Виробник: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 48QFN
Packaging: Tray
Package / Case: 48-TFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12
Data Converters: A/D 10x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Number of I/O: 34
DigiKey Programmable: Not Verified

Виробник: NXP Semiconductors
MCU 16-bit HCS12 CISC 64KB Flash 5V Automotive 48-Pin QFN EP Tray

Виробник: NXP Semiconductors
16-bit Microcontrollers - MCU 16 BIT 64K FLASH

Виробник: NXP Semiconductors
MCU 32-bit ColdFire RISC 256KB Flash 3.3V Automotive 256-Pin MAP-BGA Tray

Виробник: NXP USA Inc.
Description: IC MCU 32B 256KB FLASH 256MAPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 256-MAPBGA (17x17)
Part Status: Not For New Designs
Number of I/O: 142
DigiKey Programmable: Not Verified

Виробник: NXP Semiconductors
32-bit Microcontrollers - MCU MCF5281 V2CORE 256KFLASH

Виробник: NXP USA Inc.
Description: IC MPU I.MX6SL 1.0GHZ 432MAPBGA
Packaging: Tray
Package / Case: 432-TFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.2V, 1.8V, 3.0V
Supplier Device Package: 432-MAPBGA (13x13)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART

Виробник: NXP Semiconductors
SOC i.MX 6SoloLite ARM Cortex A9 40nm 432-Pin MAP-BGA Tray

Виробник: NXP Semiconductors
Processors - Application Specialised i.MX 6SL ROM Perf Enhan

Виробник: NXP Semiconductors
SOC i.MX 6Quad ARM Cortex A9 0.04um 624-Pin FCBGA Tray

Виробник: Hirose Electric Co Ltd
Description: CONN HEADER VERT 20POS 2.54MM
Packaging: Bulk
Connector Type: Header
Voltage Rating: 250V
Current Rating (Amps): 3A
Mounting Type: Through Hole
Number of Positions: 20
Number of Rows: 2
Style: Board to Board
Operating Temperature: -35°C ~ 85°C
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: 20
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Brass
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 39.4µin (1.00µm)
Contact Finish - Post: Tin
Contact Shape: Square
Contact Length - Post: 0.118" (3.00mm)
Insulation Height: 0.100" (2.54mm)
Shrouding: Unshrouded
Overall Contact Length: 0.867" (22.01mm)
Insulation Material: Polybutylene Terephthalate (PBT)
Row Spacing - Mating: 0.100" (2.54mm)
Contact Length - Mating: 0.648" (16.47mm)

Виробник: NXP Semiconductors
S32K324, 4MB flash, ARM M7 multi core

Виробник: NXP USA Inc.
Description: S32K324 ARM CORTEX-M7, 160 MHZ,
Packaging: Tray
Package / Case: 172-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART
Peripherals: DMA, I2S, Serial Audio, WDT
Supplier Device Package: 172-QFP (16x16)
Number of I/O: 218
Grade: Automotive
Qualification: AEC-Q100

Виробник: NXP Semiconductors
ARM Microcontrollers - MCU S32K324 Arm Cortex-M7, 160 MHz, 4 MB Flash, CAN FD, Flex IO, HSE B security, 172 MaxQFP - S32K MCUs for General-Purpose

Виробник: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-HLQFP (10x10)
Number of I/O: 31
DigiKey Programmable: Not Verified

Виробник: NXP Semiconductors
MCU 16-bit S12Z CISC 128KB Flash 5V Automotive AEC-Q100 64-Pin HLQFP EP Tray

Виробник: NXP Semiconductors
MCU 16-bit S12Z CISC 128KB Flash 5V Automotive AEC-Q100 64-Pin HLQPG EP T/R

Виробник: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-HLQFP (10x10)
Number of I/O: 31
DigiKey Programmable: Not Verified

Виробник: NXP Semiconductors
16-bit Microcontrollers - MCU MagniV 16-bit MCU, S12Z core, 128KB Flash, 50MHz, -40/+150degC, Automotive Qualified, QFP 64

Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 32x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
DigiKey Programmable: Not Verified

Виробник: NXP Semiconductors
32-bit Microcontrollers - MCU NXP 32-bit MCU, Dual Power Arch, 1MB Flash, 120MHz, -40/+125degC, Automotive Grade, QFP 144

Виробник: Zilog
Description: IC MCU 8BIT 12KB FLASH 20SOIC
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 12KB (12K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: eZ8
Data Converters: A/D 7x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT
Part Status: Not For New Designs
Number of I/O: 17
DigiKey Programmable: Verified