Результат пошуку "basys" : 131
Вид перегляду :
| Фото | Назва | Виробник | Інформація |
Доступність |
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MC33910G5ACR2 | NXP USA Inc. |
 Description: IC SYSTEM BASIS CHIP 32LQFPPackaging: Tape & Reel (TR) Package / Case: 32-LQFP Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 5.5V ~ 27V Applications: System Basis Chip Current - Supply: 4.5mA Supplier Device Package: 32-LQFP (7x7) |
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NCV7451MW0R2G | onsemi |
Description: IC SYST BASIS CHIP 14DFNW Packaging: Tape & Reel (TR) Package / Case: 14-VDFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Type: System Basis Chip (SBC) Supplier Device Package: 14-DFNW (4.5x3) Grade: Automotive DigiKey Programmable: Not Verified Qualification: AEC-Q100 |
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| TJA1128ATK/1Z | NXP USA Inc. |
Description: LIN MINI SYSTEM BASIS CHIP WITH Packaging: Tape & Reel (TR) Package / Case: 14-VDFN Exposed Pad Mounting Type: Surface Mount Interface: SPI Voltage - Supply: 3V ~ 28V Applications: System Basis Chip Supplier Device Package: 14-HVSON (3x4.5) Grade: Automotive Qualification: AEC-Q100 |
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| TJA1128GTK/1Z | NXP USA Inc. |
Description: LIN MINI SYSTEM BASIS CHIP WITH Packaging: Tape & Reel (TR) Package / Case: 14-VDFN Exposed Pad Mounting Type: Surface Mount Interface: SPI Voltage - Supply: 3V ~ 28V Applications: System Basis Chip Supplier Device Package: 14-HVSON (3x4.5) Grade: Automotive Qualification: AEC-Q100 |
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TLE9263BQXV33XUMA2 | Infineon Technologies |
Description: OPTIREG SYST BASIS CHIPS Packaging: Tape & Reel (TR) Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C (TJ) Voltage - Supply: 3V ~ 28V Applications: System Basis Chip Current - Supply: 3.5mA Supplier Device Package: PG-VQFN-48-79 |
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TLE9263BQXXUMA2 | Infineon Technologies |
Description: OPTIREG SYST BASIS CHIPS Packaging: Tape & Reel (TR) Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C (TJ) Voltage - Supply: 3V ~ 28V Applications: System Basis Chip Current - Supply: 3.5mA Supplier Device Package: PG-VQFN-48-79 |
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TLE9461ESV33XUMA1 | Infineon Technologies |
Description: IC SYST BASIS CHIP TSDSO24-1 Packaging: Tape & Reel (TR) Package / Case: 24-TSSOP (0.154", 3.90mm Width) Exposed Pad Mounting Type: Surface Mount Type: System Basis Chip (SBC) Applications: CAN Supplier Device Package: PG-TSDSO-24-1 DigiKey Programmable: Not Verified Grade: Automotive Qualification: AEC-Q100 |
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TLE9471ESXUMA1 | Infineon Technologies |
Description: IC SYST BASIS CHIP TSDSO24-1 Packaging: Tape & Reel (TR) Package / Case: 24-TSSOP (0.154", 3.90mm Width) Exposed Pad Mounting Type: Surface Mount Type: System Basis Chip (SBC) Applications: CAN Supplier Device Package: PG-TSDSO-24-1 DigiKey Programmable: Not Verified Grade: Automotive Qualification: AEC-Q100 |
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UJA1169ATK/3Z | NXP USA Inc. |
Description: IC MINI-CAN SYSTEM BASIS CHIP Packaging: Tape & Reel (TR) Package / Case: 20-VFDFN Exposed Pad Mounting Type: Surface Mount Interface: CAN, SPI Voltage - Supply: 3V ~ 28V Applications: System Basis Chip Supplier Device Package: 20-HVSON (3.5x5.5) |
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UJA1169ATK/FZ | NXP USA Inc. |
Description: IC MINI-CAN SYSTEM BASIS CHIP Packaging: Tape & Reel (TR) Package / Case: 20-VFDFN Exposed Pad Mounting Type: Surface Mount Interface: CAN, SPI Voltage - Supply: 3V ~ 28V Applications: System Basis Chip Supplier Device Package: 20-HVSON (3.5x5.5) Part Status: Active |
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UJA1169ATKZ | NXP USA Inc. |
Description: IC MINI-CAN SYSTEM BASIS CHIP Packaging: Tape & Reel (TR) Package / Case: 20-VFDFN Exposed Pad Mounting Type: Surface Mount Interface: CAN, SPI Voltage - Supply: 3V ~ 28V Applications: System Basis Chip Supplier Device Package: 20-HVSON (3.5x5.5) |
товар відсутній |
| MC33910G5ACR2 |
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Виробник: NXP USA Inc.
Description: IC SYSTEM BASIS CHIP 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 5.5V ~ 27V
Applications: System Basis Chip
Current - Supply: 4.5mA
Supplier Device Package: 32-LQFP (7x7)
Description: IC SYSTEM BASIS CHIP 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 5.5V ~ 27V
Applications: System Basis Chip
Current - Supply: 4.5mA
Supplier Device Package: 32-LQFP (7x7)
товар відсутній
| NCV7451MW0R2G |
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Виробник: onsemi
Description: IC SYST BASIS CHIP 14DFNW
Packaging: Tape & Reel (TR)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Type: System Basis Chip (SBC)
Supplier Device Package: 14-DFNW (4.5x3)
Grade: Automotive
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Description: IC SYST BASIS CHIP 14DFNW
Packaging: Tape & Reel (TR)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Type: System Basis Chip (SBC)
Supplier Device Package: 14-DFNW (4.5x3)
Grade: Automotive
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
товар відсутній
| TJA1128ATK/1Z |
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Виробник: NXP USA Inc.
Description: LIN MINI SYSTEM BASIS CHIP WITH
Packaging: Tape & Reel (TR)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Interface: SPI
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 14-HVSON (3x4.5)
Grade: Automotive
Qualification: AEC-Q100
Description: LIN MINI SYSTEM BASIS CHIP WITH
Packaging: Tape & Reel (TR)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Interface: SPI
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 14-HVSON (3x4.5)
Grade: Automotive
Qualification: AEC-Q100
товар відсутній
| TJA1128GTK/1Z |
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Виробник: NXP USA Inc.
Description: LIN MINI SYSTEM BASIS CHIP WITH
Packaging: Tape & Reel (TR)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Interface: SPI
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 14-HVSON (3x4.5)
Grade: Automotive
Qualification: AEC-Q100
Description: LIN MINI SYSTEM BASIS CHIP WITH
Packaging: Tape & Reel (TR)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Interface: SPI
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 14-HVSON (3x4.5)
Grade: Automotive
Qualification: AEC-Q100
товар відсутній
| TLE9263BQXV33XUMA2 |
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Виробник: Infineon Technologies
Description: OPTIREG SYST BASIS CHIPS
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Current - Supply: 3.5mA
Supplier Device Package: PG-VQFN-48-79
Description: OPTIREG SYST BASIS CHIPS
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Current - Supply: 3.5mA
Supplier Device Package: PG-VQFN-48-79
товар відсутній
| TLE9263BQXXUMA2 |
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Виробник: Infineon Technologies
Description: OPTIREG SYST BASIS CHIPS
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Current - Supply: 3.5mA
Supplier Device Package: PG-VQFN-48-79
Description: OPTIREG SYST BASIS CHIPS
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Current - Supply: 3.5mA
Supplier Device Package: PG-VQFN-48-79
товар відсутній
| TLE9461ESV33XUMA1 |
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Виробник: Infineon Technologies
Description: IC SYST BASIS CHIP TSDSO24-1
Packaging: Tape & Reel (TR)
Package / Case: 24-TSSOP (0.154", 3.90mm Width) Exposed Pad
Mounting Type: Surface Mount
Type: System Basis Chip (SBC)
Applications: CAN
Supplier Device Package: PG-TSDSO-24-1
DigiKey Programmable: Not Verified
Grade: Automotive
Qualification: AEC-Q100
Description: IC SYST BASIS CHIP TSDSO24-1
Packaging: Tape & Reel (TR)
Package / Case: 24-TSSOP (0.154", 3.90mm Width) Exposed Pad
Mounting Type: Surface Mount
Type: System Basis Chip (SBC)
Applications: CAN
Supplier Device Package: PG-TSDSO-24-1
DigiKey Programmable: Not Verified
Grade: Automotive
Qualification: AEC-Q100
товар відсутній
| TLE9471ESXUMA1 |
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Виробник: Infineon Technologies
Description: IC SYST BASIS CHIP TSDSO24-1
Packaging: Tape & Reel (TR)
Package / Case: 24-TSSOP (0.154", 3.90mm Width) Exposed Pad
Mounting Type: Surface Mount
Type: System Basis Chip (SBC)
Applications: CAN
Supplier Device Package: PG-TSDSO-24-1
DigiKey Programmable: Not Verified
Grade: Automotive
Qualification: AEC-Q100
Description: IC SYST BASIS CHIP TSDSO24-1
Packaging: Tape & Reel (TR)
Package / Case: 24-TSSOP (0.154", 3.90mm Width) Exposed Pad
Mounting Type: Surface Mount
Type: System Basis Chip (SBC)
Applications: CAN
Supplier Device Package: PG-TSDSO-24-1
DigiKey Programmable: Not Verified
Grade: Automotive
Qualification: AEC-Q100
товар відсутній
| UJA1169ATK/3Z |
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Виробник: NXP USA Inc.
Description: IC MINI-CAN SYSTEM BASIS CHIP
Packaging: Tape & Reel (TR)
Package / Case: 20-VFDFN Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, SPI
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 20-HVSON (3.5x5.5)
Description: IC MINI-CAN SYSTEM BASIS CHIP
Packaging: Tape & Reel (TR)
Package / Case: 20-VFDFN Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, SPI
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 20-HVSON (3.5x5.5)
товар відсутній
| UJA1169ATK/FZ |
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Виробник: NXP USA Inc.
Description: IC MINI-CAN SYSTEM BASIS CHIP
Packaging: Tape & Reel (TR)
Package / Case: 20-VFDFN Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, SPI
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 20-HVSON (3.5x5.5)
Part Status: Active
Description: IC MINI-CAN SYSTEM BASIS CHIP
Packaging: Tape & Reel (TR)
Package / Case: 20-VFDFN Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, SPI
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 20-HVSON (3.5x5.5)
Part Status: Active
товар відсутній
| UJA1169ATKZ |
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Виробник: NXP USA Inc.
Description: IC MINI-CAN SYSTEM BASIS CHIP
Packaging: Tape & Reel (TR)
Package / Case: 20-VFDFN Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, SPI
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 20-HVSON (3.5x5.5)
Description: IC MINI-CAN SYSTEM BASIS CHIP
Packaging: Tape & Reel (TR)
Package / Case: 20-VFDFN Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, SPI
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 20-HVSON (3.5x5.5)
товар відсутній