1-1825376-2 TE Connectivity
на замовлення 1230 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 67+ | 174.74 грн |
| 150+ | 171.62 грн |
| 300+ | 168.5 грн |
| 600+ | 159.47 грн |
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Технічний опис 1-1825376-2 TE Connectivity
Description: CONN IC DIP SOCKET 28POS GOLD, Features: Closed Frame, Packaging: Tray, Mounting Type: Through Hole, Type: DIP, 0.6" (15.24mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 28 (2 x 14), Termination: Solder, Housing Material: Thermoplastic, Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 30.0µin (0.76µm), Contact Material - Post: Beryllium Copper, Part Status: Active.
Інші пропозиції 1-1825376-2
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна без ПДВ |
|---|---|---|---|---|---|
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1-1825376-2 | Виробник : TE Connectivity AMP Connectors |
 Description: CONN IC DIP SOCKET 28POS GOLDFeatures: Closed Frame Packaging: Tray Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 28 (2 x 14) Termination: Solder Housing Material: Thermoplastic, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30.0µin (0.76µm) Contact Material - Post: Beryllium Copper Part Status: Active |
товар відсутній |
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1-1825376-2 | Виробник : TE Connectivity |
IC & Component Sockets 28P LB SKT; RET .600 CL; 30AU/SN BECU |
товар відсутній |