Результат пошуку "36504" : > 120
Вид перегляду :
Мінімальне замовлення: 3
Мінімальне замовлення: 3
Мінімальне замовлення: 3
Мінімальне замовлення: 4
Мінімальне замовлення: 3
Мінімальне замовлення: 3
Мінімальне замовлення: 2
Мінімальне замовлення: 6
Мінімальне замовлення: 784
Фото | Назва | Виробник | Інформація |
Доступність |
Ціна без ПДВ |
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504TR | Keystone Electronics |
Description: BATT HOLDER COIN 16MM 1 CELL SMD Packaging: Cut Tape (CT) Battery Cell Size: Coin, 16.0mm Number of Cells: 1 Mounting Type: PCB, Surface Mount Style: Holder (Open) Termination Style: SMD (SMT) Tab Height Above Board: 0.212" (5.38mm) Battery Series: 1632 Battery Type, Function: Coin Cell, Holder |
на замовлення 16044 шт: термін постачання 21-31 дні (днів) |
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ADS42JB69IRGCT | Texas Instruments |
Description: IC ADC 16BIT PIPELINED 64VQFN Packaging: Cut Tape (CT) Features: Simultaneous Sampling Package / Case: 64-VFQFN Exposed Pad Mounting Type: Surface Mount Number of Bits: 16 Configuration: S/H-ADC Data Interface: JESD204B Reference Type: Internal Operating Temperature: -40°C ~ 85°C Voltage - Supply, Analog: 1.7V ~ 1.9V Voltage - Supply, Digital: 1.7V ~ 1.9V Sampling Rate (Per Second): 250M Input Type: Differential Number of Inputs: 2 Supplier Device Package: 64-VQFN (9x9) Architecture: Pipelined Ratio - S/H:ADC: 1:1 Part Status: Active Number of A/D Converters: 2 |
на замовлення 197 шт: термін постачання 21-31 дні (днів) |
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ATS-P1-158-C2-R0 | Advanced Thermal Solutions Inc. |
Description: HEATSINK 40X40X35MM L-TAB T766 Packaging: Tray Material: Aluminum Length: 1.575" (40.00mm) Shape: Square, Fins Type: Top Mount Width: 1.575" (40.00mm) Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Attachment Method: Push Pin Thermal Resistance @ Forced Air Flow: 2.80°C/W @ 100 LFM Fin Height: 1.378" (35.00mm) Material Finish: Blue Anodized |
на замовлення 27 шт: термін постачання 21-31 дні (днів) |
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B6421E1-ND3G-5-50 | AMPHENOL RF |
Description: AMPHENOL RF - B6421E1-ND3G-5-50 - HF-/Koaxialsteckverbinder, BNC-Koaxial, Gerade Einbaubuchse mit Verschraubung, Crimp, 50 ohm tariffCode: 85366990 productTraceability: No rohsCompliant: Y-EX euEccn: NLR Frequenz, max.: 4GHz hazardous: false rohsPhthalatesCompliant: YES Impedanz: 50ohm usEccn: EAR99 Produktpalette: - |
на замовлення 1106 шт: термін постачання 21-31 дні (днів) |
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B6421E1-ND3G-6-75 | AMPHENOL RF |
Description: AMPHENOL RF - B6421E1-ND3G-6-75 - HF-/Koaxialsteckverbinder, BNC-Koaxial, Gerade Einbaubuchse mit Verschraubung, Crimp, 75 ohm tariffCode: 85366990 rohsCompliant: Y-EX Kontaktüberzug: Vergoldete Kontakte hazardous: false rohsPhthalatesCompliant: YES Kontaktmaterial: Phosphorbronze Steckverbinderausführung: Gerade Einbaubuchse mit Verschraubung Steckverbindermontage: Kabelmontage usEccn: EAR99 euEccn: NLR Koaxialanschluss: Crimp Impedanz: 75ohm Steckverbindertyp: BNC-Koaxial Produktpalette: - Koaxialkabeltypen: RG179, RG179A, RG179B, RG187, RG187A productTraceability: No Frequenz, max.: 1GHz SVHC: No SVHC (17-Dec-2014) |
на замовлення 1819 шт: термін постачання 21-31 дні (днів) |
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FP301-1 1/2-6"-Black | 3M Electronic Specialty | Heat Shrink Tubing & Sleeves 2:1 Thin Wall 1 1/2, 6" Black, Pk |
на замовлення 2 шт: термін постачання 21-30 дні (днів) |
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G2RL-1 DC12 | OMRON ELECTRONIC COMPONENTS |
Description: OMRON ELECTRONIC COMPONENTS - G2RL-1 DC12 - Universelles Leistungsrelais, Baureihe G2RL, monostabil, SPDT, 12V DC, 12A tariffCode: 85364190 rohsCompliant: YES Zulassungen & Normen: CE, UL, VDE Relaisanschlüsse: Lötanschlüsse hazardous: false rohsPhthalatesCompliant: YES Spulentyp: Monostabil Kontaktmaterial: Silberzinnoxid Kontaktstrom: 12A usEccn: EAR99 Spulenwiderstand: 360ohm euEccn: NLR Kontaktspannung V DC: 24VDC Relaismontage: Durchsteckmontage Produktpalette: G2RL productTraceability: No Spulenspannung: 12VDC Kontaktkonfiguration: SPDT Kontaktspannung V AC: 250VAC SVHC: No SVHC (17-Dec-2014) |
на замовлення 8190 шт: термін постачання 21-31 дні (днів) |
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G6K-2G-Y DC12 | OMRON ELECTRONIC COMPONENTS |
Description: OMRON ELECTRONIC COMPONENTS - G6K-2G-Y DC12 - Signalrelais, 12 VDC, DPDT, 1 A, G6K, Oberflächenmontage, Monostabil tariffCode: 85364190 rohsCompliant: YES Relaisanschlüsse: Lötanschlüsse hazardous: false rohsPhthalatesCompliant: YES Spulentyp: Monostabil Kontaktmaterial: Silber-Gold Kontaktstrom: 1A usEccn: EAR99 Spulenwiderstand: 1.315kohm euEccn: NLR Kontaktspannung V DC: 30V Relaismontage: Oberflächenmontage Produktpalette: G6K productTraceability: No Spulenspannung: 12VDC Kontaktkonfiguration: DPDT Kontaktspannung V AC: - SVHC: No SVHC (17-Dec-2014) |
на замовлення 945 шт: термін постачання 21-31 дні (днів) |
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G6K-2G-Y DC24 | OMRON ELECTRONIC COMPONENTS |
Description: OMRON ELECTRONIC COMPONENTS - G6K-2G-Y DC24 - Signalrelais, 24 VDC, DPDT, 1 A, G6K, Oberflächenmontage, Monostabil tariffCode: 85364110 rohsCompliant: YES Relaisanschlüsse: Lötanschlüsse hazardous: false rohsPhthalatesCompliant: YES Spulentyp: Monostabil Kontaktmaterial: Silber-Gold Kontaktstrom: 1A usEccn: EAR99 Spulenwiderstand: 5.22kohm euEccn: NLR Kontaktspannung V DC: 30V Relaismontage: Oberflächenmontage Produktpalette: G6K productTraceability: No Spulenspannung: 24VDC Kontaktkonfiguration: DPDT Kontaktspannung V AC: - SVHC: No SVHC (17-Dec-2014) |
на замовлення 458 шт: термін постачання 21-31 дні (днів) |
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LPC844M201JHI48E | NXP USA Inc. |
Description: IC MCU 32BIT 64KB FLASH 48HVQFN Packaging: Tray Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount Speed: 30MHz Program Memory Size: 64KB (64K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 12x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Supplier Device Package: 48-HVQFN (7x7) Part Status: Active Number of I/O: 42 DigiKey Programmable: Not Verified |
на замовлення 144 шт: термін постачання 21-31 дні (днів) |
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MP200-M | Panduit Corp |
Description: WIRE MARKR CBL TIE 19.1MMX50.8MM Packaging: Bulk Color: White Material: Polyamide (PA66), Nylon 6/6 Type: Wire Marker, Cable Tie Size: 0.75" W x 2.00" L (19.1mm x 50.8mm) Legend: Blank |
на замовлення 2000 шт: термін постачання 21-31 дні (днів) |
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N74F04N,602 | NXP USA Inc. |
Description: IC INVERTER 6CH 1-INP 14DIP Packaging: Bulk Package / Case: 14-DIP (0.300", 7.62mm) Mounting Type: Through Hole Logic Type: Inverter Operating Temperature: 0°C ~ 70°C Voltage - Supply: 4.5V ~ 5.5V Current - Output High, Low: 1mA, 20mA Number of Inputs: 1 Supplier Device Package: 14-DIP Input Logic Level - High: 2V Input Logic Level - Low: 0.8V Max Propagation Delay @ V, Max CL: 5ns @ 5V, 50pF Part Status: Obsolete Number of Circuits: 6 |
на замовлення 25821 шт: термін постачання 21-31 дні (днів) |
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365-04 | Desco Tools | Other Tools TITANIUM HS DRILL 1/16 |
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3650-4"x60yd | 3M Electronic Specialty | Adhesive Tapes 3650 WHITE 4X60YD BULK |
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36504 | Molex | Cable Glands, Strain Reliefs & Cord Grips |
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36504-0051 | Molex | DIN 41612 Connectors C Male Housing 96 pin Class |
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365046-1 | TE Connectivity | Conn SKT 9 POS 6.1mm Solder ST Thru-Hole Bag |
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365046-1 | TE Connectivity | Conn SKT 9 POS 6.1mm Solder ST Thru-Hole Bag |
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365046-1 | TE Connectivity | Conn SKT 9 POS 6.1mm Solder ST Thru-Hole Bag |
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365047-000 | TE Connectivity | Heat Shrink Transition Flexible Modified Polyolefin |
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365047N002 | TE Connectivity / Raychem | Heat Shrink Cable Boots & End Caps 562A0434/860CS8665 |
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004236504 | Altech | Specialty Fuses Fuse,HV,VVTD,442mm,4A |
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0365040049 | Molex | Conn DIN 41612 M 96 POS 2.54mm Press Fit RA Thru-Hole Carton |
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0365040051 | Molex | Conn DIN 41612 M 64 POS 2.54mm Solder RA Thru-Hole Carton |
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0387036504 | Molex |
Description: JUMPER BARRIER BLK 4POS SPADE Packaging: Bulk Contact Finish: Nickel For Use With/Related Products: Beau 38700 Series Pitch: 0.325" (8.26mm) Style: Over Barrier, Flanged Spade Type: Barrier Block Contact Material: Brass Number of Positions: 4 |
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110-83-650-41-001101 | Preci-Dip |
Description: CONN IC DIP SOCKET 50POS GOLD Packaging: Bulk Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 50 (2 x 25) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
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110-83-650-41-005101 | Preci-Dip |
Description: CONN IC DIP SOCKET 50POS GOLD Packaging: Bulk Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 50 (2 x 25) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
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1136504 | LAPP |
Category: Multicore Cables - Shielded Description: Wire; ÖLFLEX® CLASSIC 115 CY; 4G4mm2; PVC; grey; 300V,500V Type of wire: control cable Kind of wire: ÖLFLEX® CLASSIC 115 CY Cable structure: 4G4mm2 Core structure: stranded Kind of core: Cu Number of cores: 4 Core section: 4mm2 Core marking: black, numbered + ground wire Shield structure: shielded; tinned copper braid Wire insulation material: PVC Insulation colour: grey Rated voltage: 300V; 500V Kind of material: no flame propagation Operating temperature: -40...80°C Resistance to: most of chemical compounds Flexibility class: 5 Cable external diameter: 11.6mm CPR standard: Eca Earth core: yellow-green |
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1136504 | LAPP |
Category: Multicore Cables - Shielded Description: Wire; ÖLFLEX® CLASSIC 115 CY; 4G4mm2; PVC; grey; 300V,500V Type of wire: control cable Kind of wire: ÖLFLEX® CLASSIC 115 CY Cable structure: 4G4mm2 Core structure: stranded Kind of core: Cu Number of cores: 4 Core section: 4mm2 Core marking: black, numbered + ground wire Shield structure: shielded; tinned copper braid Wire insulation material: PVC Insulation colour: grey Rated voltage: 300V; 500V Kind of material: no flame propagation Operating temperature: -40...80°C Resistance to: most of chemical compounds Flexibility class: 5 Cable external diameter: 11.6mm CPR standard: Eca Earth core: yellow-green кількість в упаковці: 5 шт |
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115-83-650-41-001101 | Preci-Dip |
Description: CONN IC DIP SOCKET 50POS GOLD Features: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 50 (2 x 25) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass Part Status: Active |
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115-83-650-41-003101 | Preci-Dip |
Description: CONN IC DIP SOCKET 50POS GOLD Packaging: Bulk Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 50 (2 x 25) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass Part Status: Active |
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116-83-650-41-003101 | Preci-Dip |
Description: CONN IC DIP SOCKET 50POS GOLD Features: Elevated, Open Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 50 (2 x 25) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
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116-83-650-41-006101 | Preci-Dip |
Description: CONN IC DIP SOCKET 50POS GOLD Packaging: Bulk Features: Elevated, Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 50 (2 x 25) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
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116-83-650-41-012101 | Preci-Dip |
Description: CONN IC DIP SOCKET 50POS GOLD Packaging: Bulk Features: Elevated, Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 50 (2 x 25) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
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116-83-650-41-018101 | Preci-Dip |
Description: CONN IC DIP SOCKET 50POS GOLD Packaging: Bulk Features: Elevated, Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 50 (2 x 25) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
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121-83-650-41-001101 | Preci-Dip |
Description: CONN IC DIP SOCKET 50POS GOLD Packaging: Bulk Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 50 (2 x 25) Termination: Wire Wrap Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
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146-83-650-41-035101 | Preci-Dip |
Description: CONN IC DIP SOCKET 50POS GOLD Packaging: Bulk Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 50 (2 x 25) Termination: Press-Fit Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
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146-83-650-41-036101 | Preci-Dip |
Description: CONN IC DIP SOCKET 50POS GOLD Packaging: Bulk Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 50 (2 x 25) Termination: Press-Fit Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
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236-504/000-009/999-950 | WAGO Corporation |
Description: PCB TERMINAL BLOCK; 2.5 MM; PIN Packaging: Box Color: Gray Mounting Type: Through Hole Wire Gauge: 12-28 AWG Pitch: 0.300" (7.62mm) Mating Orientation: 45° (135°) Angle with Board Positions Per Level: 4 Wire Termination: Screwless - Spring Cage, Tension Clamp Current: 15 A Number of Levels: 1 Voltage: 300 V |
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293650-4 | TE Connectivity / P&B | Lighting Connectors UL PARALLEL SPLITTER LV2 |
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3-523650-4 | TE Connectivity | Bench Top Tools NEW FEEDING CAMME W/O STEP |
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5223650-4 | TE Connectivity AMP Connectors |
Description: CONN RCPT FUTUREBUS 96POS PCB Packaging: Bulk Connector Type: Receptacle, Female Sockets Contact Finish: Gold Color: Natural Mounting Type: Through Hole Number of Positions: 96 Pitch: 0.079" (2.00mm) Number of Rows: 4 Number of Positions Loaded: All Termination: Press-Fit Connector Style: Futurebus |
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5223650-4 | TE Connectivity | Hard Metric Connectors 2MM FB 4RV REC ASY 096 PF 4.25 |
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5536504-3 | TE Connectivity | High Speed/Modular Connectors 2MM 096 SIG HDR 6.50 |
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612-83-650-41-001101 | Preci-Dip |
Description: CONN IC DIP SOCKET 50POS GOLD Packaging: Bulk Features: Carrier, Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 50 (2 x 25) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
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614-83-650-41-001101 | Preci-Dip |
Description: CONN IC DIP SOCKET 50POS GOLD Packaging: Bulk Features: Carrier, Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 50 (2 x 25) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass Part Status: Active |
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629-25W3650-4T2 | EDAC | D-Sub Mixed Contact Connectors Right-angle Power Combo D-Sub Connector |
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629-25W3650-4TA | EDAC | D-Sub Mixed Contact Connectors Right-angle Power Combo D-Sub Connector |
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629-3W3-650-4N5 | EDAC | D-Sub Mixed Contact Connectors Right-angle Power Combo D-Sub Connector |
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629-3W3-650-4T1 | EDAC | D-Sub Mixed Contact Connectors Right-angle Power Combo D-Sub Connector |
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629-3W3-650-4TD | EDAC | D-Sub Mixed Contact Connectors Right-angle Power Combo D-Sub Connector |
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630-13W3650-4N5 | EDAC | D-Sub Mixed Contact Connectors Right-angle Power Combo D-Sub Connector |
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630-13W3650-4ND | EDAC | D-Sub Mixed Contact Connectors Right-angle Power Combo D-Sub Connector |
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630-25W3650-4TC | EDAC | D-Sub Mixed Contact Connectors Right-angle Power Combo D-Sub Connector |
товар відсутній |
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630-3W3-650-4T1 | EDAC | D-Sub Mixed Contact Connectors Right-angle Power Combo D-Sub Connector |
товар відсутній |
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630-3W3-650-4T2 | EDAC | D-Sub Mixed Contact Connectors Right-angle Power Combo D-Sub Connector |
товар відсутній |
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630-3W3-650-4T3 | EDAC | D-Sub Mixed Contact Connectors Right-angle Power Combo D-Sub Connector |
товар відсутній |
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630-3WK3650-4NB | EDAC | D-Sub Mixed Contact Connectors Right-angle Power Combo D-Sub Connector |
товар відсутній |
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7283650450 | Yazaki | Automotive Connectors SAFETY CONN 2P ORANGE |
товар відсутній |
504TR |
Виробник: Keystone Electronics
Description: BATT HOLDER COIN 16MM 1 CELL SMD
Packaging: Cut Tape (CT)
Battery Cell Size: Coin, 16.0mm
Number of Cells: 1
Mounting Type: PCB, Surface Mount
Style: Holder (Open)
Termination Style: SMD (SMT) Tab
Height Above Board: 0.212" (5.38mm)
Battery Series: 1632
Battery Type, Function: Coin Cell, Holder
Description: BATT HOLDER COIN 16MM 1 CELL SMD
Packaging: Cut Tape (CT)
Battery Cell Size: Coin, 16.0mm
Number of Cells: 1
Mounting Type: PCB, Surface Mount
Style: Holder (Open)
Termination Style: SMD (SMT) Tab
Height Above Board: 0.212" (5.38mm)
Battery Series: 1632
Battery Type, Function: Coin Cell, Holder
на замовлення 16044 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
3+ | 105.17 грн |
25+ | 87.79 грн |
100+ | 85.84 грн |
ADS42JB69IRGCT |
Виробник: Texas Instruments
Description: IC ADC 16BIT PIPELINED 64VQFN
Packaging: Cut Tape (CT)
Features: Simultaneous Sampling
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Number of Bits: 16
Configuration: S/H-ADC
Data Interface: JESD204B
Reference Type: Internal
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Analog: 1.7V ~ 1.9V
Voltage - Supply, Digital: 1.7V ~ 1.9V
Sampling Rate (Per Second): 250M
Input Type: Differential
Number of Inputs: 2
Supplier Device Package: 64-VQFN (9x9)
Architecture: Pipelined
Ratio - S/H:ADC: 1:1
Part Status: Active
Number of A/D Converters: 2
Description: IC ADC 16BIT PIPELINED 64VQFN
Packaging: Cut Tape (CT)
Features: Simultaneous Sampling
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Number of Bits: 16
Configuration: S/H-ADC
Data Interface: JESD204B
Reference Type: Internal
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Analog: 1.7V ~ 1.9V
Voltage - Supply, Digital: 1.7V ~ 1.9V
Sampling Rate (Per Second): 250M
Input Type: Differential
Number of Inputs: 2
Supplier Device Package: 64-VQFN (9x9)
Architecture: Pipelined
Ratio - S/H:ADC: 1:1
Part Status: Active
Number of A/D Converters: 2
на замовлення 197 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 17275.02 грн |
10+ | 15932.37 грн |
25+ | 15580.98 грн |
ATS-P1-158-C2-R0 |
Виробник: Advanced Thermal Solutions Inc.
Description: HEATSINK 40X40X35MM L-TAB T766
Packaging: Tray
Material: Aluminum
Length: 1.575" (40.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.575" (40.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 2.80°C/W @ 100 LFM
Fin Height: 1.378" (35.00mm)
Material Finish: Blue Anodized
Description: HEATSINK 40X40X35MM L-TAB T766
Packaging: Tray
Material: Aluminum
Length: 1.575" (40.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.575" (40.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 2.80°C/W @ 100 LFM
Fin Height: 1.378" (35.00mm)
Material Finish: Blue Anodized
на замовлення 27 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 462.47 грн |
10+ | 433.2 грн |
25+ | 409.13 грн |
B6421E1-ND3G-5-50 |
Виробник: AMPHENOL RF
Description: AMPHENOL RF - B6421E1-ND3G-5-50 - HF-/Koaxialsteckverbinder, BNC-Koaxial, Gerade Einbaubuchse mit Verschraubung, Crimp, 50 ohm
tariffCode: 85366990
productTraceability: No
rohsCompliant: Y-EX
euEccn: NLR
Frequenz, max.: 4GHz
hazardous: false
rohsPhthalatesCompliant: YES
Impedanz: 50ohm
usEccn: EAR99
Produktpalette: -
Description: AMPHENOL RF - B6421E1-ND3G-5-50 - HF-/Koaxialsteckverbinder, BNC-Koaxial, Gerade Einbaubuchse mit Verschraubung, Crimp, 50 ohm
tariffCode: 85366990
productTraceability: No
rohsCompliant: Y-EX
euEccn: NLR
Frequenz, max.: 4GHz
hazardous: false
rohsPhthalatesCompliant: YES
Impedanz: 50ohm
usEccn: EAR99
Produktpalette: -
на замовлення 1106 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
3+ | 361.57 грн |
10+ | 301.06 грн |
100+ | 278.65 грн |
250+ | 244.87 грн |
500+ | 219.63 грн |
1000+ | 212.59 грн |
B6421E1-ND3G-6-75 |
Виробник: AMPHENOL RF
Description: AMPHENOL RF - B6421E1-ND3G-6-75 - HF-/Koaxialsteckverbinder, BNC-Koaxial, Gerade Einbaubuchse mit Verschraubung, Crimp, 75 ohm
tariffCode: 85366990
rohsCompliant: Y-EX
Kontaktüberzug: Vergoldete Kontakte
hazardous: false
rohsPhthalatesCompliant: YES
Kontaktmaterial: Phosphorbronze
Steckverbinderausführung: Gerade Einbaubuchse mit Verschraubung
Steckverbindermontage: Kabelmontage
usEccn: EAR99
euEccn: NLR
Koaxialanschluss: Crimp
Impedanz: 75ohm
Steckverbindertyp: BNC-Koaxial
Produktpalette: -
Koaxialkabeltypen: RG179, RG179A, RG179B, RG187, RG187A
productTraceability: No
Frequenz, max.: 1GHz
SVHC: No SVHC (17-Dec-2014)
Description: AMPHENOL RF - B6421E1-ND3G-6-75 - HF-/Koaxialsteckverbinder, BNC-Koaxial, Gerade Einbaubuchse mit Verschraubung, Crimp, 75 ohm
tariffCode: 85366990
rohsCompliant: Y-EX
Kontaktüberzug: Vergoldete Kontakte
hazardous: false
rohsPhthalatesCompliant: YES
Kontaktmaterial: Phosphorbronze
Steckverbinderausführung: Gerade Einbaubuchse mit Verschraubung
Steckverbindermontage: Kabelmontage
usEccn: EAR99
euEccn: NLR
Koaxialanschluss: Crimp
Impedanz: 75ohm
Steckverbindertyp: BNC-Koaxial
Produktpalette: -
Koaxialkabeltypen: RG179, RG179A, RG179B, RG187, RG187A
productTraceability: No
Frequenz, max.: 1GHz
SVHC: No SVHC (17-Dec-2014)
на замовлення 1819 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
3+ | 366.05 грн |
10+ | 304.79 грн |
100+ | 281.64 грн |
250+ | 248.34 грн |
500+ | 222.19 грн |
1000+ | 215.15 грн |
FP301-1 1/2-6"-Black |
Виробник: 3M Electronic Specialty
Heat Shrink Tubing & Sleeves 2:1 Thin Wall 1 1/2, 6" Black, Pk
Heat Shrink Tubing & Sleeves 2:1 Thin Wall 1 1/2, 6" Black, Pk
на замовлення 2 шт:
термін постачання 21-30 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 2265.51 грн |
5+ | 1967.41 грн |
10+ | 1490.36 грн |
20+ | 1387.14 грн |
50+ | 1349.85 грн |
G2RL-1 DC12 |
Виробник: OMRON ELECTRONIC COMPONENTS
Description: OMRON ELECTRONIC COMPONENTS - G2RL-1 DC12 - Universelles Leistungsrelais, Baureihe G2RL, monostabil, SPDT, 12V DC, 12A
tariffCode: 85364190
rohsCompliant: YES
Zulassungen & Normen: CE, UL, VDE
Relaisanschlüsse: Lötanschlüsse
hazardous: false
rohsPhthalatesCompliant: YES
Spulentyp: Monostabil
Kontaktmaterial: Silberzinnoxid
Kontaktstrom: 12A
usEccn: EAR99
Spulenwiderstand: 360ohm
euEccn: NLR
Kontaktspannung V DC: 24VDC
Relaismontage: Durchsteckmontage
Produktpalette: G2RL
productTraceability: No
Spulenspannung: 12VDC
Kontaktkonfiguration: SPDT
Kontaktspannung V AC: 250VAC
SVHC: No SVHC (17-Dec-2014)
Description: OMRON ELECTRONIC COMPONENTS - G2RL-1 DC12 - Universelles Leistungsrelais, Baureihe G2RL, monostabil, SPDT, 12V DC, 12A
tariffCode: 85364190
rohsCompliant: YES
Zulassungen & Normen: CE, UL, VDE
Relaisanschlüsse: Lötanschlüsse
hazardous: false
rohsPhthalatesCompliant: YES
Spulentyp: Monostabil
Kontaktmaterial: Silberzinnoxid
Kontaktstrom: 12A
usEccn: EAR99
Spulenwiderstand: 360ohm
euEccn: NLR
Kontaktspannung V DC: 24VDC
Relaismontage: Durchsteckmontage
Produktpalette: G2RL
productTraceability: No
Spulenspannung: 12VDC
Kontaktkonfiguration: SPDT
Kontaktspannung V AC: 250VAC
SVHC: No SVHC (17-Dec-2014)
на замовлення 8190 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
4+ | 218.88 грн |
5+ | 212.16 грн |
10+ | 204.69 грн |
20+ | 168.56 грн |
50+ | 140.23 грн |
G6K-2G-Y DC12 |
Виробник: OMRON ELECTRONIC COMPONENTS
Description: OMRON ELECTRONIC COMPONENTS - G6K-2G-Y DC12 - Signalrelais, 12 VDC, DPDT, 1 A, G6K, Oberflächenmontage, Monostabil
tariffCode: 85364190
rohsCompliant: YES
Relaisanschlüsse: Lötanschlüsse
hazardous: false
rohsPhthalatesCompliant: YES
Spulentyp: Monostabil
Kontaktmaterial: Silber-Gold
Kontaktstrom: 1A
usEccn: EAR99
Spulenwiderstand: 1.315kohm
euEccn: NLR
Kontaktspannung V DC: 30V
Relaismontage: Oberflächenmontage
Produktpalette: G6K
productTraceability: No
Spulenspannung: 12VDC
Kontaktkonfiguration: DPDT
Kontaktspannung V AC: -
SVHC: No SVHC (17-Dec-2014)
Description: OMRON ELECTRONIC COMPONENTS - G6K-2G-Y DC12 - Signalrelais, 12 VDC, DPDT, 1 A, G6K, Oberflächenmontage, Monostabil
tariffCode: 85364190
rohsCompliant: YES
Relaisanschlüsse: Lötanschlüsse
hazardous: false
rohsPhthalatesCompliant: YES
Spulentyp: Monostabil
Kontaktmaterial: Silber-Gold
Kontaktstrom: 1A
usEccn: EAR99
Spulenwiderstand: 1.315kohm
euEccn: NLR
Kontaktspannung V DC: 30V
Relaismontage: Oberflächenmontage
Produktpalette: G6K
productTraceability: No
Spulenspannung: 12VDC
Kontaktkonfiguration: DPDT
Kontaktspannung V AC: -
SVHC: No SVHC (17-Dec-2014)
на замовлення 945 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
3+ | 317.49 грн |
5+ | 307.78 грн |
10+ | 298.07 грн |
20+ | 245.56 грн |
50+ | 204.26 грн |
G6K-2G-Y DC24 |
Виробник: OMRON ELECTRONIC COMPONENTS
Description: OMRON ELECTRONIC COMPONENTS - G6K-2G-Y DC24 - Signalrelais, 24 VDC, DPDT, 1 A, G6K, Oberflächenmontage, Monostabil
tariffCode: 85364110
rohsCompliant: YES
Relaisanschlüsse: Lötanschlüsse
hazardous: false
rohsPhthalatesCompliant: YES
Spulentyp: Monostabil
Kontaktmaterial: Silber-Gold
Kontaktstrom: 1A
usEccn: EAR99
Spulenwiderstand: 5.22kohm
euEccn: NLR
Kontaktspannung V DC: 30V
Relaismontage: Oberflächenmontage
Produktpalette: G6K
productTraceability: No
Spulenspannung: 24VDC
Kontaktkonfiguration: DPDT
Kontaktspannung V AC: -
SVHC: No SVHC (17-Dec-2014)
Description: OMRON ELECTRONIC COMPONENTS - G6K-2G-Y DC24 - Signalrelais, 24 VDC, DPDT, 1 A, G6K, Oberflächenmontage, Monostabil
tariffCode: 85364110
rohsCompliant: YES
Relaisanschlüsse: Lötanschlüsse
hazardous: false
rohsPhthalatesCompliant: YES
Spulentyp: Monostabil
Kontaktmaterial: Silber-Gold
Kontaktstrom: 1A
usEccn: EAR99
Spulenwiderstand: 5.22kohm
euEccn: NLR
Kontaktspannung V DC: 30V
Relaismontage: Oberflächenmontage
Produktpalette: G6K
productTraceability: No
Spulenspannung: 24VDC
Kontaktkonfiguration: DPDT
Kontaktspannung V AC: -
SVHC: No SVHC (17-Dec-2014)
на замовлення 458 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
3+ | 317.49 грн |
5+ | 307.78 грн |
10+ | 298.07 грн |
20+ | 245.56 грн |
50+ | 204.26 грн |
LPC844M201JHI48E |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 48HVQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 30MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
Part Status: Active
Number of I/O: 42
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 64KB FLASH 48HVQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 30MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
Part Status: Active
Number of I/O: 42
DigiKey Programmable: Not Verified
на замовлення 144 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
2+ | 216.83 грн |
10+ | 163.22 грн |
80+ | 133.74 грн |
MP200-M |
Виробник: Panduit Corp
Description: WIRE MARKR CBL TIE 19.1MMX50.8MM
Packaging: Bulk
Color: White
Material: Polyamide (PA66), Nylon 6/6
Type: Wire Marker, Cable Tie
Size: 0.75" W x 2.00" L (19.1mm x 50.8mm)
Legend: Blank
Description: WIRE MARKR CBL TIE 19.1MMX50.8MM
Packaging: Bulk
Color: White
Material: Polyamide (PA66), Nylon 6/6
Type: Wire Marker, Cable Tie
Size: 0.75" W x 2.00" L (19.1mm x 50.8mm)
Legend: Blank
на замовлення 2000 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
6+ | 56.19 грн |
10+ | 53.27 грн |
25+ | 52.03 грн |
50+ | 47.63 грн |
100+ | 45.24 грн |
500+ | 44.05 грн |
1000+ | 39.82 грн |
N74F04N,602 |
Виробник: NXP USA Inc.
Description: IC INVERTER 6CH 1-INP 14DIP
Packaging: Bulk
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Logic Type: Inverter
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 1mA, 20mA
Number of Inputs: 1
Supplier Device Package: 14-DIP
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 5ns @ 5V, 50pF
Part Status: Obsolete
Number of Circuits: 6
Description: IC INVERTER 6CH 1-INP 14DIP
Packaging: Bulk
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Logic Type: Inverter
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 1mA, 20mA
Number of Inputs: 1
Supplier Device Package: 14-DIP
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 5ns @ 5V, 50pF
Part Status: Obsolete
Number of Circuits: 6
на замовлення 25821 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
784+ | 25.28 грн |
365047-000 |
Виробник: TE Connectivity
Heat Shrink Transition Flexible Modified Polyolefin
Heat Shrink Transition Flexible Modified Polyolefin
товар відсутній
365047N002 |
Виробник: TE Connectivity / Raychem
Heat Shrink Cable Boots & End Caps 562A0434/860CS8665
Heat Shrink Cable Boots & End Caps 562A0434/860CS8665
товар відсутній
0365040049 |
Виробник: Molex
Conn DIN 41612 M 96 POS 2.54mm Press Fit RA Thru-Hole Carton
Conn DIN 41612 M 96 POS 2.54mm Press Fit RA Thru-Hole Carton
товар відсутній
0387036504 |
Виробник: Molex
Description: JUMPER BARRIER BLK 4POS SPADE
Packaging: Bulk
Contact Finish: Nickel
For Use With/Related Products: Beau 38700 Series
Pitch: 0.325" (8.26mm)
Style: Over Barrier, Flanged Spade
Type: Barrier Block
Contact Material: Brass
Number of Positions: 4
Description: JUMPER BARRIER BLK 4POS SPADE
Packaging: Bulk
Contact Finish: Nickel
For Use With/Related Products: Beau 38700 Series
Pitch: 0.325" (8.26mm)
Style: Over Barrier, Flanged Spade
Type: Barrier Block
Contact Material: Brass
Number of Positions: 4
товар відсутній
110-83-650-41-001101 |
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 50POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 50 (2 x 25)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 50POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 50 (2 x 25)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товар відсутній
110-83-650-41-005101 |
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 50POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 50 (2 x 25)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 50POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 50 (2 x 25)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товар відсутній
1136504 |
Виробник: LAPP
Category: Multicore Cables - Shielded
Description: Wire; ÖLFLEX® CLASSIC 115 CY; 4G4mm2; PVC; grey; 300V,500V
Type of wire: control cable
Kind of wire: ÖLFLEX® CLASSIC 115 CY
Cable structure: 4G4mm2
Core structure: stranded
Kind of core: Cu
Number of cores: 4
Core section: 4mm2
Core marking: black, numbered + ground wire
Shield structure: shielded; tinned copper braid
Wire insulation material: PVC
Insulation colour: grey
Rated voltage: 300V; 500V
Kind of material: no flame propagation
Operating temperature: -40...80°C
Resistance to: most of chemical compounds
Flexibility class: 5
Cable external diameter: 11.6mm
CPR standard: Eca
Earth core: yellow-green
Category: Multicore Cables - Shielded
Description: Wire; ÖLFLEX® CLASSIC 115 CY; 4G4mm2; PVC; grey; 300V,500V
Type of wire: control cable
Kind of wire: ÖLFLEX® CLASSIC 115 CY
Cable structure: 4G4mm2
Core structure: stranded
Kind of core: Cu
Number of cores: 4
Core section: 4mm2
Core marking: black, numbered + ground wire
Shield structure: shielded; tinned copper braid
Wire insulation material: PVC
Insulation colour: grey
Rated voltage: 300V; 500V
Kind of material: no flame propagation
Operating temperature: -40...80°C
Resistance to: most of chemical compounds
Flexibility class: 5
Cable external diameter: 11.6mm
CPR standard: Eca
Earth core: yellow-green
товар відсутній
1136504 |
Виробник: LAPP
Category: Multicore Cables - Shielded
Description: Wire; ÖLFLEX® CLASSIC 115 CY; 4G4mm2; PVC; grey; 300V,500V
Type of wire: control cable
Kind of wire: ÖLFLEX® CLASSIC 115 CY
Cable structure: 4G4mm2
Core structure: stranded
Kind of core: Cu
Number of cores: 4
Core section: 4mm2
Core marking: black, numbered + ground wire
Shield structure: shielded; tinned copper braid
Wire insulation material: PVC
Insulation colour: grey
Rated voltage: 300V; 500V
Kind of material: no flame propagation
Operating temperature: -40...80°C
Resistance to: most of chemical compounds
Flexibility class: 5
Cable external diameter: 11.6mm
CPR standard: Eca
Earth core: yellow-green
кількість в упаковці: 5 шт
Category: Multicore Cables - Shielded
Description: Wire; ÖLFLEX® CLASSIC 115 CY; 4G4mm2; PVC; grey; 300V,500V
Type of wire: control cable
Kind of wire: ÖLFLEX® CLASSIC 115 CY
Cable structure: 4G4mm2
Core structure: stranded
Kind of core: Cu
Number of cores: 4
Core section: 4mm2
Core marking: black, numbered + ground wire
Shield structure: shielded; tinned copper braid
Wire insulation material: PVC
Insulation colour: grey
Rated voltage: 300V; 500V
Kind of material: no flame propagation
Operating temperature: -40...80°C
Resistance to: most of chemical compounds
Flexibility class: 5
Cable external diameter: 11.6mm
CPR standard: Eca
Earth core: yellow-green
кількість в упаковці: 5 шт
товар відсутній
115-83-650-41-001101 |
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 50POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 50 (2 x 25)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Description: CONN IC DIP SOCKET 50POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 50 (2 x 25)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
товар відсутній
115-83-650-41-003101 |
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 50POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 50 (2 x 25)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Description: CONN IC DIP SOCKET 50POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 50 (2 x 25)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
товар відсутній
116-83-650-41-003101 |
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 50POS GOLD
Features: Elevated, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 50 (2 x 25)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 50POS GOLD
Features: Elevated, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 50 (2 x 25)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товар відсутній
116-83-650-41-006101 |
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 50POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 50 (2 x 25)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 50POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 50 (2 x 25)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товар відсутній
116-83-650-41-012101 |
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 50POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 50 (2 x 25)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 50POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 50 (2 x 25)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товар відсутній
116-83-650-41-018101 |
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 50POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 50 (2 x 25)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 50POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 50 (2 x 25)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товар відсутній
121-83-650-41-001101 |
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 50POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 50 (2 x 25)
Termination: Wire Wrap
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 50POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 50 (2 x 25)
Termination: Wire Wrap
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товар відсутній
146-83-650-41-035101 |
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 50POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 50 (2 x 25)
Termination: Press-Fit
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 50POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 50 (2 x 25)
Termination: Press-Fit
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товар відсутній
146-83-650-41-036101 |
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 50POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 50 (2 x 25)
Termination: Press-Fit
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 50POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 50 (2 x 25)
Termination: Press-Fit
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товар відсутній
236-504/000-009/999-950 |
Виробник: WAGO Corporation
Description: PCB TERMINAL BLOCK; 2.5 MM; PIN
Packaging: Box
Color: Gray
Mounting Type: Through Hole
Wire Gauge: 12-28 AWG
Pitch: 0.300" (7.62mm)
Mating Orientation: 45° (135°) Angle with Board
Positions Per Level: 4
Wire Termination: Screwless - Spring Cage, Tension Clamp
Current: 15 A
Number of Levels: 1
Voltage: 300 V
Description: PCB TERMINAL BLOCK; 2.5 MM; PIN
Packaging: Box
Color: Gray
Mounting Type: Through Hole
Wire Gauge: 12-28 AWG
Pitch: 0.300" (7.62mm)
Mating Orientation: 45° (135°) Angle with Board
Positions Per Level: 4
Wire Termination: Screwless - Spring Cage, Tension Clamp
Current: 15 A
Number of Levels: 1
Voltage: 300 V
товар відсутній
293650-4 |
Виробник: TE Connectivity / P&B
Lighting Connectors UL PARALLEL SPLITTER LV2
Lighting Connectors UL PARALLEL SPLITTER LV2
товар відсутній
5223650-4 |
Виробник: TE Connectivity AMP Connectors
Description: CONN RCPT FUTUREBUS 96POS PCB
Packaging: Bulk
Connector Type: Receptacle, Female Sockets
Contact Finish: Gold
Color: Natural
Mounting Type: Through Hole
Number of Positions: 96
Pitch: 0.079" (2.00mm)
Number of Rows: 4
Number of Positions Loaded: All
Termination: Press-Fit
Connector Style: Futurebus
Description: CONN RCPT FUTUREBUS 96POS PCB
Packaging: Bulk
Connector Type: Receptacle, Female Sockets
Contact Finish: Gold
Color: Natural
Mounting Type: Through Hole
Number of Positions: 96
Pitch: 0.079" (2.00mm)
Number of Rows: 4
Number of Positions Loaded: All
Termination: Press-Fit
Connector Style: Futurebus
товар відсутній
5223650-4 |
Виробник: TE Connectivity
Hard Metric Connectors 2MM FB 4RV REC ASY 096 PF 4.25
Hard Metric Connectors 2MM FB 4RV REC ASY 096 PF 4.25
товар відсутній
5536504-3 |
Виробник: TE Connectivity
High Speed/Modular Connectors 2MM 096 SIG HDR 6.50
High Speed/Modular Connectors 2MM 096 SIG HDR 6.50
товар відсутній
612-83-650-41-001101 |
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 50POS GOLD
Packaging: Bulk
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 50 (2 x 25)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 50POS GOLD
Packaging: Bulk
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 50 (2 x 25)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товар відсутній
614-83-650-41-001101 |
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 50POS GOLD
Packaging: Bulk
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 50 (2 x 25)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Description: CONN IC DIP SOCKET 50POS GOLD
Packaging: Bulk
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 50 (2 x 25)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
товар відсутній
629-25W3650-4T2 |
Виробник: EDAC
D-Sub Mixed Contact Connectors Right-angle Power Combo D-Sub Connector
D-Sub Mixed Contact Connectors Right-angle Power Combo D-Sub Connector
товар відсутній
629-25W3650-4TA |
Виробник: EDAC
D-Sub Mixed Contact Connectors Right-angle Power Combo D-Sub Connector
D-Sub Mixed Contact Connectors Right-angle Power Combo D-Sub Connector
товар відсутній
629-3W3-650-4N5 |
Виробник: EDAC
D-Sub Mixed Contact Connectors Right-angle Power Combo D-Sub Connector
D-Sub Mixed Contact Connectors Right-angle Power Combo D-Sub Connector
товар відсутній
629-3W3-650-4T1 |
Виробник: EDAC
D-Sub Mixed Contact Connectors Right-angle Power Combo D-Sub Connector
D-Sub Mixed Contact Connectors Right-angle Power Combo D-Sub Connector
товар відсутній
629-3W3-650-4TD |
Виробник: EDAC
D-Sub Mixed Contact Connectors Right-angle Power Combo D-Sub Connector
D-Sub Mixed Contact Connectors Right-angle Power Combo D-Sub Connector
товар відсутній
630-13W3650-4N5 |
Виробник: EDAC
D-Sub Mixed Contact Connectors Right-angle Power Combo D-Sub Connector
D-Sub Mixed Contact Connectors Right-angle Power Combo D-Sub Connector
товар відсутній
630-13W3650-4ND |
Виробник: EDAC
D-Sub Mixed Contact Connectors Right-angle Power Combo D-Sub Connector
D-Sub Mixed Contact Connectors Right-angle Power Combo D-Sub Connector
товар відсутній
630-25W3650-4TC |
Виробник: EDAC
D-Sub Mixed Contact Connectors Right-angle Power Combo D-Sub Connector
D-Sub Mixed Contact Connectors Right-angle Power Combo D-Sub Connector
товар відсутній
630-3W3-650-4T1 |
Виробник: EDAC
D-Sub Mixed Contact Connectors Right-angle Power Combo D-Sub Connector
D-Sub Mixed Contact Connectors Right-angle Power Combo D-Sub Connector
товар відсутній
630-3W3-650-4T2 |
Виробник: EDAC
D-Sub Mixed Contact Connectors Right-angle Power Combo D-Sub Connector
D-Sub Mixed Contact Connectors Right-angle Power Combo D-Sub Connector
товар відсутній
630-3W3-650-4T3 |
Виробник: EDAC
D-Sub Mixed Contact Connectors Right-angle Power Combo D-Sub Connector
D-Sub Mixed Contact Connectors Right-angle Power Combo D-Sub Connector
товар відсутній
630-3WK3650-4NB |
Виробник: EDAC
D-Sub Mixed Contact Connectors Right-angle Power Combo D-Sub Connector
D-Sub Mixed Contact Connectors Right-angle Power Combo D-Sub Connector
товар відсутній