Виробник: TE Connectivity Passive Product
Description: RES SMD 143 OHM 0.5% 1/32W 0201
Packaging: Tape & Reel (TR)
Power (Watts): 0.03W, 1/32W
Tolerance: ±0.5%
Package / Case: 0201 (0603 Metric)
Temperature Coefficient: ±25ppm/°C
Size / Dimension: 0.023" L x 0.011" W (0.58mm x 0.29mm)
Composition: Thin Film
Operating Temperature: -55°C ~ 155°C
Number of Terminations: 2
Supplier Device Package: 0201
Height - Seated (Max): 0.011" (0.28mm)
Resistance: 143 Ohms

Виробник: TE Connectivity Passive Product
Description: RES SMD 182 OHM 0.5% 1/32W 0201
Packaging: Tape & Reel (TR)
Power (Watts): 0.03W, 1/32W
Tolerance: ±0.5%
Package / Case: 0201 (0603 Metric)
Temperature Coefficient: ±25ppm/°C
Size / Dimension: 0.023" L x 0.011" W (0.58mm x 0.29mm)
Composition: Thin Film
Operating Temperature: -55°C ~ 155°C
Number of Terminations: 2
Supplier Device Package: 0201
Height - Seated (Max): 0.011" (0.28mm)
Resistance: 182 Ohms

Виробник: TE Connectivity Passive Product
Description: RES SMD 232 OHM 0.5% 1/32W 0201
Packaging: Tape & Reel (TR)
Power (Watts): 0.03W, 1/32W
Tolerance: ±0.5%
Package / Case: 0201 (0603 Metric)
Temperature Coefficient: ±25ppm/°C
Size / Dimension: 0.023" L x 0.011" W (0.58mm x 0.29mm)
Composition: Thin Film
Operating Temperature: -55°C ~ 155°C
Number of Terminations: 2
Supplier Device Package: 0201
Height - Seated (Max): 0.011" (0.28mm)
Resistance: 232 Ohms

Виробник: TE Connectivity Passive Product
Description: RES SMD 294 OHM 0.5% 1/32W 0201
Packaging: Tape & Reel (TR)
Power (Watts): 0.03W, 1/32W
Tolerance: ±0.5%
Package / Case: 0201 (0603 Metric)
Temperature Coefficient: ±25ppm/°C
Size / Dimension: 0.023" L x 0.011" W (0.58mm x 0.29mm)
Composition: Thin Film
Operating Temperature: -55°C ~ 155°C
Number of Terminations: 2
Supplier Device Package: 0201
Height - Seated (Max): 0.011" (0.28mm)
Resistance: 294 Ohms

Виробник: TE Connectivity Passive Product
Description: RES SMD 374 OHM 0.5% 1/32W 0201
Power (Watts): 0.03W, 1/32W
Tolerance: ±0.5%
Packaging: Tape & Reel (TR)
Package / Case: 0201 (0603 Metric)
Temperature Coefficient: ±25ppm/°C
Size / Dimension: 0.023" L x 0.011" W (0.58mm x 0.29mm)
Composition: Thin Film
Operating Temperature: -55°C ~ 155°C
Number of Terminations: 2
Supplier Device Package: 0201
Height - Seated (Max): 0.011" (0.28mm)
Resistance: 374 Ohms

Виробник: TE Connectivity Passive Product
Description: RES SMD 475 OHM 0.5% 1/32W 0201
Power (Watts): 0.03W, 1/32W
Tolerance: ±0.5%
Packaging: Tape & Reel (TR)
Package / Case: 0201 (0603 Metric)
Temperature Coefficient: ±25ppm/°C
Size / Dimension: 0.023" L x 0.011" W (0.58mm x 0.29mm)
Composition: Thin Film
Operating Temperature: -55°C ~ 155°C
Number of Terminations: 2
Supplier Device Package: 0201
Height - Seated (Max): 0.011" (0.28mm)
Resistance: 475 Ohms

Виробник: TE Connectivity Passive Product
Description: RES SMD 54.9 OHM 0.5% 1/32W 0201
Power (Watts): 0.03W, 1/32W
Tolerance: ±0.5%
Packaging: Tape & Reel (TR)
Package / Case: 0201 (0603 Metric)
Temperature Coefficient: ±25ppm/°C
Size / Dimension: 0.023" L x 0.011" W (0.58mm x 0.29mm)
Composition: Thin Film
Operating Temperature: -55°C ~ 155°C
Number of Terminations: 2
Supplier Device Package: 0201
Height - Seated (Max): 0.011" (0.28mm)
Resistance: 54.9 Ohms

Виробник: TE Connectivity Passive Product
Description: RES SMD 69.8 OHM 0.5% 1/32W 0201
Packaging: Tape & Reel (TR)
Power (Watts): 0.03W, 1/32W
Tolerance: ±0.5%
Package / Case: 0201 (0603 Metric)
Temperature Coefficient: ±25ppm/°C
Size / Dimension: 0.023" L x 0.011" W (0.58mm x 0.29mm)
Composition: Thin Film
Operating Temperature: -55°C ~ 155°C
Number of Terminations: 2
Supplier Device Package: 0201
Height - Seated (Max): 0.011" (0.28mm)
Resistance: 69.8 Ohms

Виробник: TE Connectivity Passive Product
Description: RES SMD 88.7 OHM 0.5% 1/32W 0201
Packaging: Tape & Reel (TR)
Power (Watts): 0.03W, 1/32W
Tolerance: ±0.5%
Package / Case: 0201 (0603 Metric)
Temperature Coefficient: ±25ppm/°C
Size / Dimension: 0.023" L x 0.011" W (0.58mm x 0.29mm)
Composition: Thin Film
Operating Temperature: -55°C ~ 155°C
Number of Terminations: 2
Supplier Device Package: 0201
Height - Seated (Max): 0.011" (0.28mm)
Resistance: 88.7 Ohms

Виробник: Hirose Electric Co Ltd
Description: CONN FFC FPC TOP 28POS 0.5MM R/A
Features: Zero Insertion Force (ZIF)
Packaging: Cut Tape (CT)
Contact Finish: Gold
Voltage Rating: 50V
Mounting Type: Surface Mount, Right Angle
Number of Positions: 28
Pitch: 0.020" (0.50mm)
Operating Temperature: -40°C ~ 85°C
Termination: Solder
Height Above Board: 0.079" (2.00mm)
Locking Feature: Flip Lock
Material Flammability Rating: UL94 V-0
Actuator Material: Polyphenylene Sulfide (PPS)
Contact Material: Phosphor Bronze
FFC, FCB Thickness: 0.30mm
Housing Material: Polyamide (PA), Nylon
Cable End Type: Straight
Flat Flex Type: FFC, FPC
Connector/Contact Type: Contacts, Top
Part Status: Active

Виробник: Hirose Electric Co Ltd
Description: CONN FFC FPC TOP 28POS 0.5MM R/A
Features: Zero Insertion Force (ZIF)
Packaging: Tape & Reel (TR)
Contact Finish: Gold
Voltage Rating: 50V
Mounting Type: Surface Mount, Right Angle
Number of Positions: 28
Pitch: 0.020" (0.50mm)
Operating Temperature: -40°C ~ 85°C
Termination: Solder
Height Above Board: 0.079" (2.00mm)
Locking Feature: Flip Lock
Material Flammability Rating: UL94 V-0
Actuator Material: Polyphenylene Sulfide (PPS)
Contact Material: Phosphor Bronze
FFC, FCB Thickness: 0.30mm
Housing Material: Polyamide (PA), Nylon
Cable End Type: Straight
Flat Flex Type: FFC, FPC
Connector/Contact Type: Contacts, Top
Part Status: Active

Виробник: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 14x12b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 28
DigiKey Programmable: Not Verified

Виробник: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 32LQFP
Packaging: Cut Tape (CT)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 14x12b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 28
DigiKey Programmable: Not Verified

Виробник: HellermannTyton
Description: CBL TIE LOCKING BLK 250LB 2.887'
Packaging: Bag
Color: Black
Mounting Type: Free Hanging (In-Line)
Material: Polyamide (PA66), Nylon 6/6
Tensile Strength: 250 lbs (113.40 kg)
Wire/Cable Tie Type: Standard, Locking
Width: 0.492" (12.50mm)
Bundle Diameter: 10.00" (254.00mm)
Length - Actual: 2.887' (880.00mm)
Length - Approximate: 34.75"

Виробник: Texas Instruments
Description: IC REG BUCK ADJ 3A 20HTSSOP
Packaging: Tube
Package / Case: 20-PowerTSSOP (0.173", 4.40mm Width)
Output Type: Adjustable
Mounting Type: Surface Mount
Number of Outputs: 1
Function: Step-Down
Current - Output: 3A
Operating Temperature: -40°C ~ 125°C (TJ)
Output Configuration: Positive
Frequency - Switching: 350kHz, 550kHz
Voltage - Input (Max): 6V
Topology: Buck
Supplier Device Package: 20-HTSSOP
Synchronous Rectifier: Yes
Voltage - Output (Max): 3.3V
Voltage - Input (Min): 3V
Voltage - Output (Min/Fixed): 0.891V