Виробник: TE Connectivity
SMD Current Sense Metal Chip Resistor

Виробник: TE Connectivity
Res Metal Foil 2010 0.039 Ohm 1% 0.75W(3/4W) ±50ppm/C Pad SMD T/R

Виробник: TE Connectivity
SMD Current Sense Metal Chip Resistor

Виробник: TE Connectivity
Conn Rectangular SKT 16 POS 5mm Solder ST Thru-Hole 16 Terminal 1 Port Tray

Виробник: TE Connectivity
Conn Rectangular SKT 16 POS 5mm Solder ST Thru-Hole 16 Terminal 1 Port Tray

Виробник: TE Connectivity
SMD Current Sense Metal Chip Resistor

Виробник: TE Connectivity
SMD Current Sense Metal Chip Resistor

Виробник: TE Connectivity
Res Metal Foil 2010 0.015 Ohm 5% 0.75W(3/4W) ±100ppm/C Pad SMD T/R

Виробник: TE Connectivity
SMD Current Sense Metal Chip Resistor

Виробник: TE Connectivity
SMD Current Sense Metal Chip Resistor

Виробник: TE Connectivity
2176157-9

Виробник: TE Connectivity
Res Metal Foil 2010 0.056 Ohm 1% 0.75W(3/4W) ±50ppm/C Pad SMD T/R

Виробник: TE Connectivity
Res Metal Foil 2010 0.062 Ohm 1% 0.75W(3/4W) ±50ppm/C Pad SMD T/R

Виробник: TE Connectivity
Res Metal Foil 2010 0.075 Ohm 1% 0.75W(3/4W) ±50ppm/C Pad SMD T/R

Виробник: TE Connectivity
Res Metal Foil 2010 0.091 Ohm 1% 0.75W(3/4W) ±50ppm/C Pad SMD T/R

Виробник: TE Connectivity
Res Metal Foil 2010 0.1 Ohm 1% 0.75W(3/4W) ±50ppm/C Pad SMD T/R

Виробник: Vicor
WX4-7615752-2-EL

Виробник: Vicor
WX4-7615754-2

Виробник: Vicor
WX4-7615755-MC

Виробник: Vicor
WX4-7615756-MC

Виробник: Vicor
WX4-7615757-MC

Виробник: Harting
Conn D-Subminiature F 9 POS 2.74mm Solder RA Thru-Hole 9 Terminal 1 Port

Виробник: Harting
Conn D-Subminiature F 9 POS 2.74mm Solder RA Thru-Hole 9 Terminal 1 Port

Виробник: Harting
Conn D-Subminiature PIN 15 POS Solder Cup ST Panel Mount 15 Terminal 1 Port

Виробник: Harting
Conn D-Subminiature M 15 POS Solder Bucket ST Panel Mount 15 Terminal 1 Port

Виробник: Harting
Conn D-Subminiature M 15 POS Solder Cup ST Panel Mount 15 Terminal 1 Port

Виробник: TE Application Tooling
Description: EXTRACTION TOOL
Packaging: Box
For Use With/Related Products: Rectangular Contacts
Tool Type: Extraction Tool

Виробник: TE Application Tooling
Description: EXTRACTION TOOL
Packaging: Box
For Use With/Related Products: Rectangular Contacts
Tool Type: Extraction Tool
Part Status: Active

Виробник: TE Application Tooling
Description: EXTRACTION TOOL
Packaging: Box
For Use With/Related Products: Rectangular Contacts, 20-30 AWG
Tool Type: Extraction Tool

Виробник: TE Application Tooling
Description: LOCKING TOOL
Packaging: Box
For Use With/Related Products: Rectangular Contacts
Tool Type: Extraction Tool

Виробник: EPCOS - TDK Electronics
Description: GDT 350V 10KA 2 POLE
Packaging: Bulk
Tolerance: ±20%
Package / Case: Cylinder No Lead
Mounting Type: User Defined
Voltage - DC Spark Over (Nom): 350 V
Impulse Discharge Current (8/20µs): 10000A (10kA)
Fail Short: No
Number of Poles: 2

Виробник: Bridgelux
Description: LED COB VERO SE 18 WHT RND 5000K
Packaging: Tray
Color: White, Cool
Size / Dimension: 36.20mm Dia
Type: Chip On Board (COB)
Configuration: Round
Voltage - Forward (Vf) (Typ): 28.3V
Height: 3.60mm
Current - Test: 1.05A
Viewing Angle: 120°
Lens Type: Flat
Current - Max: 2.1A
Lumens/Watt @ Current - Test: 151 lm/W
CCT (K): 5000K 4-Step MacAdam Ellipse
CRI (Color Rendering Index): 80
Light Emitting Surface (LES): 18.40mm Dia
Temperature - Test: 85°C
Luminous Flux @ Current/Temperature: 4477lm (Typ)

Виробник: Samsung Electro-Mechanics
Description: CAP CER 4700PF 25V X7R 0402
Tolerance: ±10%
Packaging: Cut Tape (CT)
Voltage - Rated: 25V
Package / Case: 0402 (1005 Metric)
Temperature Coefficient: X7R
Size / Dimension: 0.039" L x 0.020" W (1.00mm x 0.50mm)
Mounting Type: Surface Mount, MLCC
Operating Temperature: -55°C ~ 125°C
Applications: General Purpose
Thickness (Max): 0.022" (0.55mm)
Capacitance: 4700 pF

Виробник: Samsung Electro-Mechanics
Description: CAP CER 4700PF 25V X7R 0402
Tolerance: ±10%
Packaging: Tape & Reel (TR)
Voltage - Rated: 25V
Package / Case: 0402 (1005 Metric)
Temperature Coefficient: X7R
Size / Dimension: 0.039" L x 0.020" W (1.00mm x 0.50mm)
Mounting Type: Surface Mount, MLCC
Operating Temperature: -55°C ~ 125°C
Applications: General Purpose
Thickness (Max): 0.022" (0.55mm)
Capacitance: 4700 pF

Виробник: Samsung Electro-Mechanics
Description: CAP CER 4700PF 25V X7R 0402
Tolerance: ±10%
Packaging: Cut Tape (CT)
Voltage - Rated: 25V
Package / Case: 0402 (1005 Metric)
Temperature Coefficient: X7R
Size / Dimension: 0.039" L x 0.020" W (1.00mm x 0.50mm)
Mounting Type: Surface Mount, MLCC
Operating Temperature: -55°C ~ 125°C
Applications: General Purpose
Thickness (Max): 0.022" (0.55mm)
Capacitance: 4700 pF

Виробник: Samsung Electro-Mechanics
Description: CAP CER 4700PF 25V X7R 0402
Tolerance: ±10%
Packaging: Tape & Reel (TR)
Voltage - Rated: 25V
Package / Case: 0402 (1005 Metric)
Temperature Coefficient: X7R
Size / Dimension: 0.039" L x 0.020" W (1.00mm x 0.50mm)
Mounting Type: Surface Mount, MLCC
Operating Temperature: -55°C ~ 125°C
Applications: General Purpose
Thickness (Max): 0.022" (0.55mm)
Capacitance: 4700 pF

Виробник: Samsung Electro-Mechanics
Description: CAP CER 0.047UF 10V X7R 0402
Packaging: Cut Tape (CT)
Tolerance: ±10%
Voltage - Rated: 10V
Package / Case: 0402 (1005 Metric)
Temperature Coefficient: X7R
Size / Dimension: 0.039" L x 0.020" W (1.00mm x 0.50mm)
Mounting Type: Surface Mount, MLCC
Operating Temperature: -55°C ~ 125°C
Applications: General Purpose
Thickness (Max): 0.022" (0.55mm)
Capacitance: 0.047 µF

Виробник: Samsung Electro-Mechanics
Description: CAP CER 0.047UF 10V X7R 0402
Packaging: Tape & Reel (TR)
Tolerance: ±10%
Voltage - Rated: 10V
Package / Case: 0402 (1005 Metric)
Temperature Coefficient: X7R
Size / Dimension: 0.039" L x 0.020" W (1.00mm x 0.50mm)
Mounting Type: Surface Mount, MLCC
Operating Temperature: -55°C ~ 125°C
Applications: General Purpose
Thickness (Max): 0.022" (0.55mm)
Capacitance: 0.047 µF

Виробник: NXP USA Inc.
Description: IC MCU 16/32B 512KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 16x10b SAR; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 47
DigiKey Programmable: Not Verified

Виробник: NXP Semiconductors
MCU 16-bit/32-bit ARM7TDMI-S RISC 512KB Flash 3.3V 64-Pin LQFP Tray

Виробник: Phoenix Contact
PCB headers, nominal current 8 A, rated voltage (III/2) 160 V, number of positions 9, pitch 3.81 mm, color gray, contact surface Tin, mounting Wave soldering

Виробник: Nexperia USA Inc.
Description: DIODE ZENER 3.3V 500MW ALF2
Packaging: Tape & Box (TB)
Tolerance: ±3%
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C
Voltage - Zener (Nom) (Vz): 3.3 V
Impedance (Max) (Zzt): 100 Ohms
Supplier Device Package: ALF2
Part Status: Active
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 200 mA
Current - Reverse Leakage @ Vr: 5 µA @ 1 V

Виробник: NEXPERIA
Trans Digital BJT NPN/PNP 20V 1.8A 760mW Automotive 6-Pin TSOP T/R

Виробник: NEXPERIA
Next Power 100 V, 5.5 mOhm N-Channel MOSFET

Виробник: TE Connectivity Passive Product
Description: RES SMD 113 OHM 0.1% 1/10W 0805
Power (Watts): 0.1W, 1/10W
Tolerance: ±0.1%
Packaging: Tape & Reel (TR)
Package / Case: 0805 (2012 Metric)
Temperature Coefficient: ±10ppm/°C
Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
Composition: Thin Film
Operating Temperature: -55°C ~ 155°C
Number of Terminations: 2
Supplier Device Package: 0805
Height - Seated (Max): 0.026" (0.65mm)
Part Status: Active
Resistance: 113 Ohms

Виробник: TE Connectivity Passive Product
Description: RES 0.011 OHM 1% 3/4W 2010
Power (Watts): 0.75W, 3/4W
Tolerance: ±1%
Features: Current Sense
Packaging: Tape & Reel (TR)
Package / Case: 2010 (5025 Metric)
Temperature Coefficient: ±100ppm/°C
Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
Composition: Metal Foil
Operating Temperature: -55°C ~ 155°C
Number of Terminations: 2
Supplier Device Package: 2010
Height - Seated (Max): 0.029" (0.73mm)
Resistance: 11 mOhms

Виробник: TE Connectivity Passive Product
Description: RES 0.013 OHM 1% 3/4W 2010
Power (Watts): 0.75W, 3/4W
Tolerance: ±1%
Features: Current Sense
Packaging: Tape & Reel (TR)
Package / Case: 2010 (5025 Metric)
Temperature Coefficient: ±100ppm/°C
Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
Composition: Metal Foil
Operating Temperature: -55°C ~ 155°C
Number of Terminations: 2
Supplier Device Package: 2010
Height - Seated (Max): 0.029" (0.73mm)
Resistance: 13 mOhms

Виробник: TE Connectivity Passive Product
Description: RES 0.018 OHM 5% 3/4W 2010
Packaging: Tape & Reel (TR)
Power (Watts): 0.75W, 3/4W
Tolerance: ±5%
Features: Current Sense
Package / Case: 2010 (5025 Metric)
Temperature Coefficient: ±100ppm/°C
Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
Composition: Metal Foil
Operating Temperature: -55°C ~ 155°C
Number of Terminations: 2
Supplier Device Package: 2010
Height - Seated (Max): 0.029" (0.73mm)
Part Status: Active
Resistance: 18 mOhms

Виробник: TE Connectivity Passive Product
Description: RES 0.027 OHM 5% 3/4W 2010
Power (Watts): 0.75W, 3/4W
Tolerance: ±5%
Features: Current Sense
Packaging: Tape & Reel (TR)
Package / Case: 2010 (5025 Metric)
Temperature Coefficient: ±100ppm/°C
Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
Composition: Metal Foil
Operating Temperature: -55°C ~ 155°C
Number of Terminations: 2
Supplier Device Package: 2010
Height - Seated (Max): 0.029" (0.73mm)
Part Status: Active
Resistance: 27 mOhms

Виробник: Taiyo Yuden
Description: CAP CER 22UF 25V X5R 1210
Packaging: Tape & Reel (TR)
Tolerance: ±10%
Voltage - Rated: 25V
Package / Case: 1210 (3225 Metric)
Temperature Coefficient: X5R
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount, MLCC
Operating Temperature: -55°C ~ 85°C
Applications: SMPS Filtering
Thickness (Max): 0.106" (2.70mm)
Part Status: Not For New Designs
Capacitance: 22 µF