Виробник: 3M Electronic Specialty
Heat Shrink Tubing & Sleeves 2.5:1Thin Wall+Adhsv 1, 48" Black

Виробник: 3M
Description: HEATSHRINK MULTI WALL 1/2-48" BL
Features: Adhesive Lined
Packaging: 75 per Pkg
Color: Black
Material: Polyolefin (PO)
Length: 4.00' (1.22m)
Type: Tubing, Semi Rigid
Operating Temperature: -55°C ~ 110°C
Shrinkage Ratio: 2.5 to 1
Inner Diameter - Supplied: 0.500" (12.70mm)
Inner Diameter - Recovered: 0.195" (4.95mm)
Recovered Wall Thickness: 0.055" (1.40mm)
Shrink Temperature: 135°C
Part Status: Active
Storage/Refrigeration Temperature: 50°F ~ 80°F (10°C ~ 27°C)
Shelf Life: 120 Months

Виробник: 3M
Description: HEATSHRINK MULTI WALL 1/4-48" BL
Packaging: Bulk
Color: Black
Material: Polyolefin (PO)
Length: 4.00' (1.22m)
Type: Tubing, Semi Rigid
Operating Temperature: -55°C ~ 110°C
Shrinkage Ratio: 2.5 to 1
Inner Diameter - Supplied: 0.250" (6.35mm)
Inner Diameter - Recovered: 0.080" (2.03mm)
Recovered Wall Thickness: 0.047" (1.19mm)
Shrink Temperature: 135°C
Part Status: Active
Storage/Refrigeration Temperature: 50°F ~ 80°F (10°C ~ 27°C)
Shelf Life: 120 Months
Features: Adhesive Lined, Chemical Resistant, Solvent Resistant

Виробник: 3M Electronic Specialty
Heat Shrink Tubing & Sleeves 2.5:1Thin Wall+Adhsv 1/4, 48" Black

Виробник: 3M
Description: HEATSHRINK MULTI WALL 1/8-48" BL
Packaging: Bulk
Color: Black
Material: Polyolefin (PO)
Length: 4.00' (1.22m)
Type: Tubing, Semi Rigid
Operating Temperature: -55°C ~ 110°C
Shrinkage Ratio: 2.5 to 1
Inner Diameter - Supplied: 0.125" (3.18mm)
Inner Diameter - Recovered: 0.023" (0.58mm)
Recovered Wall Thickness: 0.038" (0.97mm)
Shrink Temperature: 135°C
Part Status: Active
Storage/Refrigeration Temperature: 50°F ~ 80°F (10°C ~ 27°C)
Shelf Life: 120 Months
Features: Adhesive Lined, Chemical Resistant, Solvent Resistant

Виробник: 3M
Description: HEATSHRINK MULTI WALL 3/16-48" B
Features: Adhesive Lined, Chemical Resistant, Solvent Resistant
Packaging: Bulk
Color: Black
Material: Polyolefin (PO)
Length: 4.00' (1.22m)
Type: Tubing, Semi Rigid
Operating Temperature: -55°C ~ 110°C
Shrinkage Ratio: 2.5 to 1
Inner Diameter - Supplied: 0.187" (4.75mm)
Inner Diameter - Recovered: 0.060" (1.52mm)
Recovered Wall Thickness: 0.043" (1.09mm)
Shrink Temperature: 135°C
Part Status: Active
Storage/Refrigeration Temperature: 50°F ~ 80°F (10°C ~ 27°C)
Shelf Life: 120 Months

Виробник: 3M Electronic Specialty
Heat Shrink Tubing & Sleeves 2.5:1Thin Wall+Adhsv 3/16, 48" Black

Виробник: NXP Semiconductors
Analog Switch Single SPST 6-Pin XSON T/R

Виробник: NXP USA Inc.
Description: IC SW SPST-NCX1 750MOHM 6XSON
Packaging: Tape & Reel (TR)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 6pC
Switch Circuit: SPST - NC
Multiplexer/Demultiplexer Circuit: 1:1
Switch Time (Ton, Toff) (Max): 24ns, 7ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Number of Circuits: 1

Виробник: NXP USA Inc.
Description: IC SW SPST-NCX1 750MOHM 6XSON
Packaging: Tape & Reel (TR)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 6pC
Switch Circuit: SPST - NC
Multiplexer/Demultiplexer Circuit: 1:1
Switch Time (Ton, Toff) (Max): 24ns, 7ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Number of Circuits: 1

Виробник: NXP Semiconductors
Analog Switch Single SPST 6-Pin XSON T/R

Виробник: Industrial Fiber Optics
Description: CBL FIBER OPTIC 250UM 1000M
Packaging: Bag
Length: 3281' (1000.0m)
Jacket (Insulation) Material: Polyethylene (PE)
Tensile Strength: 0.4kg
Jacket (Insulation) Diameter: 0.039" (0.99mm)
Jacket Color: Black
Refractive Index - Core: 1.49
Core Diameter: 240µm
Cladding Diameter: 250µm
Part Status: Active

Виробник: Texas Instruments
Description: IC GATE NAND 4CH 2-INP 14SOIC
Packaging: Cut Tape (CT)
Features: Open Collector
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: -, 8mA
Number of Inputs: 2
Supplier Device Package: 14-SOIC
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 50ns @ 5V, 50pF
Number of Circuits: 4

Виробник: Texas Instruments
Description: IC GATE NAND 4CH 2-INP 14SOIC
Features: Open Collector
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: -, 8mA
Number of Inputs: 2
Supplier Device Package: 14-SOIC
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 50ns @ 5V, 50pF
Number of Circuits: 4

Виробник: Texas Instruments
Description: IC TXRX NON-INVERT 3.6V 56SSOP
Packaging: Cut Tape (CT)
Package / Case: 56-BSSOP (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Transceiver, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 3.6V
Number of Bits per Element: 8
Current - Output High, Low: 24mA, 24mA
Supplier Device Package: 56-SSOP

Виробник: Texas Instruments
Description: IC TXRX NON-INVERT 3.6V 56SSOP
Packaging: Tape & Reel (TR)
Package / Case: 56-BSSOP (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Transceiver, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 3.6V
Number of Bits per Element: 8
Current - Output High, Low: 24mA, 24mA
Supplier Device Package: 56-SSOP