5-1658462-2 TE Connectivity AMP Connectors
Виробник: TE Connectivity AMP ConnectorsDescription: CONN DIFF ARRAY RCP 56P SMD GOLD
Features: Board Guide, Ground Bus (Plane)
Packaging: Box
Connector Type: Differential Pair Array, Female
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 56
Pitch: 0.031" (0.80mm)
Height Above Board: 0.128" (3.25mm)
Contact Finish Thickness: 30.0µin (0.76µm)
Mated Stacking Heights: 5mm, 8mm, 11mm, 14mm, 16mm, 19mm, 22mm, 25mm, 30mm
Part Status: Active
Number of Rows: 2
на замовлення 475 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 475+ | 730.92 грн |
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Технічний опис 5-1658462-2 TE Connectivity AMP Connectors
Description: CONN DIFF ARRAY RCP 56P SMD GOLD, Packaging: Tape & Reel (TR), Features: Board Guide, Ground Bus (Plane), Connector Type: Differential Pair Array, Female, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 56, Pitch: 0.031" (0.80mm), Height Above Board: 0.128" (3.25mm), Contact Finish Thickness: 30.0µin (0.76µm), Mated Stacking Heights: 5mm, 8mm, 11mm, 14mm, 16mm, 19mm, 22mm, 25mm, 30mm, Part Status: Active, Number of Rows: 2.
Інші пропозиції 5-1658462-2
| Фото | Назва | Виробник | Інформація |
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Ціна без ПДВ |
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5-1658462-2 | Виробник : TE Connectivity AMP Connectors |
Description: CONN DIFF ARRAY RCP 56P SMD GOLD Packaging: Cut Tape (CT) Features: Board Guide, Ground Bus (Plane) Connector Type: Differential Pair Array, Female Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 56 Pitch: 0.031" (0.80mm) Height Above Board: 0.128" (3.25mm) Contact Finish Thickness: 30.0µin (0.76µm) Mated Stacking Heights: 5mm, 8mm, 11mm, 14mm, 16mm, 19mm, 22mm, 25mm, 30mm Part Status: Active Number of Rows: 2 |
товар відсутній |
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5-1658462-2 | Виробник : TE Connectivity AMP Connectors |
Description: CONN DIFF ARRAY RCP 56P SMD GOLD Packaging: Tape & Reel (TR) Features: Board Guide, Ground Bus (Plane) Connector Type: Differential Pair Array, Female Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 56 Pitch: 0.031" (0.80mm) Height Above Board: 0.128" (3.25mm) Contact Finish Thickness: 30.0µin (0.76µm) Mated Stacking Heights: 5mm, 8mm, 11mm, 14mm, 16mm, 19mm, 22mm, 25mm, 30mm Part Status: Active Number of Rows: 2 |
товар відсутній |
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5-1658462-2 | Виробник : TE Connectivity |
Board to Board & Mezzanine Connectors MSB0.80RC-ASY56DP GP,30,VCTR |
товар відсутній |