0430450419 Molex
на замовлення 7250 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1800+ | 104.11 грн |
| 5400+ | 88.01 грн |
Відгуки про товар
Написати відгук
Технічний опис 0430450419 Molex
Description: CONN HEADER SMD 4POS 3MM, Features: Solder Retention, Packaging: Tape & Reel (TR), Connector Type: Header, Voltage Rating: 600V, Current Rating (Amps): 8A, Mounting Type: Surface Mount, Number of Positions: 4, Number of Rows: 2, Style: Board to Cable/Wire, Operating Temperature: -40°C ~ 105°C, Contact Type: Male Pin, Fastening Type: Locking Ramp, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Contact Material: Brass, Insulation Color: Black, Pitch - Mating: 0.118" (3.00mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 15.0µin (0.38µm), Contact Finish - Post: Tin, Part Status: Active, Contact Shape: Square, Insulation Height: 0.390" (9.91mm), Shrouding: Shrouded - 4 Wall, Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled, Row Spacing - Mating: 0.118" (3.00mm).
Інші пропозиції 0430450419 за ціною від 106.74 грн до 226.91 грн
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна без ПДВ | ||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
0430450419 | Виробник : Molex |
 Description: CONN HEADER SMD 4POS 3MMFeatures: Solder Retention Packaging: Tape & Reel (TR) Connector Type: Header Voltage Rating: 600V Current Rating (Amps): 8A Mounting Type: Surface Mount Number of Positions: 4 Number of Rows: 2 Style: Board to Cable/Wire Operating Temperature: -40°C ~ 105°C Contact Type: Male Pin Fastening Type: Locking Ramp Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Brass Insulation Color: Black Pitch - Mating: 0.118" (3.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 15.0µin (0.38µm) Contact Finish - Post: Tin Part Status: Active Contact Shape: Square Insulation Height: 0.390" (9.91mm) Shrouding: Shrouded - 4 Wall Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled Row Spacing - Mating: 0.118" (3.00mm) |
на замовлення 5200 шт: термін постачання 21-31 дні (днів) |
|
||||||||||
|
|
0430450419 | Виробник : Molex |
Description: CONN HEADER SMD 4POS 3MM Features: Solder Retention Packaging: Cut Tape (CT) Connector Type: Header Voltage Rating: 600V Current Rating (Amps): 8A Mounting Type: Surface Mount Number of Positions: 4 Number of Rows: 2 Style: Board to Cable/Wire Operating Temperature: -40°C ~ 105°C Contact Type: Male Pin Fastening Type: Locking Ramp Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Brass Insulation Color: Black Pitch - Mating: 0.118" (3.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 15.0µin (0.38µm) Contact Finish - Post: Tin Part Status: Active Contact Shape: Square Insulation Height: 0.390" (9.91mm) Shrouding: Shrouded - 4 Wall Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled Row Spacing - Mating: 0.118" (3.00mm) |
на замовлення 5348 шт: термін постачання 21-31 дні (днів) |
|
||||||||||
| 0430450419 | Виробник : Molex |
Conn Wire to Board HDR 4 POS 3mm Solder ST Top Entry SMD Micro-Fit 3.0™ T/R |
товар відсутній |