5055680871 Molex
Виробник: MolexDescription: CONN HEADER SMD 8POS 1.25MM
Features: Solder Retention
Packaging: Tape & Reel (TR)
Connector Type: Header
Voltage Rating: 50VAC/DC
Current Rating (Amps): Varies by Wire Gauge
Mounting Type: Surface Mount
Number of Positions: 8
Number of Rows: 1
Style: Board to Cable/Wire
Operating Temperature: -40°C ~ 105°C
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Brass
Insulation Color: Black
Pitch - Mating: 0.049" (1.25mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 39.4µin (1.00µm)
Contact Finish - Post: Tin
Part Status: Active
Contact Shape: Square
Insulation Height: 0.165" (4.20mm)
Shrouding: Shrouded - 4 Wall
Insulation Material: Polyamide (PA), Nylon, Glass Filled
на замовлення 49200 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1200+ | 47.99 грн |
| 2400+ | 41.88 грн |
| 6000+ | 40.43 грн |
| 8400+ | 36.05 грн |
| 12000+ | 35.23 грн |
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Технічний опис 5055680871 Molex
Description: CONN HEADER SMD 8POS 1.25MM, Features: Solder Retention, Packaging: Tape & Reel (TR), Connector Type: Header, Voltage Rating: 50VAC/DC, Current Rating (Amps): Varies by Wire Gauge, Mounting Type: Surface Mount, Number of Positions: 8, Number of Rows: 1, Style: Board to Cable/Wire, Operating Temperature: -40°C ~ 105°C, Contact Type: Male Pin, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Contact Material: Brass, Insulation Color: Black, Pitch - Mating: 0.049" (1.25mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 39.4µin (1.00µm), Contact Finish - Post: Tin, Part Status: Active, Contact Shape: Square, Insulation Height: 0.165" (4.20mm), Shrouding: Shrouded - 4 Wall, Insulation Material: Polyamide (PA), Nylon, Glass Filled.
Інші пропозиції 5055680871 за ціною від 38.52 грн до 87.62 грн
| Фото | Назва | Виробник | Інформація |
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5055680871 | Виробник : Molex |
Description: CONN HEADER SMD 8POS 1.25MM Features: Solder Retention Packaging: Cut Tape (CT) Connector Type: Header Voltage Rating: 50VAC/DC Current Rating (Amps): Varies by Wire Gauge Mounting Type: Surface Mount Number of Positions: 8 Number of Rows: 1 Style: Board to Cable/Wire Operating Temperature: -40°C ~ 105°C Contact Type: Male Pin Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Brass Insulation Color: Black Pitch - Mating: 0.049" (1.25mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 39.4µin (1.00µm) Contact Finish - Post: Tin Part Status: Active Contact Shape: Square Insulation Height: 0.165" (4.20mm) Shrouding: Shrouded - 4 Wall Insulation Material: Polyamide (PA), Nylon, Glass Filled |
на замовлення 49656 шт: термін постачання 21-31 дні (днів) |
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505568-0871 | Виробник : Molex | Headers & Wire Housings MicroLockPlus 1.25MM VERT HDR SR 8CKT BL |
на замовлення 11631 шт: термін постачання 21-30 дні (днів) |
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505568-0871 | Виробник : MOLEX |
Description: MOLEX - 505568-0871 - Stiftleiste, Signal, Wire-to-Board, 1.25 mm, 1 Reihe(n), 8 Kontakt(e), Oberflächenmontage, gerade tariffCode: 85366930 rohsCompliant: YES Kontaktüberzug: Kontakte beschichtet mit Zinn-Wismut hazardous: false rohsPhthalatesCompliant: YES Kontaktmaterial: Messing usEccn: EAR99 Steckverbinderkragen: Mit Kragen Anzahl der Kontakte: 8 euEccn: NLR Steckverbindersysteme: Signal, Wire-to-Board Produktpalette: Micro-Lock Plus 505568 Series productTraceability: No Kontaktanschluss: Oberflachenmontage, gerade Anzahl der Reihen: 1 Rastermaß: 1.25 SVHC: No SVHC (17-Jan-2023) |
на замовлення 6301 шт: термін постачання 21-31 дні (днів) |
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