST SMD |
товар відсутній |
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110-91-308-41-105000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Features: Open Frame Packaging: Tube Mounting Type: Surface Mount Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 8 (2 x 4) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy |
товар відсутній |
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23008411-01 | Chogori Technologies Inc. |
Description: CONN RCPT FMALE 8POS SOLDER CUP Packaging: Bulk Features: Backshell Connector Type: Receptacle, Female Sockets Color: Black Voltage Rating: 60V Current Rating (Amps): 5A Mounting Type: Free Hanging (In-Line) Shielding: Unshielded Number of Positions: 8 Orientation: Keyed Operating Temperature: -45°C ~ 105°C Fastening Type: Threaded Termination: Solder Cup Ingress Protection: IP68 - Dust Tight, Waterproof Cable Opening: 0.138" ~ 0.256" (3.50mm ~ 6.50mm) Contact Finish - Mating: Gold Part Status: Active Shell Material: Polyamide (PA66), Nylon 6/6 Primary Material: Plastic |
товар відсутній |
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23008411-02 | Chogori Technologies Inc. |
Description: CONN RCPT FMALE 8POS SOLDER CUP Packaging: Bulk Features: Backshell Connector Type: Receptacle, Female Sockets Color: Black Voltage Rating: 60V Current Rating (Amps): 5A Mounting Type: Free Hanging (In-Line) Shielding: Unshielded Number of Positions: 8 Orientation: Keyed Operating Temperature: -45°C ~ 105°C Fastening Type: Threaded Termination: Solder Cup Ingress Protection: IP68 - Dust Tight, Waterproof Cable Opening: 0.256" ~ 0.374" (6.50mm ~ 9.50mm) Contact Finish - Mating: Gold Part Status: Active Shell Material: Polyamide (PA66), Nylon 6/6 Primary Material: Plastic |
товар відсутній |
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310-41-108-41-105000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 8POS 0.1 GOLD SMD Packaging: Bulk Connector Type: Receptacle Voltage Rating: 100V, 150VDC Current Rating (Amps): 3A Mounting Type: Surface Mount Number of Positions: 8 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Post: Tin Part Status: Active Insulation Height: 0.220" (5.60mm) Number of Rows: 1 |
товар відсутній |
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310-41-108-41-107000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 8POS 0.1 GOLD SMD Packaging: Bulk Connector Type: Receptacle Voltage Rating: 100V, 150VDC Current Rating (Amps): 3A Mounting Type: Surface Mount Number of Positions: 8 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Post: Tin Part Status: Active Insulation Height: 0.220" (5.60mm) Number of Rows: 1 |
товар відсутній |
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310-43-108-41-105000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 8POS 0.1 GOLD SMD Packaging: Tube Connector Type: Receptacle Voltage Rating: 100V, 150VDC Current Rating (Amps): 3A Mounting Type: Surface Mount Number of Positions: 8 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Post: Tin Insulation Height: 0.220" (5.60mm) Number of Rows: 1 |
товар відсутній |
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310-43-108-41-107000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 8POS 0.1 GOLD SMD Packaging: Tube Connector Type: Receptacle Voltage Rating: 100V, 150VDC Current Rating (Amps): 3A Mounting Type: Surface Mount Number of Positions: 8 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Post: Tin Insulation Height: 0.220" (5.60mm) Number of Rows: 1 |
товар відсутній |
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310-83-108-41-105101 | Preci-Dip | Conn SIP Socket Strip SKT 8 POS 2.54mm Solder ST SMD Card Box |
товар відсутній |
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310-83-108-41-105101 | Preci-Dip |
Description: CONN SOCKET 8POS 0.1 GOLD SMD Packaging: Bulk Connector Type: Socket Current Rating (Amps): 3A Mounting Type: Surface Mount Number of Positions: 8 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Finish - Post: Tin Insulation Height: 0.220" (5.60mm) Number of Rows: 1 |
товар відсутній |
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310-83-108-41-105101 | Preci-dip | Headers & Wire Housings |
товар відсутній |
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310-83-108-41-105191 | Preci-Dip | Socket Connectors 2.54 mm |
товар відсутній |
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310-83-108-41-105191 | Preci-Dip |
Description: CONN SOCKET 8POS 0.1 GOLD SMD Features: Pick and Place Packaging: Bulk Connector Type: Socket Current Rating (Amps): 3A Mounting Type: Surface Mount Number of Positions: 8 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Finish - Post: Tin Part Status: Active Insulation Height: 0.220" (5.60mm) Number of Rows: 1 |
товар відсутній |
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310-87-108-41-105101 | Preci-Dip |
Description: CONN SOCKET 8POS 0.1 GOLD SMD Packaging: Bulk Connector Type: Socket Current Rating (Amps): 3A Mounting Type: Surface Mount Number of Positions: 8 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Finish - Post: Tin Insulation Height: 0.220" (5.60mm) Number of Rows: 1 |
товар відсутній |
110-43-308-41-105000 |
Виробник: Mill-Max
IC & Component Sockets 8P SMT SKT 200u Sn
IC & Component Sockets 8P SMT SKT 200u Sn
на замовлення 1601 шт:
термін постачання 21-30 дні (днів)Кількість | Ціна без ПДВ |
---|---|
2+ | 209.7 грн |
10+ | 120.12 грн |
100+ | 103.77 грн |
500+ | 103.1 грн |
2500+ | 96.99 грн |
5000+ | 94.28 грн |
10000+ | 93.6 грн |
110-43-308-41-105000 |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 8POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC DIP SOCKET 8POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
на замовлення 1140 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 1091.74 грн |
10+ | 931.83 грн |
25+ | 895.95 грн |
50+ | 807.2 грн |
100+ | 762.35 грн |
250+ | 695.08 грн |
500+ | 639.58 грн |
1000+ | 586.65 грн |
110-47-308-41-105000 |
Виробник: Mill-Max
IC & Component Sockets STANDRD SOLDER TAIL DIP SOCKET
IC & Component Sockets STANDRD SOLDER TAIL DIP SOCKET
на замовлення 490 шт:
термін постачання 21-30 дні (днів)Кількість | Ціна без ПДВ |
---|---|
4+ | 99.7 грн |
10+ | 81.12 грн |
100+ | 60.5 грн |
500+ | 55.69 грн |
1000+ | 47.75 грн |
2500+ | 44.56 грн |
110-47-308-41-105000 |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 8POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC DIP SOCKET 8POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
на замовлення 360 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
4+ | 93.18 грн |
10+ | 78.49 грн |
25+ | 75.17 грн |
50+ | 68.97 грн |
100+ | 65.83 грн |
250+ | 59.57 грн |
110-83-308-41-105101 |
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 8POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Description: CONN IC DIP SOCKET 8POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
на замовлення 101 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
3+ | 105.65 грн |
52+ | 83.21 грн |
110-87-308-41-105101 |
Виробник: Preci-Dip
Conn DIP Socket SKT 8 POS 2.54mm Solder ST SMD T/R
Conn DIP Socket SKT 8 POS 2.54mm Solder ST SMD T/R
на замовлення 36 шт:
термін постачання 21-31 дні (днів)110-87-308-41-105101 |
Виробник: Preci-dip
IC & Component Sockets 2.54mm, 8P, Surface mount, Gold Flash, 10.1x7.62x10.1x12.26
IC & Component Sockets 2.54mm, 8P, Surface mount, Gold Flash, 10.1x7.62x10.1x12.26
на замовлення 954 шт:
термін постачання 21-30 дні (днів)Кількість | Ціна без ПДВ |
---|---|
4+ | 92.58 грн |
10+ | 69.89 грн |
104+ | 52.23 грн |
520+ | 46.39 грн |
1040+ | 41.03 грн |
2548+ | 38.53 грн |
4680+ | 35.61 грн |
110-87-308-41-105161 |
Виробник: Preci-Dip
Conn DIP Socket SKT 8 POS 2.54mm Solder ST SMD T/R
Conn DIP Socket SKT 8 POS 2.54mm Solder ST SMD T/R
на замовлення 4497 шт:
термін постачання 21-31 дні (днів)110-87-308-41-105161 |
Виробник: Preci-dip
IC & Component Sockets
IC & Component Sockets
на замовлення 272 шт:
термін постачання 21-30 дні (днів)Кількість | Ціна без ПДВ |
---|---|
4+ | 94.96 грн |
10+ | 78.78 грн |
102+ | 61.99 грн |
510+ | 47.41 грн |
1020+ | 45.1 грн |
2550+ | 41.65 грн |
5049+ | 38.19 грн |
110-87-308-41-105191 |
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 8POS GOLD
Features: Open Frame
Packaging: Tape & Reel (TR)
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Description: CONN IC DIP SOCKET 8POS GOLD
Features: Open Frame
Packaging: Tape & Reel (TR)
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
на замовлення 2100 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
700+ | 61.9 грн |
1400+ | 51.09 грн |
2100+ | 49.39 грн |
110-87-308-41-105191 |
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 8POS GOLD
Features: Open Frame
Packaging: Cut Tape (CT)
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Description: CONN IC DIP SOCKET 8POS GOLD
Features: Open Frame
Packaging: Cut Tape (CT)
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
на замовлення 2497 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
4+ | 95.38 грн |
10+ | 80.05 грн |
100+ | 71.53 грн |
110-87-308-41-105191 |
Виробник: Preci-dip
IC & Component Sockets
IC & Component Sockets
на замовлення 606 шт:
термін постачання 21-30 дні (днів)Кількість | Ціна без ПДВ |
---|---|
4+ | 102.08 грн |
10+ | 88.14 грн |
100+ | 68.5 грн |
700+ | 56.84 грн |
1400+ | 55.89 грн |
110-93-308-41-105000 |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 8POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Description: CONN IC DIP SOCKET 8POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
на замовлення 50 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 1091.74 грн |
10+ | 931.83 грн |
25+ | 895.95 грн |
50+ | 807.2 грн |
110-93-308-41-105000 |
Виробник: Mill-Max
IC & Component Sockets 8P SURF-MOUNT
IC & Component Sockets 8P SURF-MOUNT
на замовлення 172 шт:
термін постачання 21-30 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 394.07 грн |
10+ | 353.34 грн |
100+ | 269.95 грн |
250+ | 236.71 грн |
500+ | 229.93 грн |
1000+ | 195.34 грн |
2500+ | 182.45 грн |
210-83-308-41-101000 |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 8POS GOLD
Features: Closed Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 300.0µin (7.62µm)
Contact Material - Post: Brass Alloy
Part Status: Obsolete
Description: CONN IC DIP SOCKET 8POS GOLD
Features: Closed Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 300.0µin (7.62µm)
Contact Material - Post: Brass Alloy
Part Status: Obsolete
на замовлення 27 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 4844.59 грн |
10+ | 4281.1 грн |
25+ | 4116.42 грн |
310-87-108-41-105101 |
Виробник: Preci-dip
Headers & Wire Housings
Headers & Wire Housings
на замовлення 614 шт:
термін постачання 21-30 дні (днів)Кількість | Ціна без ПДВ |
---|---|
3+ | 106.03 грн |
10+ | 53.82 грн |
100+ | 46.46 грн |
250+ | 45.71 грн |
950+ | 45.65 грн |
2850+ | 42.39 грн |
310-87-108-41-105191 |
Виробник: Preci-dip
Headers & Wire Housings
Headers & Wire Housings
на замовлення 650 шт:
термін постачання 21-30 дні (днів)Кількість | Ціна без ПДВ |
---|---|
2+ | 189.12 грн |
10+ | 169.26 грн |
25+ | 138.37 грн |
100+ | 119.37 грн |
250+ | 94.28 грн |
650+ | 81.39 грн |
510-87-084-11-002101 |
Виробник: Preci-dip
IC & Component Sockets
IC & Component Sockets
на замовлення 150 шт:
термін постачання 21-30 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 466.87 грн |
10+ | 416.52 грн |
19+ | 341.84 грн |
114+ | 316.75 грн |
266+ | 283.51 грн |
513+ | 266.56 грн |
684+ | 233.32 грн |
510-87-084-11-041101 |
Виробник: Preci-dip
IC & Component Sockets
IC & Component Sockets
на замовлення 138 шт:
термін постачання 21-30 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 443.92 грн |
10+ | 419.64 грн |
19+ | 332.35 грн |
57+ | 316.75 грн |
114+ | 301.15 грн |
266+ | 269.27 грн |
513+ | 253.67 грн |
510-87-084-11-042101 |
Виробник: Preci-dip
IC & Component Sockets
IC & Component Sockets
на замовлення 139 шт:
термін постачання 21-30 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 466.87 грн |
10+ | 416.52 грн |
19+ | 341.84 грн |
114+ | 316.75 грн |
266+ | 283.51 грн |
513+ | 266.56 грн |
684+ | 215.01 грн |
M80-8411042 |
Виробник: Harwin Inc.
Description: CONN HEADER R/A 10POS 2MM
Features: Strain Relief Clips
Packaging: Tube
Connector Type: Header
Voltage Rating: 120V
Current Rating (Amps): 2.2A
Mounting Type: Through Hole, Right Angle
Number of Positions: 10
Number of Rows: 2
Style: Board to Board or Cable
Operating Temperature: -55°C ~ 125°C
Contact Type: Male Pin
Fastening Type: Latch Holder
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Phosphor Bronze
Insulation Color: Black
Pitch - Mating: 0.079" (2.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Finish - Post: Tin
Part Status: Active
Contact Shape: Circular
Contact Length - Post: 0.118" (3.00mm)
Insulation Height: 0.235" (5.97mm)
Shrouding: Shrouded - 4 Wall
Insulation Material: Polyphenylene Sulfide (PPS), Glass Filled
Row Spacing - Mating: 0.079" (2.00mm)
Description: CONN HEADER R/A 10POS 2MM
Features: Strain Relief Clips
Packaging: Tube
Connector Type: Header
Voltage Rating: 120V
Current Rating (Amps): 2.2A
Mounting Type: Through Hole, Right Angle
Number of Positions: 10
Number of Rows: 2
Style: Board to Board or Cable
Operating Temperature: -55°C ~ 125°C
Contact Type: Male Pin
Fastening Type: Latch Holder
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Phosphor Bronze
Insulation Color: Black
Pitch - Mating: 0.079" (2.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Finish - Post: Tin
Part Status: Active
Contact Shape: Circular
Contact Length - Post: 0.118" (3.00mm)
Insulation Height: 0.235" (5.97mm)
Shrouding: Shrouded - 4 Wall
Insulation Material: Polyphenylene Sulfide (PPS), Glass Filled
Row Spacing - Mating: 0.079" (2.00mm)
на замовлення 300 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 300.08 грн |
18+ | 262.35 грн |
108+ | 231.18 грн |
M80-8411042 |
Виробник: Harwin
Headers & Wire Housings 5+5 POS DIL MALE R/A UNLATCHED TIN
Headers & Wire Housings 5+5 POS DIL MALE R/A UNLATCHED TIN
на замовлення 514 шт:
термін постачання 21-30 дні (днів)Кількість | Ціна без ПДВ |
---|---|
2+ | 315.73 грн |
10+ | 264.42 грн |
108+ | 214.33 грн |
252+ | 184.49 грн |
504+ | 156.68 грн |
1008+ | 153.29 грн |
0015911102 |
Виробник: Molex
Description: CONN HEADER SMD 10POS 2.54MM
Packaging: Tube
Features: Board Guide
Connector Type: Header, Breakaway
Mounting Type: Surface Mount
Number of Positions: 10
Number of Rows: 2
Style: Board to Board or Cable
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Copper Alloy
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 15.0µin (0.38µm)
Contact Finish - Post: Tin
Part Status: Discontinued at Digi-Key
Contact Shape: Square
Insulation Height: 0.090" (2.29mm)
Shrouding: Unshrouded
Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled
Row Spacing - Mating: 0.100" (2.54mm)
Contact Length - Mating: 0.240" (6.10mm)
Description: CONN HEADER SMD 10POS 2.54MM
Packaging: Tube
Features: Board Guide
Connector Type: Header, Breakaway
Mounting Type: Surface Mount
Number of Positions: 10
Number of Rows: 2
Style: Board to Board or Cable
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Copper Alloy
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 15.0µin (0.38µm)
Contact Finish - Post: Tin
Part Status: Discontinued at Digi-Key
Contact Shape: Square
Insulation Height: 0.090" (2.29mm)
Shrouding: Unshrouded
Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled
Row Spacing - Mating: 0.100" (2.54mm)
Contact Length - Mating: 0.240" (6.10mm)
на замовлення 123 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
4+ | 94.65 грн |
42+ | 75.36 грн |
15-91-1102 |
Виробник: Molex
Headers & Wire Housings 2.54MM 10P V HDR DR SMT SAU
Headers & Wire Housings 2.54MM 10P V HDR DR SMT SAU
на замовлення 5874 шт:
термін постачання 21-30 дні (днів)Кількість | Ціна без ПДВ |
---|---|
4+ | 101.29 грн |
10+ | 82.68 грн |
100+ | 69.18 грн |
500+ | 58.13 грн |
1000+ | 49.85 грн |
2268+ | 46.53 грн |
411-87-208-41-001101 |
Виробник: Preci-Dip
Conn Socket Strip SKT 8 POS 2.54mm Solder ST Top Entry Thru-Hole
Conn Socket Strip SKT 8 POS 2.54mm Solder ST Top Entry Thru-Hole
на замовлення 1000 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1000+ | 23.42 грн |
0638084110 |
Виробник: Molex
Description: FA2 APPLICATOR - PNEUMATIC FEED
Packaging: Bulk
For Use With/Related Products: Rectangular Contacts
Tool Type: Applicator for Bench Press
Wire Gauge or Range - AWG: 16-18 AWG
Tool Method: Pneumatic
Description: FA2 APPLICATOR - PNEUMATIC FEED
Packaging: Bulk
For Use With/Related Products: Rectangular Contacts
Tool Type: Applicator for Bench Press
Wire Gauge or Range - AWG: 16-18 AWG
Tool Method: Pneumatic
товар відсутній
10131318-0841100LF |
Виробник: Amphenol FCI
Power to the Board Minitek Power4.2HCC DR RATH HDR 8Pos 30Mic Au
Power to the Board Minitek Power4.2HCC DR RATH HDR 8Pos 30Mic Au
товар відсутній
10131318-084110PLF |
Виробник: Amphenol FCI
Power to the Board Minitek Power4.2HCC DR RATH HDR 8Pos 30Mic Au
Power to the Board Minitek Power4.2HCC DR RATH HDR 8Pos 30Mic Au
товар відсутній
10131318-084110RLF |
Виробник: Amphenol FCI
Power to the Board Minitek Power4.2HCC DR RATH HDR 8Pos 30Mic Au
Power to the Board Minitek Power4.2HCC DR RATH HDR 8Pos 30Mic Au
товар відсутній
10131319-0841100LF |
Виробник: Amphenol FCI
Power to the Board Minitek Power4.2HCC DR VTH HDR 8Pos 30Mic Au
Power to the Board Minitek Power4.2HCC DR VTH HDR 8Pos 30Mic Au
товар відсутній
10131319-084110PLF |
Виробник: Amphenol FCI
Power to the Board Minitek Power4.2HCC DR VTH HDR 8Pos 30Mic Au
Power to the Board Minitek Power4.2HCC DR VTH HDR 8Pos 30Mic Au
товар відсутній
10131319-084110PLF |
Виробник: Amphenol ICC (FCI)
Description: CONN HEADER VERT
Packaging: Tray
Features: Board Lock
Connector Type: Header
Voltage Rating: 600VAC/DC
Current Rating (Amps): Varies by Wire Gauge
Mounting Type: Through Hole
Number of Positions: 8
Number of Rows: 2
Style: Board to Cable/Wire
Operating Temperature: -40°C ~ 105°C
Contact Type: Male Pin
Fastening Type: Locking Ramp
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Copper Alloy
Insulation Color: Natural
Pitch - Mating: 0.165" (4.20mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Part Status: Active
Contact Shape: Square
Contact Length - Post: 0.138" (3.50mm)
Insulation Height: 0.504" (12.80mm)
Shrouding: Shrouded - 4 Wall
Insulation Material: Polyamide (PA66), Nylon 6/6
Row Spacing - Mating: 0.165" (4.20mm)
Description: CONN HEADER VERT
Packaging: Tray
Features: Board Lock
Connector Type: Header
Voltage Rating: 600VAC/DC
Current Rating (Amps): Varies by Wire Gauge
Mounting Type: Through Hole
Number of Positions: 8
Number of Rows: 2
Style: Board to Cable/Wire
Operating Temperature: -40°C ~ 105°C
Contact Type: Male Pin
Fastening Type: Locking Ramp
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Copper Alloy
Insulation Color: Natural
Pitch - Mating: 0.165" (4.20mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Part Status: Active
Contact Shape: Square
Contact Length - Post: 0.138" (3.50mm)
Insulation Height: 0.504" (12.80mm)
Shrouding: Shrouded - 4 Wall
Insulation Material: Polyamide (PA66), Nylon 6/6
Row Spacing - Mating: 0.165" (4.20mm)
товар відсутній
10131319-084110RLF |
Виробник: Amphenol FCI
Power to the Board Minitek Power4.2HCC DR VTH HDR 8Pos 30Mic Au
Power to the Board Minitek Power4.2HCC DR VTH HDR 8Pos 30Mic Au
товар відсутній
10131319-084110TLF |
Виробник: Amphenol FCI
Power to the Board Minitek Power4.2HCC DR VTH HDR 8Pos 30Mic Au
Power to the Board Minitek Power4.2HCC DR VTH HDR 8Pos 30Mic Au
товар відсутній
110-41-308-41-105000 |
Виробник: Mill-Max
IC & Component Sockets DIP Dual In Line Socket
IC & Component Sockets DIP Dual In Line Socket
товар відсутній
110-41-308-41-105000 |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Features: Open Frame
Packaging: Tube
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC SKT DBL
Features: Open Frame
Packaging: Tube
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товар відсутній
110-83-308-41-105101 |
Виробник: Preci-Dip
Conn DIP Socket SKT 8 POS 2.54mm Solder ST SMD T/R
Conn DIP Socket SKT 8 POS 2.54mm Solder ST SMD T/R
товар відсутній
110-83-308-41-105101 |
Виробник: Preci-dip
IC & Component Sockets 2.54mm, 8P, Surface mount, .75 Au, 10.1x7.62x10.1x12.26
IC & Component Sockets 2.54mm, 8P, Surface mount, .75 Au, 10.1x7.62x10.1x12.26
товар відсутній
110-83-308-41-105161 |
Виробник: Preci-Dip
Conn DIP Socket SKT 8 POS 2.54mm Solder ST SMD T/R
Conn DIP Socket SKT 8 POS 2.54mm Solder ST SMD T/R
товар відсутній
110-83-308-41-105161 |
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 8POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 8POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товар відсутній
110-83-308-41-105191 |
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 8POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Description: CONN IC DIP SOCKET 8POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
товар відсутній
110-87-308-41-105101 |
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 8POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Description: CONN IC DIP SOCKET 8POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
товар відсутній
110-87-308-41-105161 |
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 8POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 8POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товар відсутній
110-87-308-41-105191 |
Виробник: Preci-Dip
Conn DIP Socket SKT 8 POS 1.54mm Solder ST SMD
Conn DIP Socket SKT 8 POS 1.54mm Solder ST SMD
товар відсутній
110-91-308-41-105000 |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Features: Open Frame
Packaging: Tube
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Description: CONN IC SKT DBL
Features: Open Frame
Packaging: Tube
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
товар відсутній
23008411-01 |
Виробник: Chogori Technologies Inc.
Description: CONN RCPT FMALE 8POS SOLDER CUP
Packaging: Bulk
Features: Backshell
Connector Type: Receptacle, Female Sockets
Color: Black
Voltage Rating: 60V
Current Rating (Amps): 5A
Mounting Type: Free Hanging (In-Line)
Shielding: Unshielded
Number of Positions: 8
Orientation: Keyed
Operating Temperature: -45°C ~ 105°C
Fastening Type: Threaded
Termination: Solder Cup
Ingress Protection: IP68 - Dust Tight, Waterproof
Cable Opening: 0.138" ~ 0.256" (3.50mm ~ 6.50mm)
Contact Finish - Mating: Gold
Part Status: Active
Shell Material: Polyamide (PA66), Nylon 6/6
Primary Material: Plastic
Description: CONN RCPT FMALE 8POS SOLDER CUP
Packaging: Bulk
Features: Backshell
Connector Type: Receptacle, Female Sockets
Color: Black
Voltage Rating: 60V
Current Rating (Amps): 5A
Mounting Type: Free Hanging (In-Line)
Shielding: Unshielded
Number of Positions: 8
Orientation: Keyed
Operating Temperature: -45°C ~ 105°C
Fastening Type: Threaded
Termination: Solder Cup
Ingress Protection: IP68 - Dust Tight, Waterproof
Cable Opening: 0.138" ~ 0.256" (3.50mm ~ 6.50mm)
Contact Finish - Mating: Gold
Part Status: Active
Shell Material: Polyamide (PA66), Nylon 6/6
Primary Material: Plastic
товар відсутній
23008411-02 |
Виробник: Chogori Technologies Inc.
Description: CONN RCPT FMALE 8POS SOLDER CUP
Packaging: Bulk
Features: Backshell
Connector Type: Receptacle, Female Sockets
Color: Black
Voltage Rating: 60V
Current Rating (Amps): 5A
Mounting Type: Free Hanging (In-Line)
Shielding: Unshielded
Number of Positions: 8
Orientation: Keyed
Operating Temperature: -45°C ~ 105°C
Fastening Type: Threaded
Termination: Solder Cup
Ingress Protection: IP68 - Dust Tight, Waterproof
Cable Opening: 0.256" ~ 0.374" (6.50mm ~ 9.50mm)
Contact Finish - Mating: Gold
Part Status: Active
Shell Material: Polyamide (PA66), Nylon 6/6
Primary Material: Plastic
Description: CONN RCPT FMALE 8POS SOLDER CUP
Packaging: Bulk
Features: Backshell
Connector Type: Receptacle, Female Sockets
Color: Black
Voltage Rating: 60V
Current Rating (Amps): 5A
Mounting Type: Free Hanging (In-Line)
Shielding: Unshielded
Number of Positions: 8
Orientation: Keyed
Operating Temperature: -45°C ~ 105°C
Fastening Type: Threaded
Termination: Solder Cup
Ingress Protection: IP68 - Dust Tight, Waterproof
Cable Opening: 0.256" ~ 0.374" (6.50mm ~ 9.50mm)
Contact Finish - Mating: Gold
Part Status: Active
Shell Material: Polyamide (PA66), Nylon 6/6
Primary Material: Plastic
товар відсутній
310-41-108-41-105000 |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN RCPT 8POS 0.1 GOLD SMD
Packaging: Bulk
Connector Type: Receptacle
Voltage Rating: 100V, 150VDC
Current Rating (Amps): 3A
Mounting Type: Surface Mount
Number of Positions: 8
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Post: Tin
Part Status: Active
Insulation Height: 0.220" (5.60mm)
Number of Rows: 1
Description: CONN RCPT 8POS 0.1 GOLD SMD
Packaging: Bulk
Connector Type: Receptacle
Voltage Rating: 100V, 150VDC
Current Rating (Amps): 3A
Mounting Type: Surface Mount
Number of Positions: 8
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Post: Tin
Part Status: Active
Insulation Height: 0.220" (5.60mm)
Number of Rows: 1
товар відсутній
310-41-108-41-107000 |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN RCPT 8POS 0.1 GOLD SMD
Packaging: Bulk
Connector Type: Receptacle
Voltage Rating: 100V, 150VDC
Current Rating (Amps): 3A
Mounting Type: Surface Mount
Number of Positions: 8
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Post: Tin
Part Status: Active
Insulation Height: 0.220" (5.60mm)
Number of Rows: 1
Description: CONN RCPT 8POS 0.1 GOLD SMD
Packaging: Bulk
Connector Type: Receptacle
Voltage Rating: 100V, 150VDC
Current Rating (Amps): 3A
Mounting Type: Surface Mount
Number of Positions: 8
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Post: Tin
Part Status: Active
Insulation Height: 0.220" (5.60mm)
Number of Rows: 1
товар відсутній
310-43-108-41-105000 |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN RCPT 8POS 0.1 GOLD SMD
Packaging: Tube
Connector Type: Receptacle
Voltage Rating: 100V, 150VDC
Current Rating (Amps): 3A
Mounting Type: Surface Mount
Number of Positions: 8
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Tin
Insulation Height: 0.220" (5.60mm)
Number of Rows: 1
Description: CONN RCPT 8POS 0.1 GOLD SMD
Packaging: Tube
Connector Type: Receptacle
Voltage Rating: 100V, 150VDC
Current Rating (Amps): 3A
Mounting Type: Surface Mount
Number of Positions: 8
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Tin
Insulation Height: 0.220" (5.60mm)
Number of Rows: 1
товар відсутній
310-43-108-41-107000 |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN RCPT 8POS 0.1 GOLD SMD
Packaging: Tube
Connector Type: Receptacle
Voltage Rating: 100V, 150VDC
Current Rating (Amps): 3A
Mounting Type: Surface Mount
Number of Positions: 8
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Tin
Insulation Height: 0.220" (5.60mm)
Number of Rows: 1
Description: CONN RCPT 8POS 0.1 GOLD SMD
Packaging: Tube
Connector Type: Receptacle
Voltage Rating: 100V, 150VDC
Current Rating (Amps): 3A
Mounting Type: Surface Mount
Number of Positions: 8
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Tin
Insulation Height: 0.220" (5.60mm)
Number of Rows: 1
товар відсутній
310-83-108-41-105101 |
Виробник: Preci-Dip
Conn SIP Socket Strip SKT 8 POS 2.54mm Solder ST SMD Card Box
Conn SIP Socket Strip SKT 8 POS 2.54mm Solder ST SMD Card Box
товар відсутній
310-83-108-41-105101 |
Виробник: Preci-Dip
Description: CONN SOCKET 8POS 0.1 GOLD SMD
Packaging: Bulk
Connector Type: Socket
Current Rating (Amps): 3A
Mounting Type: Surface Mount
Number of Positions: 8
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Finish - Post: Tin
Insulation Height: 0.220" (5.60mm)
Number of Rows: 1
Description: CONN SOCKET 8POS 0.1 GOLD SMD
Packaging: Bulk
Connector Type: Socket
Current Rating (Amps): 3A
Mounting Type: Surface Mount
Number of Positions: 8
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Finish - Post: Tin
Insulation Height: 0.220" (5.60mm)
Number of Rows: 1
товар відсутній
310-83-108-41-105191 |
Виробник: Preci-Dip
Description: CONN SOCKET 8POS 0.1 GOLD SMD
Features: Pick and Place
Packaging: Bulk
Connector Type: Socket
Current Rating (Amps): 3A
Mounting Type: Surface Mount
Number of Positions: 8
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Finish - Post: Tin
Part Status: Active
Insulation Height: 0.220" (5.60mm)
Number of Rows: 1
Description: CONN SOCKET 8POS 0.1 GOLD SMD
Features: Pick and Place
Packaging: Bulk
Connector Type: Socket
Current Rating (Amps): 3A
Mounting Type: Surface Mount
Number of Positions: 8
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Finish - Post: Tin
Part Status: Active
Insulation Height: 0.220" (5.60mm)
Number of Rows: 1
товар відсутній
310-87-108-41-105101 |
Виробник: Preci-Dip
Description: CONN SOCKET 8POS 0.1 GOLD SMD
Packaging: Bulk
Connector Type: Socket
Current Rating (Amps): 3A
Mounting Type: Surface Mount
Number of Positions: 8
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Finish - Post: Tin
Insulation Height: 0.220" (5.60mm)
Number of Rows: 1
Description: CONN SOCKET 8POS 0.1 GOLD SMD
Packaging: Bulk
Connector Type: Socket
Current Rating (Amps): 3A
Mounting Type: Surface Mount
Number of Positions: 8
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Finish - Post: Tin
Insulation Height: 0.220" (5.60mm)
Number of Rows: 1
товар відсутній
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