Виробник: TE Connectivity / Raychem
Heat Shrink Tubing & Sleeves HS-TBG PRICE PER METER

Виробник: TE Connectivity Passive Product
Description: RES CHAS MNT 33 OHM 5% 500W
Power (Watts): 500W
Tolerance: ±5%
Lead Style: Solder Lugs
Features: Flame Proof, Safety
Packaging: Bulk
Package / Case: Radial, Tubular
Temperature Coefficient: ±440ppm/°C
Size / Dimension: 1.969" Dia x 12.441" L (50.00mm x 316.00mm)
Composition: Wirewound
Operating Temperature: -55°C ~ 155°C
Mounting Feature: Brackets
Coating, Housing Type: Silicone Coated
Part Status: Active
Resistance: 33 Ohms

Виробник: Infineon Technologies
Description: IC MCU 32BIT 8KB FLASH 16TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 6x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, I2S, POR, PWM, WDT
Supplier Device Package: PG-TSSOP-16-8
Part Status: Active
Number of I/O: 11
DigiKey Programmable: Not Verified