Виробник: TE Connectivity
Crimpers / Crimping Tools CRIMPER INSULATION F .156

Виробник: TE Connectivity
Crimpers / Crimping Tools CRIMPER INSULATION F .210

Виробник: TE Connectivity
Crimpers / Crimping Tools CRIMPER INS F (.071 )

Виробник: TE Connectivity
Crimpers / Crimping Tools CRIMPER INSULATION F .137

Виробник: TE Connectivity
716334711-TEC Tools - Unclassified

Виробник: TE Application Tooling
Description: CRIMPER, INSULATION F (.165")
Packaging: Bulk

Виробник: TE Connectivity
Crimpers / Crimping Tools CRIMPER INSULATION F .165

Виробник: TE Connectivity / AMP
Crimpers / Crimping Tools SPRING TORSION AUTOMACHINE SYSTEM

Виробник: TE Connectivity
Crimpers / Crimping Tools CRIMPER INSULATION F .185

Виробник: TE Connectivity
Category: Signal connectors - Unclassified
Description: 873471-1
кількість в упаковці: 1 шт

Виробник: TE Connectivity
Crimpers / Crimping Tools CRIMPER INSULATION F .048

Виробник: CUI Devices
DC Fans 12Vdc 1.96W 37CFM DC Axial 80x15mm RD

Виробник: CUI DEVICES
DC Fan Axial omniCOOL Bearing 12V 4.5V to 13.8V 37CFM 34.7dB 80 X 80 X 15mm

Виробник: CUI DEVICES
DC Fan Axial omniCOOL Bearing 24V 8V to 27.6V 37CFM 34.7dB 80 X 80 X 15mm

Виробник: CUI Devices
DC Fans 24Vdc 2.21W 37CFM DC Axial 80x15mm RD

Виробник: Skyworks Solutions, Inc.
RF Development Tools BOARD

Виробник: Samtec
Conn Board Stacker HDR 40 POS 2mm Solder ST Top Entry Thru-Hole Bulk

Виробник: Samtec
Board to Board & Mezzanine Connectors Flexible Surface Mount Board Stacking Header, 2.00 mm Pitch

Виробник: Samtec
Conn Board Stacker HDR 70 POS 2mm Solder ST Top Entry Thru-Hole Bulk

Виробник: Samtec
Board to Board & Mezzanine Connectors Flexible Surface Mount Board Stacking Header, 2.00 mm Pitch

Виробник: Vicor
Modular Power Supplies 4kW Megapac Std

Виробник: MOLEX
2153471124-MOL Unclassified

Виробник: Amphenol TCS
Board to Board & Mezzanine Connectors 100P NeXLev Plug 190 Solder Balls

Виробник: Amphenol TCS
Board to Board & Mezzanine Connectors 100P NeXLev Plug Solder Balls

Виробник: Amphenol TCS
Board to Board & Mezzanine Connectors 100P NeXLev Plug 190 Solder Balls

Виробник: Amphenol TCS
Board to Board & Mezzanine Connectors 100P NeXLev Plug Solder Balls

Виробник: Amphenol TCS
Board to Board & Mezzanine Connectors 100P NeXLev Plug 190 Solder Balls

Виробник: Amphenol TCS
Board to Board & Mezzanine Connectors 100P NeXLev Plug Solder Balls

Виробник: Würth Elektronik
Description: FIXED IND 1.5UH 630MA 750MOHM SM
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: 1008 (2520 Metric)
Size / Dimension: 0.102" L x 0.083" W (2.60mm x 2.10mm)
Mounting Type: Surface Mount
Shielding: Unshielded
Type: Drum Core, Wirewound
Operating Temperature: -40°C ~ 85°C
DC Resistance (DCR): 750mOhm Max
Q @ Freq: 20 @ 7.96MHz
Frequency - Self Resonant: 250MHz
Material - Core: Ferrite
Inductance Frequency - Test: 7.96 MHz
Supplier Device Package: 1008 (2520 Metric)
Height - Seated (Max): 0.075" (1.90mm)
Part Status: Active
Inductance: 1.5 µH
Current Rating (Amps): 630 mA

Виробник: Nexperia USA Inc.
Description: DIODE ZENER 3.9V 400MW ALF2
Tolerance: ±2%
Packaging: Tape & Reel (TR)
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 200°C
Voltage - Zener (Nom) (Vz): 3.9 V
Impedance (Max) (Zzt): 90 Ohms
Supplier Device Package: ALF2
Part Status: Active
Power - Max: 400 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 3 µA @ 1 V

Виробник: Nexperia USA Inc.
Description: DIODE ZENER 3.9V 400MW ALF2
Tolerance: ±2%
Packaging: Tape & Box (TB)
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 200°C
Voltage - Zener (Nom) (Vz): 3.9 V
Impedance (Max) (Zzt): 90 Ohms
Supplier Device Package: ALF2
Part Status: Active
Power - Max: 400 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 3 µA @ 1 V

Виробник: Nexperia USA Inc.
Description: DIODE ZENER 3.9V 400MW ALF2
Packaging: Tape & Box (TB)
Tolerance: ±2%
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 200°C
Voltage - Zener (Nom) (Vz): 3.9 V
Impedance (Max) (Zzt): 90 Ohms
Supplier Device Package: ALF2
Power - Max: 400 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 3 µA @ 1 V

Виробник: Murata Electronics
Description: CAP CER 18PF 25V C0G/NP0 01005
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Voltage - Rated: 25V
Package / Case: 01005 (0402 Metric)
Temperature Coefficient: C0G, NP0
Size / Dimension: 0.016" L x 0.008" W (0.40mm x 0.20mm)
Mounting Type: Surface Mount, MLCC
Operating Temperature: -55°C ~ 125°C
Applications: General Purpose
Thickness (Max): 0.009" (0.22mm)
Capacitance: 18 pF

Виробник: Analog Devices Inc.
Description: IC RF AMP GPS 3GHZ-4.5GHZ 8MSOP
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Exposed Pad
Mounting Type: Surface Mount
Frequency: 3GHz ~ 4.5GHz
RF Type: General Purpose
Voltage - Supply: 5V
Gain: 21dB
Current - Supply: 130mA
Noise Figure: 5dB
P1dB: 23.5dBm
Supplier Device Package: 8-MSOPG
Part Status: Active

Виробник: Analog Devices Inc.
Description: IC RF AMP GPS 3GHZ-4.5GHZ 8MSOP
Packaging: Tape & Reel (TR)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Exposed Pad
Mounting Type: Surface Mount
Frequency: 3GHz ~ 4.5GHz
RF Type: General Purpose
Voltage - Supply: 5V
Gain: 21dB
Current - Supply: 130mA
Noise Figure: 5dB
P1dB: 23.5dBm
Supplier Device Package: 8-MSOPG
Part Status: Active

Виробник: NXP USA Inc.
Description: IC TRANSLTR BIDIRECTIONAL 6XSON
Packaging: Tape & Reel (TR)
Features: Auto-Direction Sensing
Package / Case: 6-XFDFN
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 100Mbps
Supplier Device Package: 6-XSON, SOT1202 (1x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 1
Voltage - VCCA: 1.2 V ~ 3.6 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Part Status: Obsolete
Number of Circuits: 1

Виробник: Texas Instruments
Description: IC GATE NOR 2CH 2-INP 8VSSOP
Packaging: Tape & Reel (TR)
Package / Case: 8-VFSOP (0.091", 2.30mm Width)
Mounting Type: Surface Mount
Logic Type: NOR Gate
Operating Temperature: -55°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 5.5V
Current - Output High, Low: 32mA, 32mA
Number of Inputs: 2
Supplier Device Package: 8-VSSOP
Input Logic Level - High: 1.7V ~ 2V
Input Logic Level - Low: 0.7V ~ 0.8V
Max Propagation Delay @ V, Max CL: 5.4ns @ 5V, 50pF
Number of Circuits: 2
Current - Quiescent (Max): 10 µA

Виробник: Texas Instruments
Description: IC GATE NOR 2CH 2-INP 8VSSOP
Packaging: Cut Tape (CT)
Package / Case: 8-VFSOP (0.091", 2.30mm Width)
Mounting Type: Surface Mount
Logic Type: NOR Gate
Operating Temperature: -55°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 5.5V
Current - Output High, Low: 32mA, 32mA
Number of Inputs: 2
Supplier Device Package: 8-VSSOP
Input Logic Level - High: 1.7V ~ 2V
Input Logic Level - Low: 0.7V ~ 0.8V
Max Propagation Delay @ V, Max CL: 5.4ns @ 5V, 50pF
Number of Circuits: 2
Current - Quiescent (Max): 10 µA

Виробник: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 129
DigiKey Programmable: Not Verified

Виробник: Nexperia USA Inc.
Description: SZMM3Z10VT1G/SOD323/SOD2
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: SC-76, SOD-323
Mounting Type: Surface Mount
Operating Temperature: 150°C (TJ)
Voltage - Zener (Nom) (Vz): 10 V
Impedance (Max) (Zzt): 10 Ohms
Supplier Device Package: SOD-323
Grade: Automotive
Part Status: Active
Power - Max: 300 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Current - Reverse Leakage @ Vr: 100 nA @ 7 V
Qualification: AEC-Q101

Виробник: KEMET
Description: CAP TANT POLY 680UF 2.5V 2917
Packaging: Tape & Reel (TR)
Tolerance: ±20%
Features: General Purpose
Package / Case: 2917 (7343 Metric)
Size / Dimension: 0.287" L x 0.169" W (7.30mm x 4.30mm)
Mounting Type: Surface Mount
Type: Molded
Operating Temperature: -55°C ~ 125°C
ESR (Equivalent Series Resistance): 6mOhm @ 100kHz
Lifetime @ Temp.: 2000 Hrs @ 105°C
Manufacturer Size Code: Y
Height - Seated (Max): 0.157" (4.00mm)
Capacitance: 680 µF
Voltage - Rated: 2.5 V

Виробник: Nichicon
Description: CAP ALUM 3.3UF 20% 50V RADIAL
Tolerance: ±20%
Packaging: Tape & Box (TB)
Package / Case: Radial, Can
Size / Dimension: 0.197" Dia (5.00mm)
Polarization: Polar
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 105°C
Applications: General Purpose
Lead Spacing: 0.098" (2.50mm)
Lifetime @ Temp.: 1000 Hrs @ 105°C
Height - Seated (Max): 0.492" (12.50mm)
Part Status: Last Time Buy
Capacitance: 3.3 µF
Voltage - Rated: 50 V
Ripple Current @ Low Frequency: 25 mA @ 120 Hz
Ripple Current @ High Frequency: 50 mA @ 10 kHz