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299-93-620-10-002000

299-93-620-10-002000 Mill-Max Mfg. Corp.


299-93-620-10-002000.pdf Виробник: Mill-Max Mfg. Corp.
Conn DIP Socket SKT 20 POS 2.54mm Solder RA Thru-Hole Tube
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Технічний опис 299-93-620-10-002000 Mill-Max Mfg. Corp.

Description: CONN IC DIP SOCKET 20POS GOLD, Packaging: Tube, Features: Closed Frame, Mounting Type: Through Hole, Right Angle, Horizontal, Type: DIP, 0.6" (15.24mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 20 (2 x 10), Termination: Solder, Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin-Lead, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Material - Post: Brass Alloy.

Інші пропозиції 299-93-620-10-002000

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299-93-620-10-002000 299-93-620-10-002000 Виробник : Mill-Max Manufacturing Corp. 2017-11%3A129.pdf Description: CONN IC DIP SOCKET 20POS GOLD
Packaging: Tube
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
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299-93-620-10-002000 Виробник : Mill-Max MMMC_S_A0000089343_1-2552977.pdf IC & Component Sockets 20 POS .6" R/ANGLE
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