530733-1 TE CONNECTIVITY / PARTNER STOCK
Виробник: TE CONNECTIVITY / PARTNER STOCKDescription: TE CONNECTIVITY / PARTNER STOCK - 530733-1 - Stiftleiste, Board-to-Board, 1.27 mm, 2 Reihe(n), 40 Kontakt(e), Durchsteckmontage, abgewinkelt
tariffCode: 85366990
rohsCompliant: NO
Kontaktüberzug: Vergoldete Kontakte
hazardous: false
rohsPhthalatesCompliant: NO
Kontaktmaterial: Messing
usEccn: EAR99
Steckverbinderkragen: -
Anzahl der Kontakte: 40Kontakt(e)
euEccn: NLR
Steckverbindersysteme: Board-to-Board
Produktpalette: -
productTraceability: No
Kontaktanschluss: Durchsteckmontage, abgewinkelt
Anzahl der Reihen: 2Reihe(n)
Rastermaß: 1.27mm
SVHC: No SVHC (27-Jun-2018)
на замовлення 69 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 19755.55 грн |
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Технічний опис 530733-1 TE CONNECTIVITY / PARTNER STOCK
Description: CONN HEADER R/A 40POS 1.27MM, Features: Mating Guide, Mounting Flange, Packaging: Bulk, Connector Type: Header, Mounting Type: Through Hole, Right Angle, Number of Positions: 40, Number of Rows: 2, Style: Board to Board or Cable, Contact Type: Male Pin, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Contact Material: Brass, Insulation Color: Gray, Pitch - Mating: 0.050" (1.27mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Finish - Post: Tin, Contact Shape: Square, Insulation Height: 0.310" (7.87mm), Shrouding: Shrouded - 1 Wall, Insulation Material: Liquid Crystal Polymer (LCP), Row Spacing - Mating: 0.150" (3.81mm).
Інші пропозиції 530733-1
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна без ПДВ |
|---|---|---|---|---|---|
| 530733-1 | Виробник : TE Connectivity Aerospace, Defense and Marine |
Description: CONN HEADER R/A 40POS 1.27MM Features: Mating Guide, Mounting Flange Packaging: Bulk Connector Type: Header Mounting Type: Through Hole, Right Angle Number of Positions: 40 Number of Rows: 2 Style: Board to Board or Cable Contact Type: Male Pin Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Contact Material: Brass Insulation Color: Gray Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Post: Tin Contact Shape: Square Insulation Height: 0.310" (7.87mm) Shrouding: Shrouded - 1 Wall Insulation Material: Liquid Crystal Polymer (LCP) Row Spacing - Mating: 0.150" (3.81mm) |
товар відсутній |
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530733-1 | Виробник : TE Connectivity / AMP |
Headers & Wire Housings MINI-BX PIN HDR ASY 40 PS RA |
товар відсутній |