Виробник: Molex
Cable Assembly Flat Ribbon 0.18m 28AWG Picoflex to Picoflex 18 to 18 POS F-F IDT Bag

Виробник: TE Connectivity
8P,2MM,BRK HDR,SRVT,2.8,0.38AU,BOX

Виробник: ROSE
Category: Multipurpose Enclosures
Description: Enclosure: multipurpose; X: 180mm; Y: 180mm; Z: 101mm; aluminium
Type of enclosure: multipurpose
Dimension X: 180mm
Dimension Y: 180mm
Dimension Z: 101mm
Enclosure material: aluminium
Body colour: dark grey
Cover colour: dark grey
IP rating: IP66
Operating temperature: -55...90°C
Conform to the norm: ATEX Ex; EN

Виробник: MOLEX
Category: Raster signal connectors 3,00mm
Description: Socket; wire-board; male; Micro-Fit 3.0; 3mm; PIN: 18; Layout: 2x9
Connector: socket
Kind of connector: male
Number of pins: 18
Connector series: Micro-Fit 3.0
Connector pinout layout: 2x9
Contacts pitch: 3mm
Type of connector: wire-board
Locking system: for latch

Виробник: MOLEX
Category: Raster signal connectors 3,00mm
Description: Socket; wire-board; male; Micro-Fit 3.0; 3mm; PIN: 18; Layout: 2x9
Connector: socket
Kind of connector: male
Number of pins: 18
Connector series: Micro-Fit 3.0
Connector pinout layout: 2x9
Contacts pitch: 3mm
Type of connector: wire-board
Locking system: for latch
кількість в упаковці: 1 шт

Виробник: Aimtec
Module DC-DC 5VIN 2-OUT 18V/18V 0.027A/0.027A 1W 6-Pin SIP Bulk

Виробник: Aimtec
Module DC-DC 5VIN 2-OUT 18V/18V 0.028A/0.028A 1W 6-Pin DIP

Виробник: Aimtec
Module DC-DC 5VIN 2-OUT 18V/18V 0.055A/0.055A 2W 6-Pin SIP Module Bulk

Виробник: ECS International
Crystal 11.0592MHz ±30ppm (Tol) ±100ppm (Stability) 18pF FUND 80Ohm 4-Pin SMD T/R

Виробник: BUNGARD
Category: One-layer laminates
Description: Laminate; FR4,epoxy resin; 0.5mm; L: 570mm; W: 510mm
Type of board: laminate
Board variant: double sided
Material: epoxy resin; FR4
Laminate thickness: 0.5mm
Width: 510mm
Length: 570mm
Copper plating thickness: 18µm
Kind of board clad: copper; light-sensitive coating
Kind of material: fiber glass reinforced
кількість в упаковці: 1 шт

Виробник: BUNGARD
Category: One-layer laminates
Description: Laminate; FR4,epoxy resin; 0.5mm; L: 100mm; W: 75mm
Type of board: laminate
Board variant: double sided
Material: epoxy resin; FR4
Laminate thickness: 0.5mm
Width: 75mm
Length: 0.1m
Copper plating thickness: 18µm
Kind of board clad: copper; light-sensitive coating
Kind of material: fiber glass reinforced
кількість в упаковці: 1 шт

Виробник: BUNGARD
Category: One-layer laminates
Description: Laminate; FR4,epoxy resin; 0.5mm; L: 233mm; W: 160mm
Type of board: laminate
Board variant: double sided
Material: epoxy resin; FR4
Laminate thickness: 0.5mm
Width: 0.16m
Length: 233mm
Copper plating thickness: 18µm
Kind of board clad: copper; light-sensitive coating
Kind of material: fiber glass reinforced
кількість в упаковці: 1 шт

Виробник: BUNGARD
Category: One-layer laminates
Description: Laminate; FR4,epoxy resin; 0.5mm; L: 200mm; W: 150mm
Type of board: laminate
Material: epoxy resin; FR4
Board variant: double sided
Laminate thickness: 0.5mm
Length: 0.2m
Width: 0.15m
Kind of board clad: copper; light-sensitive coating
Copper plating thickness: 18µm
Kind of material: fiber glass reinforced
кількість в упаковці: 1 шт

Виробник: BUNGARD
Category: One-layer laminates
Description: Laminate; FR4,epoxy resin; 0.5mm; L: 250mm; W: 150mm
Length: 0.25m
Width: 0.15m
Material: epoxy resin; FR4
Laminate thickness: 0.5mm
Copper plating thickness: 18µm
Type of board: laminate
Kind of board clad: copper; light-sensitive coating
Board variant: double sided
Kind of material: fiber glass reinforced
кількість в упаковці: 1 шт

Виробник: BUNGARD
FR475X100X15/1818 One-layer laminates

Виробник: BUNGARD
FR4160X233X15/1818 One-layer laminates

Виробник: BUNGARD
Category: One-layer laminates
Description: Laminate; FR4,epoxy resin; 1.5mm; L: 200mm; W: 150mm
Type of board: laminate
Material: epoxy resin; FR4
Board variant: double sided
Laminate thickness: 1.5mm
Length: 0.2m
Width: 0.15m
Kind of board clad: copper; light-sensitive coating
Copper plating thickness: 18µm
Kind of material: fiber glass reinforced
кількість в упаковці: 1 шт

Виробник: BUNGARD
Category: One-layer laminates
Description: Laminate; FR4,epoxy resin; 1.5mm; L: 250mm; W: 150mm
Length: 0.25m
Width: 0.15m
Material: epoxy resin; FR4
Laminate thickness: 1.5mm
Copper plating thickness: 18µm
Type of board: laminate
Kind of board clad: copper; light-sensitive coating
Board variant: double sided
Kind of material: fiber glass reinforced
кількість в упаковці: 1 шт

Виробник: TE Connectivity
Conn Mini-UHF PL 0Hz to 2GHz 50Ohm Crimp ST Cable Mount Gold Package

Виробник: 3M Interconnect Solutions
Conn IDC Connector SKT 10 POS 2.54mm IDT RA Cable Mount Box

Виробник: 3M Interconnect Solutions
Conn IDC Connector SKT 10 POS 2.54mm IDT RA Cable Mount Box

Виробник: KEMET
Multilayer Piezoelectric Actuators

Виробник: KEMET
Multilayer Piezoelectric Actuator, Resin Coated

Виробник: KEMET
AE0505D18H18F

Виробник: Finisar
TX/RX Optical Fiber 1.25Gbps 20-Pin

Виробник: Amphenol
Band Backshells For Shielding

Виробник: Amphenol
Band Backshell 180° 11 Shell Size Olive Drab Cadmium

Виробник: Amphenol
Band Backshell 180° 17 Shell Size Olive Drab Cadmium

Виробник: Banner Engineering
Fibre Optic Cables Plastic Fiber, Opposed Mode; Core Dia.: 16 x 0.25 mm; Fiber Length 2 m; Rectangle, Sideview; Free cut

Виробник: NXP Semiconductors
Multimedia Converter 2 Lane Display Port to VGA 1920x1200Pixels/ 1600x1200Pixels/ 1280x1024Pixels/ 1024x768Pixels/ 800x600Pixels/ 640x480Pixels 1.62Gbps/2.7Gbps 48-Pin HVQFN EP T/R

Виробник: NXP Semiconductors
MCU 32-bit ARM Cortex M0+ RISC 8KB Flash 3.3V/5V Automotive AEC-Q100 16-Pin TSSOP T/R

Виробник: Phoenix Contact
Cable Assembly Bus System 5m 22AWG/24AWG Circular 5 POS M

Виробник: NXP Semiconductors
SXF1800HN/V10200