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Фото | Назва | Виробник | Інформація |
Доступність |
Ціна без ПДВ |
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522-13-169-13-000001 | Mill-Max Manufacturing Corp. |
Description: SKT PGA WRAPOST Features: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 169 (13 x 13) Termination: Wire Wrap Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Alloy |
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522-13-169-13-000001 | Mill-Max | IC & Component Sockets STANDARD WIRE WRAP PGA SOCKET |
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522-13-169-13-000002 | Mill-Max | IC & Component Sockets STANDARD WIRE WRAP PGA SOCKET |
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522-13-169-13-000002 | Mill-Max Manufacturing Corp. |
Description: SKT PGA WRAPOST Features: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 169 (13 x 13) Termination: Wire Wrap Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Alloy |
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522-13-169-13-000003 | Mill-Max | IC & Component Sockets STANDARD WIRE WRAP PGA SOCKET |
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522-13-169-13-000003 | Mill-Max Manufacturing Corp. |
Description: SKT PGA WRAPOST Features: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 169 (13 x 13) Termination: Wire Wrap Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Alloy |
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522-93-169-13-000001 | Mill-Max Manufacturing Corp. |
Description: SKT PGA WRAPOST Features: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 169 (13 x 13) Termination: Wire Wrap Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy |
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522-93-169-13-000001 | Mill-Max | IC & Component Sockets STANDARD WIRE WRAP PGA SOCKET |
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522-93-169-13-000002 | Mill-Max Manufacturing Corp. |
Description: SKT PGA WRAPOST Features: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 169 (13 x 13) Termination: Wire Wrap Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy |
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522-93-169-13-000002 | Mill-Max | IC & Component Sockets STANDARD WIRE WRAP PGA SOCKET |
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522-93-169-13-000003 | Mill-Max Manufacturing Corp. |
Description: SKT PGA WRAPOST Features: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 169 (13 x 13) Termination: Wire Wrap Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy |
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523-13-169-13-000001 | Mill-Max Manufacturing Corp. |
Description: SKT PGA WRAPOST Packaging: Bulk Mounting Type: Through Hole Type: PGA Number of Positions or Pins (Grid): 169 (13 x 13) Termination: Wire Wrap Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) |
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523-13-169-13-000001 | Mill-Max | IC & Component Sockets STANDARD WIRE WRAP PGA SOCKET |
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523-13-169-13-000002 | Mill-Max | IC & Component Sockets STANDARD WIRE WRAP PGA SOCKET |
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523-13-169-13-000002 | Mill-Max Manufacturing Corp. |
Description: SKT PGA WRAPOST Packaging: Bulk Mounting Type: Through Hole Type: PGA Number of Positions or Pins (Grid): 169 (13 x 13) Termination: Wire Wrap Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) |
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523-13-169-13-000003 | Mill-Max Manufacturing Corp. |
Description: SKT PGA WRAPOST Packaging: Bulk Mounting Type: Through Hole Type: PGA Number of Positions or Pins (Grid): 169 (13 x 13) Termination: Wire Wrap Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) |
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523-93-169-13-000001 | Mill-Max Manufacturing Corp. |
Description: SKT PGA WRAPOST Packaging: Bulk Mounting Type: Through Hole Type: PGA Number of Positions or Pins (Grid): 169 (13 x 13) Termination: Wire Wrap Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) |
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523-93-169-13-000002 | Mill-Max | IC & Component Sockets STANDARD WIRE WRAP PGA SOCKET |
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523-93-169-13-000002 | Mill-Max Manufacturing Corp. |
Description: SKT PGA WRAPOST Packaging: Bulk Mounting Type: Through Hole Type: PGA Number of Positions or Pins (Grid): 169 (13 x 13) Termination: Wire Wrap Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) |
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523-93-169-13-000003 | Mill-Max Manufacturing Corp. |
Description: SKT PGA WRAPOST Packaging: Bulk Mounting Type: Through Hole Type: PGA Number of Positions or Pins (Grid): 169 (13 x 13) Termination: Wire Wrap Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) |
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523-93-169-13-000003 | Mill-Max | IC & Component Sockets STANDARD WIRE WRAP PGA SOCKET |
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551-10-169-13-000003 | Mill-Max Manufacturing Corp. |
Description: CONN HDR SOLDRTL Features: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: PGA Number of Positions or Pins (Grid): 169 (13 x 13) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Alloy |
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551-10-169-13-000003 | Mill-Max | Circuit Board Hardware - PCB STANDRD SOLDER TAIL PGA SOCKET |
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551-10-169-13-000004 | Mill-Max | Circuit Board Hardware - PCB STANDRD SOLDER TAIL PGA SOCKET |
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551-10-169-13-000004 | Mill-Max Manufacturing Corp. |
Description: CONN HDR SOLDRTL Packaging: Bulk Mounting Type: Through Hole Type: PGA Number of Positions or Pins (Grid): 169 (13 x 13) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Alloy |
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551-10-169-13-000005 | Mill-Max Manufacturing Corp. |
Description: CONN HDR SOLDRTL Packaging: Bulk Mounting Type: Through Hole Type: PGA Number of Positions or Pins (Grid): 169 (13 x 13) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Alloy |
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551-10-169-13-000005 | Mill-Max | Circuit Board Hardware - PCB STANDRD SOLDER TAIL PGA SOCKET |
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551-90-169-13-000003 | Mill-Max Manufacturing Corp. |
Description: CONN HDR SOLDRTL Features: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: PGA Number of Positions or Pins (Grid): 169 (13 x 13) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin-Lead Contact Finish Thickness - Mating: 200.0µin (5.08µm) Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy |
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551-90-169-13-000003 | Mill-Max | Circuit Board Hardware - PCB STANDRD SOLDER TAIL PGA SOCKET |
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551-90-169-13-000004 | Mill-Max Manufacturing Corp. |
Description: CONN HDR SOLDRTL Packaging: Bulk Mounting Type: Through Hole Type: PGA Number of Positions or Pins (Grid): 169 (13 x 13) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin-Lead Contact Finish Thickness - Mating: 200.0µin (5.08µm) Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy |
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551-90-169-13-000004 | Mill-Max | Circuit Board Hardware - PCB STANDRD SOLDER TAIL PGA SOCKET |
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551-90-169-13-000005 | Mill-Max Manufacturing Corp. |
Description: CONN HDR SOLDRTL Packaging: Bulk Mounting Type: Through Hole Type: PGA Number of Positions or Pins (Grid): 169 (13 x 13) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin-Lead Contact Finish Thickness - Mating: 200.0µin (5.08µm) Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy |
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551-90-169-13-000005 | Mill-Max | Circuit Board Hardware - PCB STANDRD SOLDER TAIL PGA SOCKET |
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614-13-169-13-000001 | Mill-Max Manufacturing Corp. |
Description: SKT CARRIER PGA Features: Carrier, Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 169 (13 x 13) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Alloy |
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614-13-169-13-000001 | Mill-Max | IC & Component Sockets STANDARD RECEPTACLE CARRIER |
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614-13-169-13-000007 | Mill-Max | IC & Component Sockets STANDARD RECEPTACLE CARRIER |
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614-13-169-13-000012 | Mill-Max | IC & Component Sockets STANDARD RECEPTACLE CARRIER |
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614-93-169-13-000001 | Mill-Max | IC & Component Sockets STANDARD RECEPTACLE CARRIER |
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614-93-169-13-000007 | Mill-Max | IC & Component Sockets STANDARD RECEPTACLE CARRIER |
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156913-000 | TE Connectivity | Heat Shrink Molded Boot |
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1875950000 | Weidmüller |
Description: TERM BLK 5P SIDE ENT 3.81MM PCB Packaging: Cut Tape (CT) Color: Black Mounting Type: Through Hole Wire Gauge: 16-24 AWG Pitch: 0.150" (3.81mm) Mating Orientation: Horizontal with Board Positions Per Level: 5 Wire Termination: Screwless - Push Button Clamp Current: 12 A Number of Levels: 1 Voltage: 300 V |
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1875950000 | Weidmüller |
Description: TERM BLK 5P SIDE ENT 3.81MM PCB Packaging: Tape & Reel (TR) Color: Black Mounting Type: Through Hole Wire Gauge: 16-24 AWG Pitch: 0.150" (3.81mm) Mating Orientation: Horizontal with Board Positions Per Level: 5 Wire Termination: Screwless - Push Button Clamp Current: 12 A Number of Levels: 1 Voltage: 300 V |
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1974290000 | Weidmüller |
Description: TERM BLOCK HDR 20POS 3.81MM Features: Mating and Mounting Flange Packaging: Bulk Color: Black Mounting Type: Through Hole Number of Positions: 20 Pitch: 0.150" (3.81mm) Type: Header, Male Pins, Shrouded (4 Side) Operating Temperature: -50°C ~ 120°C Termination Style: Solder Current - IEC: 17.5A Number of Levels: 2 Positions Per Level: 10 Header Orientation: 90°, Right Angle Contact Mating Finish: Tin Current - UL: 10 A Voltage - IEC: 320 V Voltage - UL: 300 V |
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266913-000 | TE Connectivity | Heat Shrink Molded Boot Fluoropolymer Flame Retardant Modified |
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426913-000 | TE Connectivity | Repair Sleeves and End Seals |
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46-9132-13-004-00-0-00-PPTR | W+P Products GmbH | 46-9132-13-004-00-0-00-PPTR |
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46-9132-13-008-00-0-00-PPST | W+P Products GmbH | 46-9132-13-008-00-0-00-PPST |
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510-87-169-13-000101 | Preci-Dip | Pin grid array sockets, standard solder version |
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556913-000 | TE Connectivity | Heat Shrink Tubing |
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MS3456W10SL-3S | ITT Industries | Conn Circular SKT 3 POS Crimp ST Cable Mount 3 Terminal 1 Port |
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MS3456W10SL3P | ITT Industries | Conn Circular PIN 3 POS Crimp ST Cable Mount 3 Terminal 1 Port |
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MS3456W10SL4P | ITT Industries | Conn Circular PIN 2 POS Crimp ST Cable Mount 2 Terminal 1 Port |
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522-13-169-13-000001 |
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA WRAPOST
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 169 (13 x 13)
Termination: Wire Wrap
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Description: SKT PGA WRAPOST
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 169 (13 x 13)
Termination: Wire Wrap
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
товар відсутній
522-13-169-13-000001 |
Виробник: Mill-Max
IC & Component Sockets STANDARD WIRE WRAP PGA SOCKET
IC & Component Sockets STANDARD WIRE WRAP PGA SOCKET
товар відсутній
522-13-169-13-000002 |
Виробник: Mill-Max
IC & Component Sockets STANDARD WIRE WRAP PGA SOCKET
IC & Component Sockets STANDARD WIRE WRAP PGA SOCKET
товар відсутній
522-13-169-13-000002 |
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA WRAPOST
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 169 (13 x 13)
Termination: Wire Wrap
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Description: SKT PGA WRAPOST
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 169 (13 x 13)
Termination: Wire Wrap
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
товар відсутній
522-13-169-13-000003 |
Виробник: Mill-Max
IC & Component Sockets STANDARD WIRE WRAP PGA SOCKET
IC & Component Sockets STANDARD WIRE WRAP PGA SOCKET
товар відсутній
522-13-169-13-000003 |
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA WRAPOST
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 169 (13 x 13)
Termination: Wire Wrap
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Description: SKT PGA WRAPOST
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 169 (13 x 13)
Termination: Wire Wrap
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
товар відсутній
522-93-169-13-000001 |
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA WRAPOST
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 169 (13 x 13)
Termination: Wire Wrap
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Description: SKT PGA WRAPOST
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 169 (13 x 13)
Termination: Wire Wrap
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
товар відсутній
522-93-169-13-000001 |
Виробник: Mill-Max
IC & Component Sockets STANDARD WIRE WRAP PGA SOCKET
IC & Component Sockets STANDARD WIRE WRAP PGA SOCKET
товар відсутній
522-93-169-13-000002 |
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA WRAPOST
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 169 (13 x 13)
Termination: Wire Wrap
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Description: SKT PGA WRAPOST
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 169 (13 x 13)
Termination: Wire Wrap
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
товар відсутній
522-93-169-13-000002 |
Виробник: Mill-Max
IC & Component Sockets STANDARD WIRE WRAP PGA SOCKET
IC & Component Sockets STANDARD WIRE WRAP PGA SOCKET
товар відсутній
522-93-169-13-000003 |
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA WRAPOST
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 169 (13 x 13)
Termination: Wire Wrap
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Description: SKT PGA WRAPOST
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 169 (13 x 13)
Termination: Wire Wrap
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
товар відсутній
523-13-169-13-000001 |
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA WRAPOST
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Number of Positions or Pins (Grid): 169 (13 x 13)
Termination: Wire Wrap
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Description: SKT PGA WRAPOST
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Number of Positions or Pins (Grid): 169 (13 x 13)
Termination: Wire Wrap
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
товар відсутній
523-13-169-13-000001 |
Виробник: Mill-Max
IC & Component Sockets STANDARD WIRE WRAP PGA SOCKET
IC & Component Sockets STANDARD WIRE WRAP PGA SOCKET
товар відсутній
523-13-169-13-000002 |
Виробник: Mill-Max
IC & Component Sockets STANDARD WIRE WRAP PGA SOCKET
IC & Component Sockets STANDARD WIRE WRAP PGA SOCKET
товар відсутній
523-13-169-13-000002 |
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA WRAPOST
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Number of Positions or Pins (Grid): 169 (13 x 13)
Termination: Wire Wrap
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Description: SKT PGA WRAPOST
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Number of Positions or Pins (Grid): 169 (13 x 13)
Termination: Wire Wrap
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
товар відсутній
523-13-169-13-000003 |
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA WRAPOST
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Number of Positions or Pins (Grid): 169 (13 x 13)
Termination: Wire Wrap
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Description: SKT PGA WRAPOST
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Number of Positions or Pins (Grid): 169 (13 x 13)
Termination: Wire Wrap
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
товар відсутній
523-93-169-13-000001 |
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA WRAPOST
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Number of Positions or Pins (Grid): 169 (13 x 13)
Termination: Wire Wrap
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Description: SKT PGA WRAPOST
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Number of Positions or Pins (Grid): 169 (13 x 13)
Termination: Wire Wrap
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
товар відсутній
523-93-169-13-000002 |
Виробник: Mill-Max
IC & Component Sockets STANDARD WIRE WRAP PGA SOCKET
IC & Component Sockets STANDARD WIRE WRAP PGA SOCKET
товар відсутній
523-93-169-13-000002 |
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA WRAPOST
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Number of Positions or Pins (Grid): 169 (13 x 13)
Termination: Wire Wrap
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Description: SKT PGA WRAPOST
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Number of Positions or Pins (Grid): 169 (13 x 13)
Termination: Wire Wrap
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
товар відсутній
523-93-169-13-000003 |
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA WRAPOST
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Number of Positions or Pins (Grid): 169 (13 x 13)
Termination: Wire Wrap
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Description: SKT PGA WRAPOST
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Number of Positions or Pins (Grid): 169 (13 x 13)
Termination: Wire Wrap
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
товар відсутній
523-93-169-13-000003 |
Виробник: Mill-Max
IC & Component Sockets STANDARD WIRE WRAP PGA SOCKET
IC & Component Sockets STANDARD WIRE WRAP PGA SOCKET
товар відсутній
551-10-169-13-000003 |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN HDR SOLDRTL
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Number of Positions or Pins (Grid): 169 (13 x 13)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Description: CONN HDR SOLDRTL
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Number of Positions or Pins (Grid): 169 (13 x 13)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
товар відсутній
551-10-169-13-000003 |
Виробник: Mill-Max
Circuit Board Hardware - PCB STANDRD SOLDER TAIL PGA SOCKET
Circuit Board Hardware - PCB STANDRD SOLDER TAIL PGA SOCKET
товар відсутній
551-10-169-13-000004 |
Виробник: Mill-Max
Circuit Board Hardware - PCB STANDRD SOLDER TAIL PGA SOCKET
Circuit Board Hardware - PCB STANDRD SOLDER TAIL PGA SOCKET
товар відсутній
551-10-169-13-000004 |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN HDR SOLDRTL
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Number of Positions or Pins (Grid): 169 (13 x 13)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Description: CONN HDR SOLDRTL
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Number of Positions or Pins (Grid): 169 (13 x 13)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
товар відсутній
551-10-169-13-000005 |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN HDR SOLDRTL
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Number of Positions or Pins (Grid): 169 (13 x 13)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Description: CONN HDR SOLDRTL
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Number of Positions or Pins (Grid): 169 (13 x 13)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
товар відсутній
551-10-169-13-000005 |
Виробник: Mill-Max
Circuit Board Hardware - PCB STANDRD SOLDER TAIL PGA SOCKET
Circuit Board Hardware - PCB STANDRD SOLDER TAIL PGA SOCKET
товар відсутній
551-90-169-13-000003 |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN HDR SOLDRTL
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Number of Positions or Pins (Grid): 169 (13 x 13)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin-Lead
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Description: CONN HDR SOLDRTL
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Number of Positions or Pins (Grid): 169 (13 x 13)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin-Lead
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
товар відсутній
551-90-169-13-000003 |
Виробник: Mill-Max
Circuit Board Hardware - PCB STANDRD SOLDER TAIL PGA SOCKET
Circuit Board Hardware - PCB STANDRD SOLDER TAIL PGA SOCKET
товар відсутній
551-90-169-13-000004 |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN HDR SOLDRTL
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Number of Positions or Pins (Grid): 169 (13 x 13)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin-Lead
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Description: CONN HDR SOLDRTL
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Number of Positions or Pins (Grid): 169 (13 x 13)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin-Lead
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
товар відсутній
551-90-169-13-000004 |
Виробник: Mill-Max
Circuit Board Hardware - PCB STANDRD SOLDER TAIL PGA SOCKET
Circuit Board Hardware - PCB STANDRD SOLDER TAIL PGA SOCKET
товар відсутній
551-90-169-13-000005 |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN HDR SOLDRTL
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Number of Positions or Pins (Grid): 169 (13 x 13)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin-Lead
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Description: CONN HDR SOLDRTL
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Number of Positions or Pins (Grid): 169 (13 x 13)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin-Lead
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
товар відсутній
551-90-169-13-000005 |
Виробник: Mill-Max
Circuit Board Hardware - PCB STANDRD SOLDER TAIL PGA SOCKET
Circuit Board Hardware - PCB STANDRD SOLDER TAIL PGA SOCKET
товар відсутній
614-13-169-13-000001 |
Виробник: Mill-Max Manufacturing Corp.
Description: SKT CARRIER PGA
Features: Carrier, Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 169 (13 x 13)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Description: SKT CARRIER PGA
Features: Carrier, Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 169 (13 x 13)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
товар відсутній
614-13-169-13-000001 |
Виробник: Mill-Max
IC & Component Sockets STANDARD RECEPTACLE CARRIER
IC & Component Sockets STANDARD RECEPTACLE CARRIER
товар відсутній
614-13-169-13-000007 |
Виробник: Mill-Max
IC & Component Sockets STANDARD RECEPTACLE CARRIER
IC & Component Sockets STANDARD RECEPTACLE CARRIER
товар відсутній
614-13-169-13-000012 |
Виробник: Mill-Max
IC & Component Sockets STANDARD RECEPTACLE CARRIER
IC & Component Sockets STANDARD RECEPTACLE CARRIER
товар відсутній
614-93-169-13-000001 |
Виробник: Mill-Max
IC & Component Sockets STANDARD RECEPTACLE CARRIER
IC & Component Sockets STANDARD RECEPTACLE CARRIER
товар відсутній
614-93-169-13-000007 |
Виробник: Mill-Max
IC & Component Sockets STANDARD RECEPTACLE CARRIER
IC & Component Sockets STANDARD RECEPTACLE CARRIER
товар відсутній
1875950000 |
Виробник: Weidmüller
Description: TERM BLK 5P SIDE ENT 3.81MM PCB
Packaging: Cut Tape (CT)
Color: Black
Mounting Type: Through Hole
Wire Gauge: 16-24 AWG
Pitch: 0.150" (3.81mm)
Mating Orientation: Horizontal with Board
Positions Per Level: 5
Wire Termination: Screwless - Push Button Clamp
Current: 12 A
Number of Levels: 1
Voltage: 300 V
Description: TERM BLK 5P SIDE ENT 3.81MM PCB
Packaging: Cut Tape (CT)
Color: Black
Mounting Type: Through Hole
Wire Gauge: 16-24 AWG
Pitch: 0.150" (3.81mm)
Mating Orientation: Horizontal with Board
Positions Per Level: 5
Wire Termination: Screwless - Push Button Clamp
Current: 12 A
Number of Levels: 1
Voltage: 300 V
товар відсутній
1875950000 |
Виробник: Weidmüller
Description: TERM BLK 5P SIDE ENT 3.81MM PCB
Packaging: Tape & Reel (TR)
Color: Black
Mounting Type: Through Hole
Wire Gauge: 16-24 AWG
Pitch: 0.150" (3.81mm)
Mating Orientation: Horizontal with Board
Positions Per Level: 5
Wire Termination: Screwless - Push Button Clamp
Current: 12 A
Number of Levels: 1
Voltage: 300 V
Description: TERM BLK 5P SIDE ENT 3.81MM PCB
Packaging: Tape & Reel (TR)
Color: Black
Mounting Type: Through Hole
Wire Gauge: 16-24 AWG
Pitch: 0.150" (3.81mm)
Mating Orientation: Horizontal with Board
Positions Per Level: 5
Wire Termination: Screwless - Push Button Clamp
Current: 12 A
Number of Levels: 1
Voltage: 300 V
товар відсутній
1974290000 |
Виробник: Weidmüller
Description: TERM BLOCK HDR 20POS 3.81MM
Features: Mating and Mounting Flange
Packaging: Bulk
Color: Black
Mounting Type: Through Hole
Number of Positions: 20
Pitch: 0.150" (3.81mm)
Type: Header, Male Pins, Shrouded (4 Side)
Operating Temperature: -50°C ~ 120°C
Termination Style: Solder
Current - IEC: 17.5A
Number of Levels: 2
Positions Per Level: 10
Header Orientation: 90°, Right Angle
Contact Mating Finish: Tin
Current - UL: 10 A
Voltage - IEC: 320 V
Voltage - UL: 300 V
Description: TERM BLOCK HDR 20POS 3.81MM
Features: Mating and Mounting Flange
Packaging: Bulk
Color: Black
Mounting Type: Through Hole
Number of Positions: 20
Pitch: 0.150" (3.81mm)
Type: Header, Male Pins, Shrouded (4 Side)
Operating Temperature: -50°C ~ 120°C
Termination Style: Solder
Current - IEC: 17.5A
Number of Levels: 2
Positions Per Level: 10
Header Orientation: 90°, Right Angle
Contact Mating Finish: Tin
Current - UL: 10 A
Voltage - IEC: 320 V
Voltage - UL: 300 V
товар відсутній
266913-000 |
Виробник: TE Connectivity
Heat Shrink Molded Boot Fluoropolymer Flame Retardant Modified
Heat Shrink Molded Boot Fluoropolymer Flame Retardant Modified
товар відсутній
510-87-169-13-000101 |
Виробник: Preci-Dip
Pin grid array sockets, standard solder version
Pin grid array sockets, standard solder version
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MS3456W10SL-3S |
Виробник: ITT Industries
Conn Circular SKT 3 POS Crimp ST Cable Mount 3 Terminal 1 Port
Conn Circular SKT 3 POS Crimp ST Cable Mount 3 Terminal 1 Port
товар відсутній
MS3456W10SL3P |
Виробник: ITT Industries
Conn Circular PIN 3 POS Crimp ST Cable Mount 3 Terminal 1 Port
Conn Circular PIN 3 POS Crimp ST Cable Mount 3 Terminal 1 Port
товар відсутній
MS3456W10SL4P |
Виробник: ITT Industries
Conn Circular PIN 2 POS Crimp ST Cable Mount 2 Terminal 1 Port
Conn Circular PIN 2 POS Crimp ST Cable Mount 2 Terminal 1 Port
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