Результат пошуку "31685" : > 120
Вид перегляду :
Фото | Назва | Виробник | Інформація |
Доступність |
Ціна без ПДВ |
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0831685 | Phoenix Contact | Labels & Industrial Warning Signs LS-EMLP (20X8) WH |
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1-103168-5 | TE Connectivity AMP Connectors |
Description: CONN HEADER VERT 34POS 2.54MM Packaging: Tray Connector Type: Header Current Rating (Amps): 3A Mounting Type: Through Hole Number of Positions: 34 Number of Rows: 2 Style: Board to Board or Cable Operating Temperature: -65°C ~ 105°C Contact Type: Male Pin Fastening Type: Detent Lock Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Phosphor Bronze Insulation Color: Black Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Post: Tin-Lead Part Status: Active Contact Shape: Square Contact Length - Post: 0.125" (3.18mm) Insulation Height: 0.440" (11.18mm) Shrouding: Shrouded - 4 Wall Overall Contact Length: 0.533" (13.55mm) Insulation Material: Thermoplastic Row Spacing - Mating: 0.100" (2.54mm) Contact Length - Mating: 0.318" (8.08mm) |
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1-103168-5 | TE Connectivity | Headers & Wire Housings SHROUDED VER DUAL 34 detent windows |
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103168-5 | TE Connectivity | Conn Shrouded Header (4 Sides) HDR 14 POS 2.54mm Solder ST Top Entry Thru-Hole Automotive Tray |
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103168-5 | TE Connectivity AMP Connectors |
Description: CONN HEADER VERT 14POS 2.54MM Packaging: Tray Connector Type: Header Current Rating (Amps): 3A Mounting Type: Through Hole Number of Positions: 14 Number of Rows: 2 Style: Board to Board or Cable Operating Temperature: -65°C ~ 105°C Contact Type: Male Pin Fastening Type: Detent Lock Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Phosphor Bronze Insulation Color: Black Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Post: Tin-Lead Part Status: Active Contact Shape: Square Contact Length - Post: 0.125" (3.18mm) Insulation Height: 0.440" (11.18mm) Shrouding: Shrouded - 4 Wall Overall Contact Length: 0.533" (13.55mm) Insulation Material: Thermoplastic Row Spacing - Mating: 0.100" (2.54mm) Contact Length - Mating: 0.318" (8.08mm) |
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103168-5 | TE Connectivity | Headers & Wire Housings SHROUDED VER DUAL 14 detent windows |
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1423168-5 | TE Connectivity | Time Delay Relay 120VAC 10A DPDT(82.55x78.49x107.95)mm Panel |
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2-103168-5 | TE Connectivity | Headers & Wire Housings 54 MODII HDR DRST SHRD .100CL |
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2-1423168-5 | TE Connectivity | TimeDelayRelaysRLY NUC ON 2P 240VA |
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2316851-1 | TE Connectivity | Sensor Module Analog Output 3.3V 7-Pin |
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2316851-1 | TE Connectivity AMP Connectors |
Description: SENSOR HUM/TEMP I2C OUTPUT Packaging: Tray Output Type: I2C Operating Temperature: -5°C ~ 50°C Sensor Type: Humidity, Temperature Part Status: Obsolete |
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2316851-1 | TE Connectivity | Sensor Module Analog Output 3.3V 7-Pin |
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2316851-2 | TE Connectivity | Sensor Module Analog Output 3.3V 7-Pin |
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2316851-2 | TE Connectivity AMP Connectors |
Description: SENSOR AUDIO/HUM/LGT/MOT I2C OUT Packaging: Tray Output Type: I2C Operating Temperature: -5°C ~ 50°C Sensor Type: Audio, Humidity, Light, Motion, Temperature Part Status: Obsolete |
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2316852-1 | TE Connectivity | Sensor Module Analog Output 3.3V 7-Pin |
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2316852-1 | TE Connectivity AMP Connectors |
Description: SENSOR MULTI FUNCTION I2C OUTPUT Packaging: Tray Output Type: I2C Operating Temperature: -5°C ~ 50°C Sensor Type: Gas, Humidity, Light, Motion, Temperature Part Status: Obsolete |
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2316852-1 | TE Connectivity | Sensor Module Analog Output 3.3V 7-Pin |
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2316852-2 | TE Connectivity | Sensor Module Analog Output 3.3V 7-Pin |
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2316852-2 | TE Connectivity | Sensor Module Analog Output 3.3V 7-Pin |
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2316852-2 | TE Connectivity AMP Connectors |
Description: SENSOR HUM/LGT/MOT/TEMP I2C OUT Packaging: Tray Output Type: I2C Operating Temperature: -5°C ~ 50°C Sensor Type: Humidity, Light, Motion, Temperature Part Status: Obsolete |
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3-1423168-5 | TE Connectivity | TimeDelayRelaysRLY NUC ON 2P 120V 30M LLS |
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5-103168-5 | TE Connectivity | Conn Shrouded Header (4 Sides) HDR 14 POS 2.54mm Solder ST Top Entry Thru-Hole Tray |
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5-103168-5 | TE Connectivity | Conn Shrouded Header (4 Sides) HDR 14 POS 2.54mm Solder ST Top Entry Thru-Hole Tray |
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523168-5 | TE Connectivity | HTS Heavy Duty Connectors, TURRET HEAD |
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523168-5 | TE Connectivity / AMP | Crimpers / Crimping Tools TURRET HEAD TYCO TH493T |
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6-103168-5 | TE Connectivity | Conn Shrouded Header (4 Sides) HDR 34 POS 2.54mm Solder ST Top Entry Thru-Hole Tray |
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6-103168-5 | TE Connectivity | Conn Shrouded Header (4 Sides) HDR 34 POS 2.54mm Solder ST Top Entry Thru-Hole Tray |
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6-1423168-5 | TE Connectivity | TimeDelayRelaysRLY NUC ON 2P 127V50HZ 1S |
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750316854 | Würth Elektronik |
Description: XFMR FWD P-P DC/DC CONV 200UH SM Packaging: Tape & Reel (TR) Size / Dimension: 0.450" L x 0.327" W (11.43mm x 8.30mm) Mounting Type: Surface Mount Frequency: 420kHz Type: For DC/DC Converters Operating Temperature: -40°C ~ 125°C Applications: Forward, Push-Pull Converters Voltage - Isolation: 2500Vrms Voltage - Primary: 5V Footprint: 0.581" L x 0.327" W (14.75mm x 8.30mm) Chipset Manufacturer: Texas Instruments Height - Seated (Max): 0.165" (4.20mm) Inductance @ Frequency: 200µH @ 10kHz Part Status: Active |
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750316855 | Würth Elektronik |
Description: XFMR FWD P-P DC/DC CONV 200UH SM Packaging: Tape & Reel (TR) Size / Dimension: 0.450" L x 0.327" W (11.43mm x 8.30mm) Mounting Type: Surface Mount Frequency: 420kHz Type: For DC/DC Converters Operating Temperature: -40°C ~ 125°C Applications: Forward, Push-Pull Converters Voltage - Isolation: 2500Vrms Voltage - Primary: 5V Footprint: 0.581" L x 0.327" W (14.75mm x 8.30mm) Chipset Manufacturer: Texas Instruments Height - Seated (Max): 0.165" (4.20mm) Inductance @ Frequency: 200µH @ 10kHz Part Status: Active |
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750316855 | Würth Elektronik |
Description: XFMR FWD P-P DC/DC CONV 200UH SM Packaging: Cut Tape (CT) Size / Dimension: 0.450" L x 0.327" W (11.43mm x 8.30mm) Mounting Type: Surface Mount Frequency: 420kHz Type: For DC/DC Converters Operating Temperature: -40°C ~ 125°C Applications: Forward, Push-Pull Converters Voltage - Isolation: 2500Vrms Voltage - Primary: 5V Footprint: 0.581" L x 0.327" W (14.75mm x 8.30mm) Chipset Manufacturer: Texas Instruments Height - Seated (Max): 0.165" (4.20mm) Inductance @ Frequency: 200µH @ 10kHz Part Status: Active |
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77316-852LF | Amphenol ICC (FCI) |
Description: CONN HEADER R/A 9POS 2.54MM Packaging: Bag Connector Type: Header, Breakaway Current Rating (Amps): 3A per Contact Mounting Type: Through Hole, Right Angle Number of Positions: 9 Number of Rows: 1 Style: Board to Board Operating Temperature: -65°C ~ 125°C Contact Type: Male Pin Fastening Type: Push-Pull Number of Positions Loaded: 3 Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Phosphor Bronze Insulation Color: Black Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold or Gold, GXT™ Contact Finish Thickness - Mating: 15.0µin (0.38µm) Part Status: Active Contact Shape: Square Contact Length - Post: 0.136" (3.46mm) Insulation Height: 0.094" (2.40mm) Shrouding: Unshrouded Insulation Material: Thermoplastic Contact Length - Mating: 0.394" (10.00mm) |
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77316-852LF | Amphenol FCI | Headers & Wire Housings BERGSTIK |
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CPI-2316-85T | CUI DEVICES | Audio Buzzer Piezo 3VDC 20VDC 10mA 12VDC 85dB 2500Hz to 3500Hz Through Hole Pin Carton |
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FPC31685A | Essentra | Conduit Fittings & Accessories PIPE CAP CLOSED-END:PE FLEXIBLE YELLOW |
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61500161155 | 3M |
Description: SURFACE LS BELT 2X17-3/4" A CRS Packaging: Box Type: Abrasive Belt |
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D-141-0111CS555 | TE Connectivity Raychem Cable Protection |
Description: SLDR SLV WIRE-WIRE 0.035/0.075" Packaging: Bulk Color: Transparent - Blue Diameter: 0.035" (0.89mm), 0.075" (1.91mm) Length: 0.240" (6.10mm) Type: Wire to Wire |
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FS32K118LIT0VLFR | NXP Semiconductors | MCU 32-bit ARM Cortex M0+ RISC 256KB Flash 3.3V/5V Automotive 48-Pin LQFP T/R |
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FS32K118LIT0VLFR | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 48LQFP Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 256KB (256K x 8) RAM Size: 25K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 16x12b SAR; D/A1x8b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART Peripherals: DMA, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 43 DigiKey Programmable: Not Verified |
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FS32K118LIT0VLFR | NXP Semiconductors | ARM Microcontrollers - MCU S32K118 Arm Cortex-M0+, 48 MHz, 256 Kb Flash, ISELED, FlexIO, LQFP48 - S32K MCUs for General-Purpose |
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FS32K118LIT0VLFT | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 48LQFP Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 256KB (256K x 8) RAM Size: 25K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 16x12b SAR; D/A1x8b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART Peripherals: DMA, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 43 DigiKey Programmable: Not Verified |
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FS32K118LIT0VLFT | NXP Semiconductors | MCU 32-bit ARM Cortex M0+ RISC 256KB Flash 3.3V/5V Automotive 48-Pin LQFP Tray |
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GC00437 | Caplugs | Adhesive Tapes GC00437 7/16" GLASS CLOTH DISC(2000/ROLL) |
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HHM1711Q1 | TDK Corporation |
Description: BALUN 2.3GHZ-3.8GHZ 50/100 0603 Packaging: Tape & Reel (TR) Package / Case: 0603 (1608 Metric), 6 PC Pad Mounting Type: Surface Mount Frequency Range: 2.3Ghz ~ 3.8GHz Impedance - Unbalanced/Balanced: 50 / 100Ohm Insertion Loss (Max): 1.0dB Return Loss (Min): 10dB Phase Difference: 180° ±15° Part Status: Active |
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LFTCXO063712BULK | IQD Frequency Products |
Description: XTAL OSC TCXO 20.0000MHZ HCMOS Packaging: Strip Package / Case: 8-SMD, No Lead Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm) Mounting Type: Surface Mount Output: HCMOS Type: TCXO Operating Temperature: -20°C ~ 70°C Frequency Stability: ±280ppb Voltage - Supply: 3.3V Current - Supply (Max): 10mA Height - Seated (Max): 0.094" (2.40mm) Part Status: Active Frequency: 20 MHz Base Resonator: Crystal |
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MC9S08SH8CTJR | NXP Semiconductors | MCU 8-bit S08 CISC 8KB Flash 3.3V/5V 20-Pin TSSOP T/R |
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OD2510-12LLB | Orion Fans |
Description: FAN AXIAL 25X10MM 12VDC WIRE Packaging: Bulk Features: Auto Restart Voltage - Rated: 12VDC Size / Dimension: Square - 25mm L x 25mm H Bearing Type: Ball RPM: 7000 RPM Air Flow: 1.5 CFM (0.042m³/min) Width: 10.00mm Weight: 0.022 lb (9.98 g) Operating Temperature: 14 ~ 158°F (-10 ~ 70°C) Termination: 2 Wire Leads Approval Agency: cURus, TUV Fan Type: Tubeaxial Noise: 15.0dB(A) Static Pressure: 0.070 in H2O (17.4 Pa) Part Status: Active Power (Watts): 840 mW |
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OM9800/MCT8000,599 | NXP Semiconductors | LPC2212 Development Board |
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S912XDP512J1VAL | NXP Semiconductors | MCU 16-bit HCS12X CISC 512KB Flash 2.5V/5V Automotive 112-Pin LQFP Tray |
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S912XDP512J1VAL | NXP USA Inc. |
Description: IC MCU 16BIT 512KB FLASH 112LQFP Packaging: Tray Package / Case: 112-LQFP Mounting Type: Surface Mount Speed: 80MHz Program Memory Size: 512KB (512K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: HCS12X Data Converters: A/D 8x10b, 16x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V Connectivity: CANbus, I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 112-LQFP (20x20) Part Status: Not For New Designs Number of I/O: 91 DigiKey Programmable: Not Verified |
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S912XDP512J1VAL | NXP Semiconductors | 16-bit Microcontrollers - MCU 912XDP512J1 GENERAL |
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S912XDP512J1VALR | NXP Semiconductors | MCU 16-bit HCS12X CISC 512KB Flash 2.5V/5V Automotive 112-Pin LQFP T/R |
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S912XDP512J1VALR | NXP USA Inc. |
Description: IC MCU 16BIT 512KB FLASH 112LQFP Packaging: Tape & Reel (TR) Package / Case: 112-LQFP Mounting Type: Surface Mount Speed: 80MHz Program Memory Size: 512KB (512K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: HCS12X Data Converters: A/D 8x10b, 16x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V Connectivity: CANbus, I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 112-LQFP (20x20) Number of I/O: 91 DigiKey Programmable: Not Verified |
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S912XDP512J1VALR | NXP Semiconductors | 16-bit Microcontrollers - MCU 912XDP512J1 GENERAL |
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S912XDT512J1CAG | NXP USA Inc. |
Description: IC MCU 16BIT 512KB FLASH 144LQFP Packaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 80MHz Program Memory Size: 512KB (512K x 8) RAM Size: 20K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: HCS12X Data Converters: A/D 24x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V Connectivity: CANbus, I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Part Status: Not For New Designs Number of I/O: 119 DigiKey Programmable: Not Verified |
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S912XDT512J1CAG | NXP Semiconductors | MCU 16-bit HCS12X CISC 512KB Flash 2.5V/5V Automotive 144-Pin LQFP Tray |
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S912XDT512J1CAG | NXP Semiconductors | 16-bit Microcontrollers - MCU 16-bit MCU, S12X core, 512KB Flash, 80MHz, -40/+85degC, Automotive Qualified, QFP 144 |
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S912XDT512J1CAGR | NXP USA Inc. |
Description: IC MCU 16BIT 512KB FLASH 144LQFP Packaging: Tape & Reel (TR) Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 80MHz Program Memory Size: 512KB (512K x 8) RAM Size: 20K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: HCS12X Data Converters: A/D 24x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V Connectivity: CANbus, I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Number of I/O: 119 DigiKey Programmable: Not Verified |
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S912XDT512J1CAGR | NXP Semiconductors | 16-bit Microcontrollers - MCU 16-bit MCU, S12X core, 512KB Flash, 80MHz, -40/+85degC, Automotive Qualified, QFP 144 |
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U5354-000002-001BG | TE Connectivity Measurement Specialties |
Description: SENSOR Features: Temperature Compensated Packaging: Box Package / Case: Cylinder Output Type: Analog Current Output: 4 mA ~ 20 mA Operating Pressure: 14.5PSI (100kPa) Pressure Type: Vented Gauge Accuracy: ±0.1% Operating Temperature: -40°C ~ 125°C Termination Style: Connector Voltage - Supply: 9V ~ 30V Port Size: Male - 1/4" (6.35mm) BSPP Applications: Industrial Automation Port Style: Threaded Maximum Pressure: 43.51PSI (300kPa) Part Status: Active |
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0831685 |
Виробник: Phoenix Contact
Labels & Industrial Warning Signs LS-EMLP (20X8) WH
Labels & Industrial Warning Signs LS-EMLP (20X8) WH
товар відсутній
1-103168-5 |
Виробник: TE Connectivity AMP Connectors
Description: CONN HEADER VERT 34POS 2.54MM
Packaging: Tray
Connector Type: Header
Current Rating (Amps): 3A
Mounting Type: Through Hole
Number of Positions: 34
Number of Rows: 2
Style: Board to Board or Cable
Operating Temperature: -65°C ~ 105°C
Contact Type: Male Pin
Fastening Type: Detent Lock
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Phosphor Bronze
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Tin-Lead
Part Status: Active
Contact Shape: Square
Contact Length - Post: 0.125" (3.18mm)
Insulation Height: 0.440" (11.18mm)
Shrouding: Shrouded - 4 Wall
Overall Contact Length: 0.533" (13.55mm)
Insulation Material: Thermoplastic
Row Spacing - Mating: 0.100" (2.54mm)
Contact Length - Mating: 0.318" (8.08mm)
Description: CONN HEADER VERT 34POS 2.54MM
Packaging: Tray
Connector Type: Header
Current Rating (Amps): 3A
Mounting Type: Through Hole
Number of Positions: 34
Number of Rows: 2
Style: Board to Board or Cable
Operating Temperature: -65°C ~ 105°C
Contact Type: Male Pin
Fastening Type: Detent Lock
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Phosphor Bronze
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Tin-Lead
Part Status: Active
Contact Shape: Square
Contact Length - Post: 0.125" (3.18mm)
Insulation Height: 0.440" (11.18mm)
Shrouding: Shrouded - 4 Wall
Overall Contact Length: 0.533" (13.55mm)
Insulation Material: Thermoplastic
Row Spacing - Mating: 0.100" (2.54mm)
Contact Length - Mating: 0.318" (8.08mm)
товар відсутній
1-103168-5 |
Виробник: TE Connectivity
Headers & Wire Housings SHROUDED VER DUAL 34 detent windows
Headers & Wire Housings SHROUDED VER DUAL 34 detent windows
товар відсутній
103168-5 |
Виробник: TE Connectivity
Conn Shrouded Header (4 Sides) HDR 14 POS 2.54mm Solder ST Top Entry Thru-Hole Automotive Tray
Conn Shrouded Header (4 Sides) HDR 14 POS 2.54mm Solder ST Top Entry Thru-Hole Automotive Tray
товар відсутній
103168-5 |
Виробник: TE Connectivity AMP Connectors
Description: CONN HEADER VERT 14POS 2.54MM
Packaging: Tray
Connector Type: Header
Current Rating (Amps): 3A
Mounting Type: Through Hole
Number of Positions: 14
Number of Rows: 2
Style: Board to Board or Cable
Operating Temperature: -65°C ~ 105°C
Contact Type: Male Pin
Fastening Type: Detent Lock
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Phosphor Bronze
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Tin-Lead
Part Status: Active
Contact Shape: Square
Contact Length - Post: 0.125" (3.18mm)
Insulation Height: 0.440" (11.18mm)
Shrouding: Shrouded - 4 Wall
Overall Contact Length: 0.533" (13.55mm)
Insulation Material: Thermoplastic
Row Spacing - Mating: 0.100" (2.54mm)
Contact Length - Mating: 0.318" (8.08mm)
Description: CONN HEADER VERT 14POS 2.54MM
Packaging: Tray
Connector Type: Header
Current Rating (Amps): 3A
Mounting Type: Through Hole
Number of Positions: 14
Number of Rows: 2
Style: Board to Board or Cable
Operating Temperature: -65°C ~ 105°C
Contact Type: Male Pin
Fastening Type: Detent Lock
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Phosphor Bronze
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Tin-Lead
Part Status: Active
Contact Shape: Square
Contact Length - Post: 0.125" (3.18mm)
Insulation Height: 0.440" (11.18mm)
Shrouding: Shrouded - 4 Wall
Overall Contact Length: 0.533" (13.55mm)
Insulation Material: Thermoplastic
Row Spacing - Mating: 0.100" (2.54mm)
Contact Length - Mating: 0.318" (8.08mm)
товар відсутній
103168-5 |
Виробник: TE Connectivity
Headers & Wire Housings SHROUDED VER DUAL 14 detent windows
Headers & Wire Housings SHROUDED VER DUAL 14 detent windows
товар відсутній
1423168-5 |
Виробник: TE Connectivity
Time Delay Relay 120VAC 10A DPDT(82.55x78.49x107.95)mm Panel
Time Delay Relay 120VAC 10A DPDT(82.55x78.49x107.95)mm Panel
товар відсутній
2-103168-5 |
Виробник: TE Connectivity
Headers & Wire Housings 54 MODII HDR DRST SHRD .100CL
Headers & Wire Housings 54 MODII HDR DRST SHRD .100CL
товар відсутній
2316851-1 |
Виробник: TE Connectivity AMP Connectors
Description: SENSOR HUM/TEMP I2C OUTPUT
Packaging: Tray
Output Type: I2C
Operating Temperature: -5°C ~ 50°C
Sensor Type: Humidity, Temperature
Part Status: Obsolete
Description: SENSOR HUM/TEMP I2C OUTPUT
Packaging: Tray
Output Type: I2C
Operating Temperature: -5°C ~ 50°C
Sensor Type: Humidity, Temperature
Part Status: Obsolete
товар відсутній
2316851-2 |
Виробник: TE Connectivity AMP Connectors
Description: SENSOR AUDIO/HUM/LGT/MOT I2C OUT
Packaging: Tray
Output Type: I2C
Operating Temperature: -5°C ~ 50°C
Sensor Type: Audio, Humidity, Light, Motion, Temperature
Part Status: Obsolete
Description: SENSOR AUDIO/HUM/LGT/MOT I2C OUT
Packaging: Tray
Output Type: I2C
Operating Temperature: -5°C ~ 50°C
Sensor Type: Audio, Humidity, Light, Motion, Temperature
Part Status: Obsolete
товар відсутній
2316852-1 |
Виробник: TE Connectivity AMP Connectors
Description: SENSOR MULTI FUNCTION I2C OUTPUT
Packaging: Tray
Output Type: I2C
Operating Temperature: -5°C ~ 50°C
Sensor Type: Gas, Humidity, Light, Motion, Temperature
Part Status: Obsolete
Description: SENSOR MULTI FUNCTION I2C OUTPUT
Packaging: Tray
Output Type: I2C
Operating Temperature: -5°C ~ 50°C
Sensor Type: Gas, Humidity, Light, Motion, Temperature
Part Status: Obsolete
товар відсутній
2316852-2 |
Виробник: TE Connectivity AMP Connectors
Description: SENSOR HUM/LGT/MOT/TEMP I2C OUT
Packaging: Tray
Output Type: I2C
Operating Temperature: -5°C ~ 50°C
Sensor Type: Humidity, Light, Motion, Temperature
Part Status: Obsolete
Description: SENSOR HUM/LGT/MOT/TEMP I2C OUT
Packaging: Tray
Output Type: I2C
Operating Temperature: -5°C ~ 50°C
Sensor Type: Humidity, Light, Motion, Temperature
Part Status: Obsolete
товар відсутній
5-103168-5 |
Виробник: TE Connectivity
Conn Shrouded Header (4 Sides) HDR 14 POS 2.54mm Solder ST Top Entry Thru-Hole Tray
Conn Shrouded Header (4 Sides) HDR 14 POS 2.54mm Solder ST Top Entry Thru-Hole Tray
товар відсутній
5-103168-5 |
Виробник: TE Connectivity
Conn Shrouded Header (4 Sides) HDR 14 POS 2.54mm Solder ST Top Entry Thru-Hole Tray
Conn Shrouded Header (4 Sides) HDR 14 POS 2.54mm Solder ST Top Entry Thru-Hole Tray
товар відсутній
523168-5 |
Виробник: TE Connectivity / AMP
Crimpers / Crimping Tools TURRET HEAD TYCO TH493T
Crimpers / Crimping Tools TURRET HEAD TYCO TH493T
товар відсутній
6-103168-5 |
Виробник: TE Connectivity
Conn Shrouded Header (4 Sides) HDR 34 POS 2.54mm Solder ST Top Entry Thru-Hole Tray
Conn Shrouded Header (4 Sides) HDR 34 POS 2.54mm Solder ST Top Entry Thru-Hole Tray
товар відсутній
6-103168-5 |
Виробник: TE Connectivity
Conn Shrouded Header (4 Sides) HDR 34 POS 2.54mm Solder ST Top Entry Thru-Hole Tray
Conn Shrouded Header (4 Sides) HDR 34 POS 2.54mm Solder ST Top Entry Thru-Hole Tray
товар відсутній
750316854 |
Виробник: Würth Elektronik
Description: XFMR FWD P-P DC/DC CONV 200UH SM
Packaging: Tape & Reel (TR)
Size / Dimension: 0.450" L x 0.327" W (11.43mm x 8.30mm)
Mounting Type: Surface Mount
Frequency: 420kHz
Type: For DC/DC Converters
Operating Temperature: -40°C ~ 125°C
Applications: Forward, Push-Pull Converters
Voltage - Isolation: 2500Vrms
Voltage - Primary: 5V
Footprint: 0.581" L x 0.327" W (14.75mm x 8.30mm)
Chipset Manufacturer: Texas Instruments
Height - Seated (Max): 0.165" (4.20mm)
Inductance @ Frequency: 200µH @ 10kHz
Part Status: Active
Description: XFMR FWD P-P DC/DC CONV 200UH SM
Packaging: Tape & Reel (TR)
Size / Dimension: 0.450" L x 0.327" W (11.43mm x 8.30mm)
Mounting Type: Surface Mount
Frequency: 420kHz
Type: For DC/DC Converters
Operating Temperature: -40°C ~ 125°C
Applications: Forward, Push-Pull Converters
Voltage - Isolation: 2500Vrms
Voltage - Primary: 5V
Footprint: 0.581" L x 0.327" W (14.75mm x 8.30mm)
Chipset Manufacturer: Texas Instruments
Height - Seated (Max): 0.165" (4.20mm)
Inductance @ Frequency: 200µH @ 10kHz
Part Status: Active
товар відсутній
750316855 |
Виробник: Würth Elektronik
Description: XFMR FWD P-P DC/DC CONV 200UH SM
Packaging: Tape & Reel (TR)
Size / Dimension: 0.450" L x 0.327" W (11.43mm x 8.30mm)
Mounting Type: Surface Mount
Frequency: 420kHz
Type: For DC/DC Converters
Operating Temperature: -40°C ~ 125°C
Applications: Forward, Push-Pull Converters
Voltage - Isolation: 2500Vrms
Voltage - Primary: 5V
Footprint: 0.581" L x 0.327" W (14.75mm x 8.30mm)
Chipset Manufacturer: Texas Instruments
Height - Seated (Max): 0.165" (4.20mm)
Inductance @ Frequency: 200µH @ 10kHz
Part Status: Active
Description: XFMR FWD P-P DC/DC CONV 200UH SM
Packaging: Tape & Reel (TR)
Size / Dimension: 0.450" L x 0.327" W (11.43mm x 8.30mm)
Mounting Type: Surface Mount
Frequency: 420kHz
Type: For DC/DC Converters
Operating Temperature: -40°C ~ 125°C
Applications: Forward, Push-Pull Converters
Voltage - Isolation: 2500Vrms
Voltage - Primary: 5V
Footprint: 0.581" L x 0.327" W (14.75mm x 8.30mm)
Chipset Manufacturer: Texas Instruments
Height - Seated (Max): 0.165" (4.20mm)
Inductance @ Frequency: 200µH @ 10kHz
Part Status: Active
товар відсутній
750316855 |
Виробник: Würth Elektronik
Description: XFMR FWD P-P DC/DC CONV 200UH SM
Packaging: Cut Tape (CT)
Size / Dimension: 0.450" L x 0.327" W (11.43mm x 8.30mm)
Mounting Type: Surface Mount
Frequency: 420kHz
Type: For DC/DC Converters
Operating Temperature: -40°C ~ 125°C
Applications: Forward, Push-Pull Converters
Voltage - Isolation: 2500Vrms
Voltage - Primary: 5V
Footprint: 0.581" L x 0.327" W (14.75mm x 8.30mm)
Chipset Manufacturer: Texas Instruments
Height - Seated (Max): 0.165" (4.20mm)
Inductance @ Frequency: 200µH @ 10kHz
Part Status: Active
Description: XFMR FWD P-P DC/DC CONV 200UH SM
Packaging: Cut Tape (CT)
Size / Dimension: 0.450" L x 0.327" W (11.43mm x 8.30mm)
Mounting Type: Surface Mount
Frequency: 420kHz
Type: For DC/DC Converters
Operating Temperature: -40°C ~ 125°C
Applications: Forward, Push-Pull Converters
Voltage - Isolation: 2500Vrms
Voltage - Primary: 5V
Footprint: 0.581" L x 0.327" W (14.75mm x 8.30mm)
Chipset Manufacturer: Texas Instruments
Height - Seated (Max): 0.165" (4.20mm)
Inductance @ Frequency: 200µH @ 10kHz
Part Status: Active
товар відсутній
77316-852LF |
Виробник: Amphenol ICC (FCI)
Description: CONN HEADER R/A 9POS 2.54MM
Packaging: Bag
Connector Type: Header, Breakaway
Current Rating (Amps): 3A per Contact
Mounting Type: Through Hole, Right Angle
Number of Positions: 9
Number of Rows: 1
Style: Board to Board
Operating Temperature: -65°C ~ 125°C
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: 3
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Phosphor Bronze
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold or Gold, GXT™
Contact Finish Thickness - Mating: 15.0µin (0.38µm)
Part Status: Active
Contact Shape: Square
Contact Length - Post: 0.136" (3.46mm)
Insulation Height: 0.094" (2.40mm)
Shrouding: Unshrouded
Insulation Material: Thermoplastic
Contact Length - Mating: 0.394" (10.00mm)
Description: CONN HEADER R/A 9POS 2.54MM
Packaging: Bag
Connector Type: Header, Breakaway
Current Rating (Amps): 3A per Contact
Mounting Type: Through Hole, Right Angle
Number of Positions: 9
Number of Rows: 1
Style: Board to Board
Operating Temperature: -65°C ~ 125°C
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: 3
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Phosphor Bronze
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold or Gold, GXT™
Contact Finish Thickness - Mating: 15.0µin (0.38µm)
Part Status: Active
Contact Shape: Square
Contact Length - Post: 0.136" (3.46mm)
Insulation Height: 0.094" (2.40mm)
Shrouding: Unshrouded
Insulation Material: Thermoplastic
Contact Length - Mating: 0.394" (10.00mm)
товар відсутній
CPI-2316-85T |
Виробник: CUI DEVICES
Audio Buzzer Piezo 3VDC 20VDC 10mA 12VDC 85dB 2500Hz to 3500Hz Through Hole Pin Carton
Audio Buzzer Piezo 3VDC 20VDC 10mA 12VDC 85dB 2500Hz to 3500Hz Through Hole Pin Carton
товар відсутній
FPC31685A |
Виробник: Essentra
Conduit Fittings & Accessories PIPE CAP CLOSED-END:PE FLEXIBLE YELLOW
Conduit Fittings & Accessories PIPE CAP CLOSED-END:PE FLEXIBLE YELLOW
товар відсутній
61500161155 |
товар відсутній
D-141-0111CS555 |
Виробник: TE Connectivity Raychem Cable Protection
Description: SLDR SLV WIRE-WIRE 0.035/0.075"
Packaging: Bulk
Color: Transparent - Blue
Diameter: 0.035" (0.89mm), 0.075" (1.91mm)
Length: 0.240" (6.10mm)
Type: Wire to Wire
Description: SLDR SLV WIRE-WIRE 0.035/0.075"
Packaging: Bulk
Color: Transparent - Blue
Diameter: 0.035" (0.89mm), 0.075" (1.91mm)
Length: 0.240" (6.10mm)
Type: Wire to Wire
товар відсутній
FS32K118LIT0VLFR |
Виробник: NXP Semiconductors
MCU 32-bit ARM Cortex M0+ RISC 256KB Flash 3.3V/5V Automotive 48-Pin LQFP T/R
MCU 32-bit ARM Cortex M0+ RISC 256KB Flash 3.3V/5V Automotive 48-Pin LQFP T/R
товар відсутній
FS32K118LIT0VLFR |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 25K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 43
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 25K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 43
DigiKey Programmable: Not Verified
товар відсутній
FS32K118LIT0VLFR |
Виробник: NXP Semiconductors
ARM Microcontrollers - MCU S32K118 Arm Cortex-M0+, 48 MHz, 256 Kb Flash, ISELED, FlexIO, LQFP48 - S32K MCUs for General-Purpose
ARM Microcontrollers - MCU S32K118 Arm Cortex-M0+, 48 MHz, 256 Kb Flash, ISELED, FlexIO, LQFP48 - S32K MCUs for General-Purpose
товар відсутній
FS32K118LIT0VLFT |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 25K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 43
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 25K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 43
DigiKey Programmable: Not Verified
товар відсутній
FS32K118LIT0VLFT |
Виробник: NXP Semiconductors
MCU 32-bit ARM Cortex M0+ RISC 256KB Flash 3.3V/5V Automotive 48-Pin LQFP Tray
MCU 32-bit ARM Cortex M0+ RISC 256KB Flash 3.3V/5V Automotive 48-Pin LQFP Tray
товар відсутній
HHM1711Q1 |
Виробник: TDK Corporation
Description: BALUN 2.3GHZ-3.8GHZ 50/100 0603
Packaging: Tape & Reel (TR)
Package / Case: 0603 (1608 Metric), 6 PC Pad
Mounting Type: Surface Mount
Frequency Range: 2.3Ghz ~ 3.8GHz
Impedance - Unbalanced/Balanced: 50 / 100Ohm
Insertion Loss (Max): 1.0dB
Return Loss (Min): 10dB
Phase Difference: 180° ±15°
Part Status: Active
Description: BALUN 2.3GHZ-3.8GHZ 50/100 0603
Packaging: Tape & Reel (TR)
Package / Case: 0603 (1608 Metric), 6 PC Pad
Mounting Type: Surface Mount
Frequency Range: 2.3Ghz ~ 3.8GHz
Impedance - Unbalanced/Balanced: 50 / 100Ohm
Insertion Loss (Max): 1.0dB
Return Loss (Min): 10dB
Phase Difference: 180° ±15°
Part Status: Active
товар відсутній
LFTCXO063712BULK |
Виробник: IQD Frequency Products
Description: XTAL OSC TCXO 20.0000MHZ HCMOS
Packaging: Strip
Package / Case: 8-SMD, No Lead
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: HCMOS
Type: TCXO
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±280ppb
Voltage - Supply: 3.3V
Current - Supply (Max): 10mA
Height - Seated (Max): 0.094" (2.40mm)
Part Status: Active
Frequency: 20 MHz
Base Resonator: Crystal
Description: XTAL OSC TCXO 20.0000MHZ HCMOS
Packaging: Strip
Package / Case: 8-SMD, No Lead
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: HCMOS
Type: TCXO
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±280ppb
Voltage - Supply: 3.3V
Current - Supply (Max): 10mA
Height - Seated (Max): 0.094" (2.40mm)
Part Status: Active
Frequency: 20 MHz
Base Resonator: Crystal
товар відсутній
MC9S08SH8CTJR |
Виробник: NXP Semiconductors
MCU 8-bit S08 CISC 8KB Flash 3.3V/5V 20-Pin TSSOP T/R
MCU 8-bit S08 CISC 8KB Flash 3.3V/5V 20-Pin TSSOP T/R
товар відсутній
OD2510-12LLB |
Виробник: Orion Fans
Description: FAN AXIAL 25X10MM 12VDC WIRE
Packaging: Bulk
Features: Auto Restart
Voltage - Rated: 12VDC
Size / Dimension: Square - 25mm L x 25mm H
Bearing Type: Ball
RPM: 7000 RPM
Air Flow: 1.5 CFM (0.042m³/min)
Width: 10.00mm
Weight: 0.022 lb (9.98 g)
Operating Temperature: 14 ~ 158°F (-10 ~ 70°C)
Termination: 2 Wire Leads
Approval Agency: cURus, TUV
Fan Type: Tubeaxial
Noise: 15.0dB(A)
Static Pressure: 0.070 in H2O (17.4 Pa)
Part Status: Active
Power (Watts): 840 mW
Description: FAN AXIAL 25X10MM 12VDC WIRE
Packaging: Bulk
Features: Auto Restart
Voltage - Rated: 12VDC
Size / Dimension: Square - 25mm L x 25mm H
Bearing Type: Ball
RPM: 7000 RPM
Air Flow: 1.5 CFM (0.042m³/min)
Width: 10.00mm
Weight: 0.022 lb (9.98 g)
Operating Temperature: 14 ~ 158°F (-10 ~ 70°C)
Termination: 2 Wire Leads
Approval Agency: cURus, TUV
Fan Type: Tubeaxial
Noise: 15.0dB(A)
Static Pressure: 0.070 in H2O (17.4 Pa)
Part Status: Active
Power (Watts): 840 mW
товар відсутній
S912XDP512J1VAL |
Виробник: NXP Semiconductors
MCU 16-bit HCS12X CISC 512KB Flash 2.5V/5V Automotive 112-Pin LQFP Tray
MCU 16-bit HCS12X CISC 512KB Flash 2.5V/5V Automotive 112-Pin LQFP Tray
товар відсутній
S912XDP512J1VAL |
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 512KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x10b, 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Part Status: Not For New Designs
Number of I/O: 91
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 512KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x10b, 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Part Status: Not For New Designs
Number of I/O: 91
DigiKey Programmable: Not Verified
товар відсутній
S912XDP512J1VAL |
Виробник: NXP Semiconductors
16-bit Microcontrollers - MCU 912XDP512J1 GENERAL
16-bit Microcontrollers - MCU 912XDP512J1 GENERAL
товар відсутній
S912XDP512J1VALR |
Виробник: NXP Semiconductors
MCU 16-bit HCS12X CISC 512KB Flash 2.5V/5V Automotive 112-Pin LQFP T/R
MCU 16-bit HCS12X CISC 512KB Flash 2.5V/5V Automotive 112-Pin LQFP T/R
товар відсутній
S912XDP512J1VALR |
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 512KB FLASH 112LQFP
Packaging: Tape & Reel (TR)
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x10b, 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 512KB FLASH 112LQFP
Packaging: Tape & Reel (TR)
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x10b, 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
товар відсутній
S912XDP512J1VALR |
Виробник: NXP Semiconductors
16-bit Microcontrollers - MCU 912XDP512J1 GENERAL
16-bit Microcontrollers - MCU 912XDP512J1 GENERAL
товар відсутній
S912XDT512J1CAG |
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 512KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 20K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 24x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Not For New Designs
Number of I/O: 119
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 512KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 20K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 24x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Not For New Designs
Number of I/O: 119
DigiKey Programmable: Not Verified
товар відсутній
S912XDT512J1CAG |
Виробник: NXP Semiconductors
MCU 16-bit HCS12X CISC 512KB Flash 2.5V/5V Automotive 144-Pin LQFP Tray
MCU 16-bit HCS12X CISC 512KB Flash 2.5V/5V Automotive 144-Pin LQFP Tray
товар відсутній
S912XDT512J1CAG |
Виробник: NXP Semiconductors
16-bit Microcontrollers - MCU 16-bit MCU, S12X core, 512KB Flash, 80MHz, -40/+85degC, Automotive Qualified, QFP 144
16-bit Microcontrollers - MCU 16-bit MCU, S12X core, 512KB Flash, 80MHz, -40/+85degC, Automotive Qualified, QFP 144
товар відсутній
S912XDT512J1CAGR |
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 512KB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 20K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 24x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 119
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 512KB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 20K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 24x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 119
DigiKey Programmable: Not Verified
товар відсутній
S912XDT512J1CAGR |
Виробник: NXP Semiconductors
16-bit Microcontrollers - MCU 16-bit MCU, S12X core, 512KB Flash, 80MHz, -40/+85degC, Automotive Qualified, QFP 144
16-bit Microcontrollers - MCU 16-bit MCU, S12X core, 512KB Flash, 80MHz, -40/+85degC, Automotive Qualified, QFP 144
товар відсутній
U5354-000002-001BG |
Виробник: TE Connectivity Measurement Specialties
Description: SENSOR
Features: Temperature Compensated
Packaging: Box
Package / Case: Cylinder
Output Type: Analog Current
Output: 4 mA ~ 20 mA
Operating Pressure: 14.5PSI (100kPa)
Pressure Type: Vented Gauge
Accuracy: ±0.1%
Operating Temperature: -40°C ~ 125°C
Termination Style: Connector
Voltage - Supply: 9V ~ 30V
Port Size: Male - 1/4" (6.35mm) BSPP
Applications: Industrial Automation
Port Style: Threaded
Maximum Pressure: 43.51PSI (300kPa)
Part Status: Active
Description: SENSOR
Features: Temperature Compensated
Packaging: Box
Package / Case: Cylinder
Output Type: Analog Current
Output: 4 mA ~ 20 mA
Operating Pressure: 14.5PSI (100kPa)
Pressure Type: Vented Gauge
Accuracy: ±0.1%
Operating Temperature: -40°C ~ 125°C
Termination Style: Connector
Voltage - Supply: 9V ~ 30V
Port Size: Male - 1/4" (6.35mm) BSPP
Applications: Industrial Automation
Port Style: Threaded
Maximum Pressure: 43.51PSI (300kPa)
Part Status: Active
товар відсутній