Виробник: NXP Semiconductors
MCU 32-bit ARM Cortex M0+ RISC 64KB Flash 3.3V/5V Tray

Виробник: NXP Semiconductors
MCU 32-bit ARM Cortex M0+ RISC 16KB Flash 1.8V/2.5V/3.3V 32-Pin QFN EP Tray

Виробник: NXP Semiconductors
MCU 32-bit ARM Cortex M0+ RISC 32KB Flash 1.8V/2.5V/3.3V 64-Pin LQFP Tray

Виробник: NXP Semiconductors
Power Management IC 2.8V to 4.5V 56-Pin QFN EP Tray

Виробник: NXP USA Inc.
Description: IC MPU MPC82XX 266MHZ PBGA516
Packaging: Tray
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC G2_LE
Voltage - I/O: 3.3V
Supplier Device Package: 516-PBGA (27x27)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Part Status: Active

Виробник: NXP Semiconductors
MPU PowerQUICC II Pro MPC83xx Processor RISC 32bit 90nm 400MHz 620-Pin TEBGA II Tray

Виробник: NXP Semiconductors
MPU PowerQUICC II Pro MPC83xx Processor RISC 32bit 90nm 266MHz 1.8V/2.5V/3.3V 516-Pin TEBGA Tray

Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 66MHZ 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, PCMCIA, SPI, TDM, UART

Виробник: NXP Semiconductors
Wireless Power Transmitter/Receiver Automotive AEC-Q100 100-Pin LQFP

Виробник: NXP USA Inc.
Description: IC MPU QORIQ P4 1.5GHZ 1295BGA
Packaging: Tray
Package / Case: 1295-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.5GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500mc
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 1295-FCPBGA (37.5x37.5)
Ethernet: 1Gbps (8), 10Gbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 8 Core, 32-Bit
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, MMC/SD, RapidIO, SPI
Part Status: Obsolete

Виробник: NXP Semiconductors
S32K312, 2MB flash, ARM M7

Виробник: NXP Semiconductors
MCU 16-bit S12Z CISC 128KB Flash 5V Automotive 64-Pin HLQFP EP Tray

Виробник: NXP Semiconductors
MCU 8-bit S08 CISC 32KB Flash 3.3V/5V Automotive 48-Pin LQFP Tray

Виробник: NXP Semiconductors
MCU 16-bit S12 CISC 240KB Flash 5V Automotive 64-Pin LQFP Tray

Виробник: NXP USA Inc.
Description: IC MCU 16BIT 48KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: S12
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 26

Виробник: NXP Semiconductors
16-bit Microcontrollers - MCU 16-bit MCU, S12 core, 48KB Flash, 25MHz, -40/+85degC, Prototype, QFP 32

Виробник: NXP Semiconductors
MCU 16-bit S12 CISC 240KB Flash 3.3V/5V Automotive 100-Pin LQFP Tray

Виробник: NXP Semiconductors
MCU 16-bit HCS12 CISC 96KB Flash 5V Automotive 48-Pin QFN EP Tray

Виробник: NXP USA Inc.
Description: IC AUD DECODER 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Type: Audio Decoder
Voltage - Supply, Analog: 3V ~ 3.6V
Voltage - Supply, Digital: 1.8V, 3.3V
Applications: Audio CD
Supplier Device Package: 144-LQFP (20x20)
Part Status: Obsolete

Виробник: NXP Semiconductors
MCU 32-bit PowerPC RISC ROMLess 2.6V/5V Automotive 388-Pin BGA Tray

Виробник: NXP USA Inc.
Description: IC MCU 32BIT 6MB FLSH 256MAPPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Part Status: Active
Number of I/O: 178
DigiKey Programmable: Not Verified

Виробник: NXP Semiconductors
32-bit Microcontrollers - MCU TRIPLE CORE, 6M FLASH, 768K RAM