5031481890 Molex
Виробник: Molex
Description: CONN RCPT 18P 0.059 TIN SMD R/A
Packaging: Tape & Reel (TR)
Features: Pick and Place, Solder Retention
Connector Type: Receptacle
Mounting Type: Surface Mount, Right Angle
Number of Positions: 18
Style: Board to Cable/Wire
Operating Temperature: -40°C ~ 105°C
Contact Type: Forked
Fastening Type: Latch Holder
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Beige
Pitch - Mating: 0.059" (1.50mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 39.4µin (1.00µm)
Contact Finish - Post: Tin
Insulation Height: 0.360" (9.14mm)
Number of Rows: 2
Description: CONN RCPT 18P 0.059 TIN SMD R/A
Packaging: Tape & Reel (TR)
Features: Pick and Place, Solder Retention
Connector Type: Receptacle
Mounting Type: Surface Mount, Right Angle
Number of Positions: 18
Style: Board to Cable/Wire
Operating Temperature: -40°C ~ 105°C
Contact Type: Forked
Fastening Type: Latch Holder
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Beige
Pitch - Mating: 0.059" (1.50mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 39.4µin (1.00µm)
Contact Finish - Post: Tin
Insulation Height: 0.360" (9.14mm)
Number of Rows: 2
на замовлення 7700 шт:
термін постачання 21-31 дні (днів)
Кількість | Ціна без ПДВ |
---|---|
550+ | 100.68 грн |
1100+ | 76.54 грн |
1650+ | 73.99 грн |
2750+ | 67.04 грн |
5500+ | 63.69 грн |
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Технічний опис 5031481890 Molex
Description: CONN RCPT 18P 0.059 TIN SMD R/A, Packaging: Tape & Reel (TR), Features: Pick and Place, Solder Retention, Connector Type: Receptacle, Mounting Type: Surface Mount, Right Angle, Number of Positions: 18, Style: Board to Cable/Wire, Operating Temperature: -40°C ~ 105°C, Contact Type: Forked, Fastening Type: Latch Holder, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Insulation Color: Beige, Pitch - Mating: 0.059" (1.50mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 39.4µin (1.00µm), Contact Finish - Post: Tin, Insulation Height: 0.360" (9.14mm), Number of Rows: 2.
Інші пропозиції 5031481890 за ціною від 121.02 грн до 201.22 грн
Фото | Назва | Виробник | Інформація |
Доступність |
Ціна без ПДВ | ||||||||||||
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503148-1890 | Виробник : MOLEX |
Description: MOLEX - 503148-1890 - Printbuchse, Signal, Wire-to-Board, 1.5 mm, 2 Reihe(n), 18 Kontakt(e) tariffCode: 85366930 rohsCompliant: YES Kontaktüberzug: Verzinnte Kontakte hazardous: false rohsPhthalatesCompliant: YES Kontaktmaterial: Kupferlegierung Steckverbindermontage: Oberflächenmontage, abgewinkelt usEccn: EAR99 Anzahl der Kontakte: 18Kontakt(e) euEccn: NLR Steckverbindersysteme: Signal, Wire-to-Board Produktpalette: CLIK-Mate 503148 Series productTraceability: No Anzahl der Reihen: 2Reihe(n) Rastermaß: 1.5mm SVHC: No SVHC (17-Jan-2023) |
на замовлення 1650 шт: термін постачання 21-31 дні (днів) |
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503148-1890 | Виробник : MOLEX |
Description: MOLEX - 503148-1890 - Printbuchse, Signal, Wire-to-Board, 1.5 mm, 2 Reihe(n), 18 Kontakt(e) tariffCode: 85366930 rohsCompliant: YES Kontaktüberzug: Verzinnte Kontakte hazardous: false rohsPhthalatesCompliant: YES Kontaktmaterial: Kupferlegierung Steckverbindermontage: Oberflachenmontage, abgewinkelt usEccn: EAR99 Anzahl der Kontakte: 18Kontakt(e) euEccn: NLR Steckverbindersysteme: Signal, Wire-to-Board Produktpalette: CLIK-Mate 503148 Series productTraceability: No Anzahl der Reihen: 2Reihe(n) Rastermaß: 1.5mm SVHC: No SVHC (17-Jan-2023) |
на замовлення 1050 шт: термін постачання 21-31 дні (днів) |
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5031481890 | Виробник : Molex |
Description: CONN RCPT 18P 0.059 TIN SMD R/A Packaging: Cut Tape (CT) Features: Pick and Place, Solder Retention Connector Type: Receptacle Mounting Type: Surface Mount, Right Angle Number of Positions: 18 Style: Board to Cable/Wire Operating Temperature: -40°C ~ 105°C Contact Type: Forked Fastening Type: Latch Holder Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Beige Pitch - Mating: 0.059" (1.50mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 39.4µin (1.00µm) Contact Finish - Post: Tin Insulation Height: 0.360" (9.14mm) Number of Rows: 2 |
на замовлення 8096 шт: термін постачання 21-31 дні (днів) |
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503148-1890 | Виробник : Molex | Headers & Wire Housings 1.5WB DUAL R/A EMBS TAPE PKG 18P |
на замовлення 2956 шт: термін постачання 21-30 дні (днів) |
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5031481890 | Виробник : Molex | Conn Wire to Board RCP 18 POS 1.5mm Solder RA Side Entry SMD T/R |
товар відсутній |