5055670331 Molex
Виробник: MolexDescription: 1.25WB SGL RA ASSY 3CKT EMBPKG B
Features: Pick and Place, Solder Retention
Packaging: Tape & Reel (TR)
Connector Type: Header
Voltage Rating: 50VAC/DC
Current Rating (Amps): Varies by Wire Gauge
Mounting Type: Surface Mount, Right Angle
Number of Positions: 3
Number of Rows: 1
Style: Board to Cable/Wire
Operating Temperature: -40°C ~ 105°C
Contact Type: Male Pin
Fastening Type: Locking Ramp
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Brass
Insulation Color: Black
Pitch - Mating: 0.049" (1.25mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 15.0µin (0.38µm)
Contact Finish - Post: Gold
Part Status: Active
Contact Shape: Square
Insulation Height: 0.154" (3.90mm)
Shrouding: Shrouded - 4 Wall
Insulation Material: Polyamide (PA), Nylon, Glass Filled
на замовлення 14400 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1200+ | 57.15 грн |
| 2400+ | 49.87 грн |
| 6000+ | 48.15 грн |
| 8400+ | 42.93 грн |
| 12000+ | 41.96 грн |
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Технічний опис 5055670331 Molex
Description: 1.25WB SGL RA ASSY 3CKT EMBPKG B, Features: Pick and Place, Solder Retention, Packaging: Tape & Reel (TR), Connector Type: Header, Voltage Rating: 50VAC/DC, Current Rating (Amps): Varies by Wire Gauge, Mounting Type: Surface Mount, Right Angle, Number of Positions: 3, Number of Rows: 1, Style: Board to Cable/Wire, Operating Temperature: -40°C ~ 105°C, Contact Type: Male Pin, Fastening Type: Locking Ramp, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Contact Material: Brass, Insulation Color: Black, Pitch - Mating: 0.049" (1.25mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 15.0µin (0.38µm), Contact Finish - Post: Gold, Part Status: Active, Contact Shape: Square, Insulation Height: 0.154" (3.90mm), Shrouding: Shrouded - 4 Wall, Insulation Material: Polyamide (PA), Nylon, Glass Filled.
Інші пропозиції 5055670331 за ціною від 42.45 грн до 101.52 грн
| Фото | Назва | Виробник | Інформація |
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5055670331 | Виробник : Molex |
Description: 1.25WB SGL RA ASSY 3CKT EMBPKG B Features: Pick and Place, Solder Retention Packaging: Cut Tape (CT) Connector Type: Header Voltage Rating: 50VAC/DC Current Rating (Amps): Varies by Wire Gauge Mounting Type: Surface Mount, Right Angle Number of Positions: 3 Number of Rows: 1 Style: Board to Cable/Wire Operating Temperature: -40°C ~ 105°C Contact Type: Male Pin Fastening Type: Locking Ramp Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Brass Insulation Color: Black Pitch - Mating: 0.049" (1.25mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 15.0µin (0.38µm) Contact Finish - Post: Gold Part Status: Active Contact Shape: Square Insulation Height: 0.154" (3.90mm) Shrouding: Shrouded - 4 Wall Insulation Material: Polyamide (PA), Nylon, Glass Filled |
на замовлення 16122 шт: термін постачання 21-31 дні (днів) |
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505567-0331 | Виробник : Molex | Headers & Wire Housings 1.25WB SGL R 3CKT BK G038 |
на замовлення 3068 шт: термін постачання 21-30 дні (днів) |
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| 5055670331 | Виробник : Molex |
1.25mm Pitch, Micro Lock Plus PCB Header, Right Angle, Surface Mount, 0.38um Gold Plating, 3 Circuits, Tape And Reel, Black |
товар відсутній |