Результат пошуку "Sn62Pb36AG2" : 117
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| Фото | Назва | Виробник | Інформація |
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Дрітовий припій зі сріблом Sn62Pb36Ag2 1мм 10г Флюс: F-SW26; 2,5% (LC63S1) Код товару: 182418 |
Паяльне обладнання, витратні матеріали для пайки > Припої, паяльні пасти Категорія: Припій з флюсом Опис: Припій для м'якої пайки з флюсом. Припій: Sn63Pb36Ag2; дріт; 1,0мм; 0,01кг; флюс: F-SW26; 2,5%, температура плавлення:183 ° С Вага/Об’єм/К-сть: 10 g Діаметр: 1 mm Склад сплаву: Sn63Pb36Ag2 Температура плавлення: 183°C Вид припоя: Свинцевий |
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Припій W62AG2K1503A -SOLDERINDO Припой Sn62/Pb36/Ag2, с флюсом SD-82-1,5% (ROL1), 0,3 мм, 100 г Код товару: 115154 |
Паяльне обладнання, витратні матеріали для пайки > Припої, паяльні пасти Категорія: Припой |
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EXB-SN62PB36AG2 | Chip Quik Inc. |
 Description: SOLDER BAR SN62/PB36/AG2 1LB (45Packaging: Bulk Composition: Sn62Pb36Ag2 (62/36/2) Type: Bar Solder Melting Point: 354°F (179°C) Form: Bar, 1 lb (454g) Process: Leaded Part Status: Active |
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SMD-SC-SN62PB36AG2-0.031-1oz | Chip Quik Inc. |
Description: SN62/PB36/AG2 .031" SOLDER WIRE Packaging: Bulk Diameter: 0.031" (0.79mm) Composition: Sn62Pb36Ag2 (62/36/2) Type: Wire Solder Melting Point: 354°F (179°C) Form: Spool Process: Leaded Shelf Life: 60 Months |
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ESN62PB36AG/8 прострочено, вийшов термін придатності Код товару: 104195 |
AG TermoPasty |
Паяльне обладнання, витратні матеріали для пайки > Припої, паяльні пасти Категорія: Припій з додаванням срібла Опис: Припій; Sn62Pb36Ag2; паста; шприц; 8г; 2,5мл; флюс: No Clean; 15% Вага/Об’єм/К-сть: 8 g Склад сплаву: Sn62Pb36Ag2 Вид припоя: Свинцевий |
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| 04-7150-0000 | Kester |
Solder SN62PB36AG02 E-BAR 1 2/3 LB |
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22-7150-8802 | Kester Solder |
Description: SOLDER FLUX-CORED/245 .031" 2LB Packaging: Bulk Diameter: 0.031" (0.79mm) Wire Gauge: 20 AWG, 22 SWG Composition: Sn62Pb36Ag2 (62/36/2) Type: Wire Solder Melting Point: 354°F (179°C) Form: Spool, 2 lbs (907.19g) Process: Leaded Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C) |
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22-7150-8802 | Kester |
Solder Sn62Pb36Ag2 3.3/245 WIRE .031 2 LB SPL |
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24-7150-0010 | Kester |
Solder Sn62Pb36Ag2 3.3%/44 .020 1LB SPL WIRE |
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24-7150-0010 | Kester Solder |
Description: SOLDER FLUX-CORED/44 .020" 1LB S Packaging: Bulk Diameter: 0.020" (0.51mm) Wire Gauge: 24 AWG, 25 SWG Composition: Sn62Pb36Ag2 (62/36/2) Type: Wire Solder Melting Point: 354°F (179°C) Form: Spool, 1 lb (454 g) Process: Leaded Flux Type: Rosin Activated (RA) Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C) |
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24-7150-0018 | Kester Solder |
Description: SOLDER RA FLUX 22AWG 62/36/2 1LB Packaging: Spool Diameter: 0.025" (0.64mm) Wire Gauge: 22 AWG, 23 SWG Composition: Sn62Pb36Ag2 (62/36/2) Type: Wire Solder Melting Point: 361°F (183°C) Form: Spool, 1 lb (454 g) Process: Leaded Flux Type: Rosin Activated (RA) Part Status: Active Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C) |
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24-7150-0027 | Kester Solder |
Description: SOLDER FLUX-CORED/44 .031" 1LB S Packaging: Bulk Diameter: 0.031" (0.79mm) Wire Gauge: 20 AWG, 22 SWG Composition: Sn62Pb36Ag2 (62/36/2) Type: Wire Solder Melting Point: 354°F (179°C) Form: Spool, 1 lb (454 g) Process: Leaded Flux Type: Rosin Activated (RA) Part Status: Active Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C) |
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24-7150-0027 | Kester |
Solder Sn62Pb36Ag2 3.3%/44 .031 1LB SPL WIRE |
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24-7150-0053 | Kester |
Solder 62/36/2 .050 DIA. 1LB SPOOL |
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| 24-7150-8800 | Kester |
Solder 62/36/2 .031 DIA. 1LB SPOOL |
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24-7150-8801 | Kester |
Solder Sn62Pb36Ag2 2.2%/245 .031 1LB SPL WIRE |
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24-7150-8801 | Kester Solder |
Description: SOLDER FLUX-CORED/245 .031" 1LB Packaging: Bulk Diameter: 0.031" (0.79mm) Wire Gauge: 20 AWG, 22 SWG Composition: Sn62Pb36Ag2 (62/36/2) Type: Wire Solder Melting Point: 354°F (179°C) Form: Spool, 1 lb (454 g) Process: Leaded Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C) |
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24-7150-8802 | Kester |
Solder Sn62Pb36Ag2 3.3%/245 .031 1LB SPL WIRE |
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24-7150-8802 | Kester Solder |
Description: SOLDER FLUX-CORED/245 .031" 1LB Packaging: Bulk Diameter: 0.031" (0.79mm) Wire Gauge: 20 AWG, 22 SWG Composition: Sn62Pb36Ag2 (62/36/2) Type: Wire Solder Melting Point: 354°F (179°C) Form: Spool, 1 lb (454 g) Process: Leaded Flux Type: No-Clean Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C) |
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24-7150-8806 | Kester Solder |
Description: SOLDER FLUX-CORED/245 .015" 1LB Packaging: Bulk Diameter: 0.015" (0.38mm) Wire Gauge: 27 AWG, 28 SWG Composition: Sn62Pb36Ag2 (62/36/2) Type: Wire Solder Melting Point: 354°F (179°C) Form: Spool, 1 lb (454 g) Process: Leaded Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C) |
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24-7150-8806 | Kester |
Solder Sn62Pb36Ag2 1.1%/245 .015 1LB SPL WIRE |
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24-7150-8809 | Kester Solder |
Description: SOLDER FLUX-CORED/245 .025" 1LB Packaging: Bulk Diameter: 0.025" (0.64mm) Wire Gauge: 22 AWG, 23 SWG Composition: Sn62Pb36Ag2 (62/36/2) Type: Wire Solder Melting Point: 354°F (179°C) Form: Spool, 1 lb (454 g) Process: Leaded Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C) |
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24-7150-8809 | Kester |
Solder Sn62Pb36Ag2 1.1%/245 .025 1LB SPL WIRE |
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24-7150-8814 | Kester |
Solder Sn62Pb36Ag2 1.1%/245 .050 1LB SPL WIRE |
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24-7150-8814 | Kester Solder |
Description: SOLDER FLUX-CORED/245 .050 1LB S Packaging: Bulk Diameter: 0.050" (1.27mm) Wire Gauge: 16 AWG, 18 SWG Composition: Sn62Pb36Ag2 (62/36/2) Type: Wire Solder Melting Point: 354°F (179°C) Form: Spool, 1 lb (454 g) Process: Leaded Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C) |
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24-7150-8834 | Kester Solder |
Description: SOLDER FLUX-CORED/245 .020 1LB S Packaging: Bulk Diameter: 0.020" (0.51mm) Wire Gauge: 24 AWG, 25 SWG Composition: Sn62Pb36Ag2 (62/36/2) Type: Wire Solder Melting Point: 354°F (179°C) Form: Spool, 1 lb (454 g) Process: Leaded Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C) |
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24-7150-8834 | Kester |
Solder Sn62Pb36Ag2 2.2%/245 .020 1LB SPL WIRE |
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24-7150-8842 | Kester |
Solder Sn62Pb36Ag2 3.3%/245 .025 1LB SPL WIRE |
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24-7150-9702 | Kester |
Solder Sn62Pb36Ag2 3.3%/285 .020 1LB SPL WIRE |
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| 24-7150-9703 | Kester |
Solder 285 .015 DIA. 1LB SPOOL |
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24-7150-9710 | Kester |
Solder Sn62Pb36Ag2 3.3%/285 .031 1LB SPL WIRE |
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24-7150-9727 | Kester |
Solder Sn62Pb36Ag2 2.2%/285 .015 1LB SPL WIRE |
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29-7150-8808 | Kester |
Solder Sn62Pb36Ag2 3.3/245 WIRE .020 3 LB SPL |
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29-7150-8808 | Kester Solder |
Description: SOLDER FLUX-CORED/245 .020 3LB S Packaging: Bulk Diameter: 0.020" (0.51mm) Wire Gauge: 24 AWG, 25 SWG Composition: Sn62Pb36Ag2 (62/36/2) Type: Wire Solder Melting Point: 354°F (179°C) Form: Spool, 3 lbs (1.36kg) Process: Leaded Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C) |
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| 44-7150-0000 | Kester Solder |
Description: SOLDER BAR E-BAR 1.66LB Packaging: Bulk Composition: Sn62Pb36Ag2 (62/36/2) Type: Bar Solder Melting Point: 354°F (179°C) Form: Bar, 1.66 lbs (750g) Process: Leaded Part Status: Active |
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70-0102-0310 | Kester Solder |
Description: SOLDER PASTE NO CLEAN 500GM Packaging: Bulk Composition: Sn62Pb36Ag2 (62/36/2) Type: Solder Paste Melting Point: 354°F (179°C) Form: Jar, 17.64 oz (500g) Mesh Type: 3 Process: Leaded Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
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70-0102-0311 | Kester Solder |
Description: SOLDER PASTE NO CLEAN 600GM Packaging: Bulk Composition: Sn62Pb36Ag2 (62/36/2) Type: Solder Paste Melting Point: 354°F (179°C) Form: Cartridge, 21.16 oz (600g) Mesh Type: 3 Process: Leaded Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
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70-0102-0410 | Kester Solder |
Description: SOLDER PASTE NO CLEAN 500GM Packaging: Bulk Composition: Sn62Pb36Ag2 (62/36/2) Type: Solder Paste Melting Point: 354°F (179°C) Form: Jar, 17.64 oz (500g) Mesh Type: 3 Process: Leaded Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
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70-0102-0411 | Kester Solder |
Description: SOLDER PASTE NO CLEAN 600GM Packaging: Bulk Composition: Sn62Pb36Ag2 (62/36/2) Type: Solder Paste Melting Point: 354°F (179°C) Form: Cartridge, 21.16 oz (600g) Mesh Type: 3 Process: Leaded Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
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70-0202-0310 | Kester Solder |
Description: SOLDER PASTE NO CLEAN 500GM Packaging: Bulk Composition: Sn62Pb36Ag2 (62/36/2) Type: Solder Paste Melting Point: 354°F (179°C) Form: Jar, 17.64 oz (500g) Mesh Type: 3 Process: Leaded Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
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70-0202-0311 | Kester Solder |
Description: SOLDER PASTE NO CLEAN 600GM Packaging: Bulk Composition: Sn62Pb36Ag2 (62/36/2) Type: Solder Paste Melting Point: 354°F (179°C) Form: Cartridge, 21.16 oz (600g) Mesh Type: 3 Process: Leaded Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
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70-1002-0310 | Kester Solder |
Description: SOLDER PASTE WATER SOLUBLE 500GM Packaging: Bulk Composition: Sn62Pb36Ag2 (62/36/2) Type: Solder Paste Melting Point: 354°F (179°C) Form: Jar, 17.64 oz (500g) Mesh Type: 3 Process: Leaded Flux Type: Water Soluble Part Status: Active Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
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70-1002-0311 | Kester Solder |
Description: SOLDER PASTE WATER SOLUBLE 600GM Packaging: Bulk Composition: Sn62Pb36Ag2 (62/36/2) Type: Solder Paste Melting Point: 354°F (179°C) Form: Cartridge, 21.16 oz (600g) Mesh Type: 3 Process: Leaded Flux Type: Water Soluble Part Status: Active Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
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70-2102-0310 | Kester Solder |
Description: SOLDER PASTE WATER SOLUBLE 500GM Packaging: Bulk Composition: Sn62Pb36Ag2 (62/36/2) Type: Solder Paste Melting Point: 354°F (179°C) Form: Jar, 17.64 oz (500g) Mesh Type: 3 Process: Leaded Flux Type: Water Soluble Part Status: Active Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
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| 70-2102-0311 | Kester Solder |
Description: SOLDER PASTE WATER SOLUBLE 600GM Packaging: Bulk Composition: Sn62Pb36Ag2 (62/36/2) Type: Solder Paste Melting Point: 354°F (179°C) Form: Cartridge, 21.16 oz (600g) Mesh Type: 3 Process: Leaded Flux Type: Water Soluble Part Status: Active Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
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| 7010020310 | Kester |
Solder HM531 Sn62Pb36Ag2 T3 90% 500g JAR |
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| 83-7145-0415 | Kester Solder |
Description: SOLDER SILVER 24AWG .35OZ TUBE Packaging: Tube Wire Gauge: 24 AWG, 25 SWG Composition: Sn62Pb36Ag2 (62/36/2) Type: Wire Solder Melting Point: 361°F (183°C) Form: Tube, 0.35 oz (10g) Process: Leaded Flux Type: Rosin Activated (RA) Part Status: Obsolete |
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92-7150-8800 | Kester |
Solder Sn62Pb36Ag2 1.1/245 WIRE .031 500g SPL |
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92-7150-8806 | Kester |
Solder Sn62Pb36Ag2 1.1/245 WIRE .015 500g SPL |
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92-7150-8807 | Kester |
Solder Sn62Pb36Ag2 1.1/245 WIRE .020 500g SPL |
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92-7150-8850 | Kester |
Solder Sn62Pb36Ag2 1.1/245 WIRE .050 500g SPL |
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92-7150-9702 | Kester |
Solder Sn62Pb36Ag2 3.3/285 WIRE .020 500g SPL |
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92-7150-9703 | Kester |
Solder Sn62Pb36Ag2 3.3/285 WIRE .015 500g SPL |
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CQ-SS-623602-0.65MM-25000 | Chip Quik |
Solder Solder Spheres Sn62/Pb36/Ag2 0.65mm diameter 25K Bottle |
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SMD3SW.020 .4OZ | Chip Quik Inc. |
Description: SOLDER WIRE POCKET PACK 62/36/2 Packaging: Bulk Diameter: 0.020" (0.51mm) Wire Gauge: 24 AWG, 25 SWG Composition: Sn62Pb36Ag2 (62/36/2) Type: Wire Solder Melting Point: 354°F (179°C) Form: Tube, 0.4 oz (11.34g) Process: Leaded Flux Type: No-Clean, Water Soluble Part Status: Active |
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| WBAR62/36/2 | SRA Soldering Products |
Description: SN62/PB36/AG2 1 LB. BAR Packaging: Bag Composition: Sn62Pb36Ag2 (62/36/2) Type: Bar Solder Form: Bar, 1 lb (453.59g) Process: Leaded Part Status: Active |
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| WBAR62362-1/2LB2 | SRA Soldering Products |
Description: SN62/PB36/AG2 1/2 LB. BAR Packaging: Bag Composition: Sn62Pb36Ag2 (62/36/2) Type: Bar Solder Form: Bar, 0.5 lb (266.79g) Process: Leaded Part Status: Active |
товар відсутній |
| Дрітовий припій зі сріблом Sn62Pb36Ag2 1мм 10г Флюс: F-SW26; 2,5% (LC63S1) Код товару: 182418 |
Паяльне обладнання, витратні матеріали для пайки > Припої, паяльні пасти
Категорія: Припій з флюсом
Опис: Припій для м'якої пайки з флюсом. Припій: Sn63Pb36Ag2; дріт; 1,0мм; 0,01кг; флюс: F-SW26; 2,5%, температура плавлення:183 ° С
Вага/Об’єм/К-сть: 10 g
Діаметр: 1 mm
Склад сплаву: Sn63Pb36Ag2
Температура плавлення: 183°C
Вид припоя: Свинцевий
Категорія: Припій з флюсом
Опис: Припій для м'якої пайки з флюсом. Припій: Sn63Pb36Ag2; дріт; 1,0мм; 0,01кг; флюс: F-SW26; 2,5%, температура плавлення:183 ° С
Вага/Об’єм/К-сть: 10 g
Діаметр: 1 mm
Склад сплаву: Sn63Pb36Ag2
Температура плавлення: 183°C
Вид припоя: Свинцевий
товар відсутній
| Припій W62AG2K1503A -SOLDERINDO Припой Sn62/Pb36/Ag2, с флюсом SD-82-1,5% (ROL1), 0,3 мм, 100 г Код товару: 115154 |
товар відсутній
| EXB-SN62PB36AG2 |
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Виробник: Chip Quik Inc.
Description: SOLDER BAR SN62/PB36/AG2 1LB (45
Packaging: Bulk
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Bar Solder
Melting Point: 354°F (179°C)
Form: Bar, 1 lb (454g)
Process: Leaded
Part Status: Active
Description: SOLDER BAR SN62/PB36/AG2 1LB (45
Packaging: Bulk
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Bar Solder
Melting Point: 354°F (179°C)
Form: Bar, 1 lb (454g)
Process: Leaded
Part Status: Active
товар відсутній
| SMD-SC-SN62PB36AG2-0.031-1oz |
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Виробник: Chip Quik Inc.
Description: SN62/PB36/AG2 .031" SOLDER WIRE
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Spool
Process: Leaded
Shelf Life: 60 Months
Description: SN62/PB36/AG2 .031" SOLDER WIRE
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Spool
Process: Leaded
Shelf Life: 60 Months
товар відсутній
| ESN62PB36AG/8 прострочено, вийшов термін придатності Код товару: 104195 |
Виробник: AG TermoPasty
Паяльне обладнання, витратні матеріали для пайки > Припої, паяльні пасти
Категорія: Припій з додаванням срібла
Опис: Припій; Sn62Pb36Ag2; паста; шприц; 8г; 2,5мл; флюс: No Clean; 15%
Вага/Об’єм/К-сть: 8 g
Склад сплаву: Sn62Pb36Ag2
Вид припоя: Свинцевий
Паяльне обладнання, витратні матеріали для пайки > Припої, паяльні пасти
Категорія: Припій з додаванням срібла
Опис: Припій; Sn62Pb36Ag2; паста; шприц; 8г; 2,5мл; флюс: No Clean; 15%
Вага/Об’єм/К-сть: 8 g
Склад сплаву: Sn62Pb36Ag2
Вид припоя: Свинцевий
товар відсутній
| 22-7150-8802 |
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Виробник: Kester Solder
Description: SOLDER FLUX-CORED/245 .031" 2LB
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 22 SWG
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Spool, 2 lbs (907.19g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C)
Description: SOLDER FLUX-CORED/245 .031" 2LB
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 22 SWG
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Spool, 2 lbs (907.19g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C)
товар відсутній
| 24-7150-0010 |
|
Виробник: Kester Solder
Description: SOLDER FLUX-CORED/44 .020" 1LB S
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: Rosin Activated (RA)
Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C)
Description: SOLDER FLUX-CORED/44 .020" 1LB S
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: Rosin Activated (RA)
Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C)
товар відсутній
| 24-7150-0018 |
|
Виробник: Kester Solder
Description: SOLDER RA FLUX 22AWG 62/36/2 1LB
Packaging: Spool
Diameter: 0.025" (0.64mm)
Wire Gauge: 22 AWG, 23 SWG
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: Rosin Activated (RA)
Part Status: Active
Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C)
Description: SOLDER RA FLUX 22AWG 62/36/2 1LB
Packaging: Spool
Diameter: 0.025" (0.64mm)
Wire Gauge: 22 AWG, 23 SWG
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: Rosin Activated (RA)
Part Status: Active
Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C)
товар відсутній
| 24-7150-0027 |
|
Виробник: Kester Solder
Description: SOLDER FLUX-CORED/44 .031" 1LB S
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 22 SWG
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: Rosin Activated (RA)
Part Status: Active
Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C)
Description: SOLDER FLUX-CORED/44 .031" 1LB S
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 22 SWG
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: Rosin Activated (RA)
Part Status: Active
Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C)
товар відсутній
| 24-7150-8801 |
|
Виробник: Kester Solder
Description: SOLDER FLUX-CORED/245 .031" 1LB
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 22 SWG
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C)
Description: SOLDER FLUX-CORED/245 .031" 1LB
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 22 SWG
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C)
товар відсутній
| 24-7150-8802 |
|
Виробник: Kester Solder
Description: SOLDER FLUX-CORED/245 .031" 1LB
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 22 SWG
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean
Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C)
Description: SOLDER FLUX-CORED/245 .031" 1LB
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 22 SWG
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean
Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C)
товар відсутній
| 24-7150-8806 |
|
Виробник: Kester Solder
Description: SOLDER FLUX-CORED/245 .015" 1LB
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Wire Gauge: 27 AWG, 28 SWG
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C)
Description: SOLDER FLUX-CORED/245 .015" 1LB
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Wire Gauge: 27 AWG, 28 SWG
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C)
товар відсутній
| 24-7150-8809 |
|
Виробник: Kester Solder
Description: SOLDER FLUX-CORED/245 .025" 1LB
Packaging: Bulk
Diameter: 0.025" (0.64mm)
Wire Gauge: 22 AWG, 23 SWG
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C)
Description: SOLDER FLUX-CORED/245 .025" 1LB
Packaging: Bulk
Diameter: 0.025" (0.64mm)
Wire Gauge: 22 AWG, 23 SWG
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C)
товар відсутній
| 24-7150-8814 |
|
Виробник: Kester Solder
Description: SOLDER FLUX-CORED/245 .050 1LB S
Packaging: Bulk
Diameter: 0.050" (1.27mm)
Wire Gauge: 16 AWG, 18 SWG
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C)
Description: SOLDER FLUX-CORED/245 .050 1LB S
Packaging: Bulk
Diameter: 0.050" (1.27mm)
Wire Gauge: 16 AWG, 18 SWG
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C)
товар відсутній
| 24-7150-8834 |
|
Виробник: Kester Solder
Description: SOLDER FLUX-CORED/245 .020 1LB S
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C)
Description: SOLDER FLUX-CORED/245 .020 1LB S
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C)
товар відсутній
| 29-7150-8808 |
|
Виробник: Kester Solder
Description: SOLDER FLUX-CORED/245 .020 3LB S
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Spool, 3 lbs (1.36kg)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C)
Description: SOLDER FLUX-CORED/245 .020 3LB S
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Spool, 3 lbs (1.36kg)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C)
товар відсутній
| 44-7150-0000 |
|
Виробник: Kester Solder
Description: SOLDER BAR E-BAR 1.66LB
Packaging: Bulk
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Bar Solder
Melting Point: 354°F (179°C)
Form: Bar, 1.66 lbs (750g)
Process: Leaded
Part Status: Active
Description: SOLDER BAR E-BAR 1.66LB
Packaging: Bulk
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Bar Solder
Melting Point: 354°F (179°C)
Form: Bar, 1.66 lbs (750g)
Process: Leaded
Part Status: Active
товар відсутній
| 70-0102-0310 |
|
Виробник: Kester Solder
Description: SOLDER PASTE NO CLEAN 500GM
Packaging: Bulk
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Solder Paste
Melting Point: 354°F (179°C)
Form: Jar, 17.64 oz (500g)
Mesh Type: 3
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SOLDER PASTE NO CLEAN 500GM
Packaging: Bulk
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Solder Paste
Melting Point: 354°F (179°C)
Form: Jar, 17.64 oz (500g)
Mesh Type: 3
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
товар відсутній
| 70-0102-0311 |
|
Виробник: Kester Solder
Description: SOLDER PASTE NO CLEAN 600GM
Packaging: Bulk
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Solder Paste
Melting Point: 354°F (179°C)
Form: Cartridge, 21.16 oz (600g)
Mesh Type: 3
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SOLDER PASTE NO CLEAN 600GM
Packaging: Bulk
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Solder Paste
Melting Point: 354°F (179°C)
Form: Cartridge, 21.16 oz (600g)
Mesh Type: 3
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
товар відсутній
| 70-0102-0410 |
|
Виробник: Kester Solder
Description: SOLDER PASTE NO CLEAN 500GM
Packaging: Bulk
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Solder Paste
Melting Point: 354°F (179°C)
Form: Jar, 17.64 oz (500g)
Mesh Type: 3
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SOLDER PASTE NO CLEAN 500GM
Packaging: Bulk
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Solder Paste
Melting Point: 354°F (179°C)
Form: Jar, 17.64 oz (500g)
Mesh Type: 3
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
товар відсутній
| 70-0102-0411 |
|
Виробник: Kester Solder
Description: SOLDER PASTE NO CLEAN 600GM
Packaging: Bulk
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Solder Paste
Melting Point: 354°F (179°C)
Form: Cartridge, 21.16 oz (600g)
Mesh Type: 3
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SOLDER PASTE NO CLEAN 600GM
Packaging: Bulk
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Solder Paste
Melting Point: 354°F (179°C)
Form: Cartridge, 21.16 oz (600g)
Mesh Type: 3
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
товар відсутній
| 70-0202-0310 |
|
Виробник: Kester Solder
Description: SOLDER PASTE NO CLEAN 500GM
Packaging: Bulk
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Solder Paste
Melting Point: 354°F (179°C)
Form: Jar, 17.64 oz (500g)
Mesh Type: 3
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SOLDER PASTE NO CLEAN 500GM
Packaging: Bulk
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Solder Paste
Melting Point: 354°F (179°C)
Form: Jar, 17.64 oz (500g)
Mesh Type: 3
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
товар відсутній
| 70-0202-0311 |
|
Виробник: Kester Solder
Description: SOLDER PASTE NO CLEAN 600GM
Packaging: Bulk
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Solder Paste
Melting Point: 354°F (179°C)
Form: Cartridge, 21.16 oz (600g)
Mesh Type: 3
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SOLDER PASTE NO CLEAN 600GM
Packaging: Bulk
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Solder Paste
Melting Point: 354°F (179°C)
Form: Cartridge, 21.16 oz (600g)
Mesh Type: 3
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
товар відсутній
| 70-1002-0310 |
|
Виробник: Kester Solder
Description: SOLDER PASTE WATER SOLUBLE 500GM
Packaging: Bulk
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Solder Paste
Melting Point: 354°F (179°C)
Form: Jar, 17.64 oz (500g)
Mesh Type: 3
Process: Leaded
Flux Type: Water Soluble
Part Status: Active
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SOLDER PASTE WATER SOLUBLE 500GM
Packaging: Bulk
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Solder Paste
Melting Point: 354°F (179°C)
Form: Jar, 17.64 oz (500g)
Mesh Type: 3
Process: Leaded
Flux Type: Water Soluble
Part Status: Active
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
товар відсутній
| 70-1002-0311 |
|
Виробник: Kester Solder
Description: SOLDER PASTE WATER SOLUBLE 600GM
Packaging: Bulk
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Solder Paste
Melting Point: 354°F (179°C)
Form: Cartridge, 21.16 oz (600g)
Mesh Type: 3
Process: Leaded
Flux Type: Water Soluble
Part Status: Active
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SOLDER PASTE WATER SOLUBLE 600GM
Packaging: Bulk
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Solder Paste
Melting Point: 354°F (179°C)
Form: Cartridge, 21.16 oz (600g)
Mesh Type: 3
Process: Leaded
Flux Type: Water Soluble
Part Status: Active
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
товар відсутній
| 70-2102-0310 |
|
Виробник: Kester Solder
Description: SOLDER PASTE WATER SOLUBLE 500GM
Packaging: Bulk
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Solder Paste
Melting Point: 354°F (179°C)
Form: Jar, 17.64 oz (500g)
Mesh Type: 3
Process: Leaded
Flux Type: Water Soluble
Part Status: Active
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SOLDER PASTE WATER SOLUBLE 500GM
Packaging: Bulk
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Solder Paste
Melting Point: 354°F (179°C)
Form: Jar, 17.64 oz (500g)
Mesh Type: 3
Process: Leaded
Flux Type: Water Soluble
Part Status: Active
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
товар відсутній
| 70-2102-0311 |
|
Виробник: Kester Solder
Description: SOLDER PASTE WATER SOLUBLE 600GM
Packaging: Bulk
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Solder Paste
Melting Point: 354°F (179°C)
Form: Cartridge, 21.16 oz (600g)
Mesh Type: 3
Process: Leaded
Flux Type: Water Soluble
Part Status: Active
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SOLDER PASTE WATER SOLUBLE 600GM
Packaging: Bulk
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Solder Paste
Melting Point: 354°F (179°C)
Form: Cartridge, 21.16 oz (600g)
Mesh Type: 3
Process: Leaded
Flux Type: Water Soluble
Part Status: Active
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
товар відсутній
| 83-7145-0415 |
|
Виробник: Kester Solder
Description: SOLDER SILVER 24AWG .35OZ TUBE
Packaging: Tube
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Tube, 0.35 oz (10g)
Process: Leaded
Flux Type: Rosin Activated (RA)
Part Status: Obsolete
Description: SOLDER SILVER 24AWG .35OZ TUBE
Packaging: Tube
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Tube, 0.35 oz (10g)
Process: Leaded
Flux Type: Rosin Activated (RA)
Part Status: Obsolete
товар відсутній
| CQ-SS-623602-0.65MM-25000 |
|
Виробник: Chip Quik
Solder Solder Spheres Sn62/Pb36/Ag2 0.65mm diameter 25K Bottle
Solder Solder Spheres Sn62/Pb36/Ag2 0.65mm diameter 25K Bottle
товар відсутній
| SMD3SW.020 .4OZ |
|
Виробник: Chip Quik Inc.
Description: SOLDER WIRE POCKET PACK 62/36/2
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Tube, 0.4 oz (11.34g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: SOLDER WIRE POCKET PACK 62/36/2
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Tube, 0.4 oz (11.34g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
товар відсутній
| WBAR62/36/2 |
|
Виробник: SRA Soldering Products
Description: SN62/PB36/AG2 1 LB. BAR
Packaging: Bag
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Bar Solder
Form: Bar, 1 lb (453.59g)
Process: Leaded
Part Status: Active
Description: SN62/PB36/AG2 1 LB. BAR
Packaging: Bag
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Bar Solder
Form: Bar, 1 lb (453.59g)
Process: Leaded
Part Status: Active
товар відсутній
| WBAR62362-1/2LB2 |
|
Виробник: SRA Soldering Products
Description: SN62/PB36/AG2 1/2 LB. BAR
Packaging: Bag
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Bar Solder
Form: Bar, 0.5 lb (266.79g)
Process: Leaded
Part Status: Active
Description: SN62/PB36/AG2 1/2 LB. BAR
Packaging: Bag
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Bar Solder
Form: Bar, 0.5 lb (266.79g)
Process: Leaded
Part Status: Active
товар відсутній
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